Products of Tomorrow: September 2017

This column presents technologies that have applications in commercial areas, possibly creating the products of tomorrow. To learn more about each technology, see the contact information provided for that innovation.

Posted in: Articles, Electronics & Computers, Materials, Windows and windshields, Solar energy, Medical equipment and supplies, Product development
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DIGITALIZATION: The New Critical Success Factor

The terms Industry 4.0, Big Data, the Internet of Things, and the Digital Factory are being pitched around like a rugby ball, and almost always with a decided lack of clear definition. Let’s set the record straight.

Posted in: Articles, Electronics & Computers, Sensors, Computer simulation, Big data, Cyber security, Internet of things, Big data, Cyber security, Internet of things, Computer integrated manufacturing
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3D Chip Combines Computing and Data Storage

Fields ranging from autonomous driving to personalized medicine are generating huge amounts of data. But just as the flood of data is reaching massive proportions, the ability of computer chips to process it into useful information is stalling.

Posted in: Briefs, Electronics & Computers, Architecture, Computer software / hardware, Computer software and hardware, Integrated circuits, Architecture, Computer software / hardware, Computer software and hardware, Integrated circuits, Data management, Product development
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Shaper Design in CMOS for High Dynamic Range

Front-end electronics for capacitive sensors typically include a preamplifier followed by a filter. The preamplifier provides low-noise amplification of the signals induced in the sensor electrodes. The filter, by properly limiting the signal bandwidth, maximizes the Signal-to-Noise (S/N) ratio. Additionally, the filter limits the duration of the output signal associated with the measured event and, for those sensors where the induced signal is relatively slow, it maximizes the signal amplitude.

Posted in: Briefs, Electronics & Computers, Semiconductors & ICs
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Boost Economics in Agile High Throughput Satcom Payloads

The inexorable demand for bandwidth fuels the need for agile systems throughout data networks. Even satellite communications are undergoing transformative digital developments. Innovative architectures supported by new, ultra-wideband (UWB) data convertors are helping boost both their economics and data throughput. Read this white paper from Teledyne e2v to find out just how these UWB data converters are affecting payload system design choices to boost economics and delivering new price points.

Posted in: White Papers, Aerospace, Defense, Electronics & Computers
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Modular Vs. Unibody Enclosures: How to Improve Scalability and Efficiency

This brief Tech Talk examines strategies for improving enclosure scalability and efficiency while highlighting the differences between truly modular and unibody welded enclosures. It also addresses considerations that should be made when specifying an enclosure including: the application for which the enclosure will be used; the environment in which it will reside; space, temperature and internal design requirements; and the enclosure’s need to facilitate cable management.

Posted in: Tech Talks, Electronics & Computers
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New Research into Solving Simulation Bottlenecks

Research is under way to increase the performance of the LS-DYNA finite element program, which is used in automotive, aerospace, construction, military, manufacturing, and bio-engineering applications to simulate complex real-world problems. Most important is the research into its multifrontal linear solver. This 10-minute audio-visual presentation examines: leveraging new microprocessor architectures and emerging solid-state disks; improving the performance of factorization on large-scale distributed memory systems; and looking into distributed reordering and block low-rank approximation to enable LS-DYNA to handle even larger implicit models. Viewers will be able to submit questions and download a new white paper on important advancements affecting LS-DYNA.

Posted in: Dynamic White Papers, Electronics & Computers
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Thermal Management Solutions for Embedded Computing Systems

Embedded computing systems used in many military and industrial applications are trending toward higher heat fluxes and power requirements. As a result, performance is being hindered by thermal limitations. This is intensified by the enclosed nature of server racks and harsh ambient conditions experienced in many of today’s applications. The thermal path typically involves a heat spreader to get heat from the electronics components to the edge of the board, a retainer clamp/lock to mechanically and thermally couple the board to the chassis and heat spreading or dissipation from the outside of the enclosure.

Posted in: On-Demand Webinars, Electronics & Computers
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RF Testing on Automotive Infotainment Devices

The car radio has evolved from a cassette player to a state of the art entertainment system, keeping the driver and passengers connected on the go. The entertainment system brings a design challenge in that communication and broadcast standards have to coexist within a small area in the dashboard of a car. Since the frequencies defined by the RF standards are in close proximity, it is very important that the frequencies coexist and since multiple standards need to be supported in the single assembly, RF modules are placed next to each other on the assembly line. Other than testing the entertainment center in the car, the antennas inside the car are subjected to cross-coupling effects with passengers mobile devices. To ensure the RF performance of the infotainment system, all of these scenarios need to be thoroughly tested. This application note highlights some of the RF measurement challenges and introduces equipment that is required for relevant RF characterization of car infotainment devices.

Posted in: White Papers, Automotive, Electronics & Computers, Antennas, RF & Microwave Electronics
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Writing with Light: An ‘Etch A Sketch’ Electrical Circuit

Physicists from Washington State University (WSU) have used lasers to draw conductive circuits into a crystal. The achievement demonstrates a new kind of transparent, three-dimensional electronics: circuits that can be erased and reconfigured, like the drawings of an Etch A Sketch.

Posted in: News, Board-Level Electronics, Electronic Components, Electronics & Computers, Lasers & Laser Systems, Optical Components, Optics, Photonics
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