Connected Vehicles & Cybersecurity: How Government and Industry Are Responding to New IoT Tech & Emerging Threats

Cybersecurity is critical to producing the connected vehicles that consumers demand. With threats evolving as rapidly as the technology integrated into today's vehicles, the industry, academia, and government must take a unified approach to secure our vehicles and the future of our field.

Posted in: On-Demand Webinars, Automotive, Electronics & Computers
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Vision Processing using NXP S32V234 Processor

During this Webinar, you will learn how the comprehensive Vision Software Development Kit (VSDK) for NXP S32V234 Vision Processor will help you with your vision processing applications. The VSDK includes an image sensor processor (ISP) and APEX graph tools. The S32V234 Vision Processor targets surround view, object detection, CNN/DNN neural networks for image classification and sensor fusion applications in Automotive and Industrial markets.

Posted in: On-Demand Webinars, Automotive, Electronics & Computers
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Annual IIoT Maturity Survey

A survey of senior-level, experienced Industrial Internet of Things (IIoT) decision-makers and influencers in the manufacturing, oil and gas (O&G), and transportation industries confirms that IIoT has progressed beyond hype to widespread use. Eighty six percent of participants in the Bsquare 2017 Annual IIoT Maturity Survey have adopted IIoT solutions and 84% believe their solutions are very or extremely effective.

Posted in: White Papers, Electronics & Computers
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Industrial IoT: Keeping Heavy-Duty Vehicles Moving

Commercial trucking, agriculture, and construction businesses know the challenges of relying on heavy-duty vehicles and equipment for day to day operations and the cost of maintenance over a vehicle's lifetime.

Posted in: White Papers, Electronics & Computers
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Specialized Materials Meet Critical Packaging Needs in MEMS Devices

The unique requirements of microelectromechanical systems (MEMS) call for specialized materials. Versatile epoxy adhesives are often capable of providing the necessary properties to ensure support and protection from thermal and mechanical shock, vibration, high acceleration, particles, and other physical damage. Download Master Bond’s white paper to find out how these materials are used and their benefits for MEMs applications.

Posted in: White Papers, Electronics, Materials, Semiconductors & ICs
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Flexible, Printable Electronics for Sensor Arrays

Printable electronics — flexible circuitry that is deposited on some type of plastic substrate — has been a major area of research for decades. But the ability to print the substrate itself greatly increases the range of devices the technique can yield.

Posted in: Briefs, Electronics & Computers, Computer software / hardware, Computer software and hardware, Integrated circuits, Computer software / hardware, Computer software and hardware, Integrated circuits, Plastics
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Single Event Upset Suppression System (SEUSS)

Electronic devices are getting smaller and more energy-efficient, meaning that they are more susceptible to single event upsets (SEUs) — malfunctions caused by particles in the atmosphere interfering with electronic systems. The need increases as these devices get smaller, since particles that cause these upsets can even come from the packages that house the devices. This is especially prevalent in the aerospace industry, since working at higher altitudes means increased exposure to cosmic ray particles.

Posted in: Briefs, Electronics & Computers, Electromagnetic compatibility, Electronic equipment, Electromagnetic compatibility, Electronic equipment, Radiation protection
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Products of Tomorrow: November 2017

This column presents technologies that have applications in commercial areas, possibly creating the products of tomorrow. To learn more about each technology, see the contact information provided for that innovation.

Posted in: Articles, Products, Batteries, Energy Storage, Fluid Handling, Implants & Prosthetics, Rehabilitation & Physical Therapy, Robotics, Ultracapacitors and supercapacitors, Ultracapacitors and supercapacitors, Air pollution, Medical equipment and supplies
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Device for and Method of Computer Intrusion Anticipation, Detection, and Remediation

Initially, relatively powerful computers were constructed as unique mainframes operated by larger corporations on isolated networks. Then, computers with modest amounts of computing power were made available to individuals as standalone personal computers. The computing power of personal computers and the applications for which they could be used were increased by networking them with other computers throughout the world using ancillary devices (e.g., servers, routers, links, switches, hubs, etc.). An arrangement into which computer and ancillary devices are configured is called a topology. There are many different types of topologies (e.g., bus, ring, star, tree, mesh, etc.).

Posted in: Briefs, Electronics & Computers, Architecture, Computer software / hardware, Computer software and hardware, Wireless communication systems, Architecture, Computer software / hardware, Computer software and hardware, Wireless communication systems
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Integrated Three-Dimensional Module Heat Exchanger for Power Electronics Cooling

Critical elements in the operation of electric drive systems are power electronics and power semiconductor packages. Improving thermal management of power electronics can help reduce the cost, weight, and volume of electric drive systems, and thus increase market acceptance. The power semiconductor packaging must provide the necessary electrical connections, while at the same time enabling heat removal from the semiconductor devices such as insulated gate bipolar transistors (IGBTs) and diodes.

Posted in: Briefs, Electronics & Computers, Power electronics, Semiconductor devices, Power electronics, Semiconductor devices, Heat exchangers, Heat exchangers
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