Briefs: Test & Measurement
Engineers have remotely determined the temperature beneath the surface of certain materials using a new technique called depth thermography. The method may be useful in applications where...
Articles: Electronics & Computers
Briefs: Imaging
Technology Leaders: Manufacturing & Prototyping
One of the first things an electrical engineer will learn is that the number-one enemy of designing and manufacturing any electrical/electronic product is heat. It's the one...
Briefs: Materials
A stainless steel alloy — alloy 709 — has potential for elevated-temperature applications such as nuclear reactor structures. It is exceptionally strong and resistant to damage when exposed to...
Briefs: Test & Measurement
A new probe developed at the University of Adelaide, may help researchers find better treatments to prevent drug-induced overheating of the brain, and potentially refine thermal treatment for...
Briefs: Electronics & Computers
Technique Measures Temperature of 2D Materials at the Atomic Level
Newly developed two-dimensional (2D) materials such as graphene — which consists of a single layer of carbon atoms — have the potential to replace traditional microprocessing chips based on silicon, which have reached the limit of how small they can get. But engineers have...
Who's Who: Materials
Thermal Protection Systems (TPS) — heatshields — form the outer surface of spacecraft and provide protection as the vehicle plunges through planetary...
Articles: Test & Measurement
Testing in rugged applications often includes testing in extreme temperature ranges, which can add constraints to hardware. Cold-start engine testing, for example, uses a test...
Briefs: Physical Sciences
This innovation provides the following thermal properties data from a single steady-state test run: the effective thermal conductivity value (ke) for the full temperature difference, and...
Articles: Lighting Technology
LED, semiconductor, and package designers use complex thermal analysis software to analyze their products, but the analysis is only as good as the data provided. Reliable clarification of heat data upstream and downstream...
Briefs: Manufacturing & Prototyping
Thermal Control Method for High-Current Wire Bundles by Injecting a Thermally Conductive Filler
A procedure was developed to inject thermal filler material (a paste-like substance) inside the power wire bundle coming from solar arrays. This substance fills in voids between wires, which enhances the heat path and reduces wire temperature. This...
Briefs: Test & Measurement
Dielectric Heaters for Testing Spacecraft Nuclear Reactors
Like the electrical-resistance heaters used heretofore for such testing, the dielectric heaters would be inserted in the reactors in place of nuclear fuel rods. A typical heater according to the proposal would consist of a rod of lossy dielectric material sized and shaped like a fuel rod...
Briefs: Physical Sciences
A family of iron-nickel and ironnickel- cobalt alloys made using metal injection technology (MIT) has been designed to match the coefficient of thermal expansion (CTE) of...
Briefs: Physical Sciences
Thin-film heat-flux sensors of a proposed type would offer advantages over currently available thin-film heat flux sensors. Like a currently available thin-film heat-flux sensor, a sensor according to...
Briefs: Photonics/Optics
Next-generation thermal load sensors, or combo sensors, optimize climate control and lighting in "intelligent automobiles," thereby enhancing the comfort and safety of drivers and passengers....
Briefs: Materials
Analysis of Multilayer Thermal Insulation for Reentry
A paper presents a study of multilayer thermal insulations for protecting spacecraft against aerodynamic heating during reentry into a planetary atmosphere. A multilayer insulation considered in the study comprised (1) thin ceramic/composite foils coated with gold for high reflectance...
Briefs: Photonics/Optics
A proposed thermographic technique would exploit the unique fluorescence characteristics of yttrium vanadate doped with dysprosium (YVO4:Dy3+). The particular aspect of the fluorescence...
Briefs: Electronics & Computers
“Flip chip on board (FCOB) with high thermal conductivity and tailored coefficient of thermal expansion (CTE)” denotes a developmental concept for relatively inexpensive,...
Briefs: Physical Sciences
Software for Probabilistic Thermal and Structural Analysis
NESTEM is a computer code that is a combination of a heat-transfer-analysis subprogram and a NASA in-house probabilistic-analysis code called "NESSUS" (for Numerical Evaluation of StochasticStructures Under Stress). NESTEM can be used to analyze a complex combustor thermal environment...
Briefs: Electronics & Computers
Dryden Flight Research Center's Flight Loads Laboratory (FLL) was constructed in 1964 for use in performing combined mechanical and thermal tests of structural components and complete...
Briefs: Electronics & Computers
Improved electrical connections have been developed for thin-film thermocouples used to measure temperatures on the surfaces of ceramic-matrix composite-material specimens during...
Briefs: Physical Sciences
The figure shows a tension/compression structure that provides rigid suspension and a high degree of thermal isolation for a small instrument assembly used in low-temperature...
Briefs: Photonics/Optics
Computer Code for Analysis of Stress in Silicon Wafers
The MacWafer™ code computes gravitational and thermal stresses in silicon wafers and uses these results to determine the maximum allowable temperature variation across a wafer, maximum processing temperatures, and maximum allowable heating and cooling rates. This information is of...
Briefs: Test & Measurement
Noncontact Measurement of Resistivity of Molten Material
It is now possible to determine the electrical resistivity of a molten sample of a pure, electrically conductive material (a metal or semiconductor), without contact between the sample or any solid object. Once the electrical resistivity has been determined, the thermal conductivity can...
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