3D Imaging Sensor

FSI Technologies (Lombard, IL) has added a new 3D imaging sensor to its machine vision product line. The GS Family of 3D imaging sensors provides support to a whole new range of robot control and inspection applications. The GS 3D sensors, when used in conjunction with the PowerEye machine vision system, can be used in applications such as bin picking, robotic manipulation, sorting products, mold clearance checking, and space monitoring and object recognition. In addition, the 3D technology will aid in determining spatial positions and measurements.

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C-mount Spectrometer Adapters

A new series of adapters, simplifying integration of c-mount cMOS and CCD cameras with McPherson (Chelmsford, MA) high performance spectrometers, is now available. Easy and secure c-mount adapters are suitable for cryogenic, TEcooled, deep depletion, near infrared In- GaAs, and sensitive Silicon visible range cameras. They fasten via 1-inch, 32-pitch screw thread with 17.526mm back distance to focal plane. The new McPherson adapters have a nested design to accommodate the threaded, rotating c-mount.

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2.8 MP GigE Vision Camera

Point Grey (Richmond, BC, Canada) recently announced the addition of new 2.8 megapixel models to its Flea®3 line of GigE Vision digital cameras. Building on Point Grey’s experience with Sony CCD technology, the Flea3 FL3-GE- 28S4 monochrome and color models use the all-new, highly sensitive Sony ICX687 EXview HAD CCD II™ image sensor to deliver high resolution, high quality images in a compact and low-cost package. The Sony ICX687 builds on the success of the popular ICX274 2MP CCD by offering more pixels and better sensitivity in the same 1/1.8" optical format.

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Cool Bypass Switches

STMicroelectronics (Geneva, Switzerland) has introduced its latestgeneration high-efficiency cool bypass switches for photovoltaic modules, enabling an even higher percentage of harvested energy to reach end-users and further reducing the cost per Watt of renewable energy. The new devices can save up to 1% of the energy produced and normally lost through conventional bypass diodes; in a 1MWp solar array farm this loss could provide the total annual electricity consumption of two average European households.

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Multi-Channel Laser Modules

AKELA Laser Corporation (Monmouth Junction, NJ) announced the release of its single and multi-channel laser diode modules in wavelengths from 635nm to 1950nm. The second in a series of releases over the next 6 months, these modules offer integrated cooling and drive electronics for plugand- play use. Suitable for both R&D and OEM applications, they are designed for 100 micron, 0.22NA fibers and provide up to 2 Watts CW per channel. Future product releases will include increasingly higher power levels as well as modules designed for the medical market with built-in accessories such as photodetectors, aiming beams, blast shields, and fiber sensors. The laser modules are available in the following configurations: single channel; multi-channel with independently addressable outputs; and multiple outputs controlled by a single driver.

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Chip-Based Video Camera

Lattice Semiconductor Corporation (Bridgewater, NJ) recently demonstrated a LatticeECP3-based video camera supporting NIT’s NSC1005 Wide Dynamic Range (WDR) 720p image sensor. The NSC1005 high dynamic range image sensor from NIT (Verrieres le Buisson, France) is available mounted on a headboard, called the Widy Board, complete with lens and is intended for use with the Lattice HDR-60 Video Camera Development Kit. The sensor is fully supported with a 60 frames per second color Image Signal Processing (ISP) pipeline implemented on a LatticeECP3(TM) FPGA. The hardware is designed to support full 720p resolution of the NIT NSC1005 sensor at 60fps in streaming mode through the FPGA, without the need for an external frame buffer. Other features include high-quality DeBayer operating in the log domain, Auto White Balance, Gamma Correction and Overlay for both character and graphics. Lattice HDMI PHY IP enables output to HDMI/DVI monitors.

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Silicon Solar Cells

Imec (Leuven, Belgium) has developed a 20.04% large-area industrial-level silicon solar cell. Imec’s PERC-cell is compatible with the requirements of industrial photovoltaic production. It is a large-area (125mm x 125mm) Cz p-type silicon cell with a simple homogeneous emitter and Ag-single screen-printed front side contacts (65μm finger width), two busbars, and an adapted Al back-side metallization. The transfer of this process to 156mm x 156mm wafers is ongoing.

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Infrared Image Sensor

ON Semiconductor (Phoenix, AZ) has collaborated with Teledyne Imaging Sensors (Camarillo, CA) to manufacture an Extremely Large Stitched Read Out Integrated Circuit (ELS ROIC) for astronomy. The H4RG-15 image sensor, designed by Teledyne, is the latest generation of a 20-year effort sponsored by the National Science Foundation, the National Aeronautics and Space Administration, and Teledyne internal funding to develop increasingly larger and more powerful infrared sensors for astronomical research.

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USB 3.0 CMOSIS-Sensor- Based Cameras

Lumenera Corporation (0ttawa. Ontario, Canada) has introduced a new line of cameras that pair CMOSIS sensors with a USB 3.0 interface. This new product line features six distinct color, monochrome and NIR enhanced cameras based on the CMOSIS CMV4000 (Lt425) and CMV2000 (Lt225) megapixel sensors. Product highlights include a robust, sleek enclosure, compact design for integration, as well as industrial and scientific models. Built-in FPGA-based image processing ensures the highest image quality without having to compromise on performance.

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Epoxy Based UV Curable System

With outstanding light transmission properties and optical clarity, Master Bond (Hackensack, NJ) UV15 is widely used for a variety of bonding, coating and sealing applications in the optical, electronic and optoelectronic industries. This epoxy based UV curable system is 100% reactive and does not contain any solvents or other volatiles.

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