Newly developed two-dimensional (2D) materials such as graphene — which consists of a single layer of carbon atoms — have the potential to replace traditional microprocessing chips based on silicon, which have reached the limit of how small they can get. But engineers have been...

A procedure was developed to inject thermal filler material (a paste-like substance) inside the power wire bundle coming from solar arrays. This substance fills in voids between wires, which enhances the heat path and reduces wire temperature. This leads...

Like the electrical-resistance heaters used heretofore for such testing, the dielectric heaters would be inserted in the reactors in place of nuclear fuel rods. A typical heater according to the proposal would consist of a rod of lossy dielectric material sized and shaped like a fuel rod...

A paper presents a study of multilayer thermal insulations for protecting spacecraft against aerodynamic heating during reentry into a planetary atmosphere. A multilayer insulation considered in the study comprised (1) thin ceramic/composite foils coated with gold for high reflectance...

NESTEM is a computer code that is a combination of a heat-transfer-analysis subprogram and a NASA in-house probabilistic-analysis code called "NESSUS" (for Numerical Evaluation of StochasticStructures Under Stress). NESTEM can be used to analyze a complex combustor thermal environment with...

The MacWafer™ code computes gravitational and thermal stresses in silicon wafers and uses these results to determine the maximum allowable temperature variation across a wafer, maximum processing temperatures, and maximum allowable heating and cooling rates. This information is of particular...

It is now possible to determine the electrical resistivity of a molten sample of a pure, electrically conductive material (a metal or semiconductor), without contact between the sample or any solid object. Once the electrical resistivity has been determined, the thermal conductivity can be...