Boothroyd Dewhurst (Wakefield, RI) announced Design for Manufacture and Assembly (DFMA®) 2019 software for analyzing parts and assemblies. DFMA utilizes a question-and-answer interface that identifies opportunities for substantial cost reduction in a product. By applying industry-tested minimum part count criteria, the software finds parts that can be consolidated/eliminated while maintaining functionality. New CAD calculators allow users to utilize more cost driver information directly from a 3D model.

Dewesoft (Whitehouse, OH) introduced single-channel KRYPTON data acquisition modules for use in harsh environments such as exposure to extreme temperatures, water spray or submersion, or high shock and vibration. The modules are machined from an aluminum brick. After the industrial-grade electronics are installed, the units are sealed with thermally conductive and electrically isolating rubber. Units are waterproof and can withstand shocks up to 100 G. The modules meet IP67 protection against water, dust, and other elements.

EFCO (San Diego, CA) introduced the SmartSL Plus embedded box computer with Power-over-Ethernet (PoE) capability. Powered by the 3rd Gen (Bay Trail) Intel® Atom™ or Celeron® processor, the fanless, cable-less computer is equipped with a Qseven module. The computer features a variety of interfaces and expansion options. Features include aluminum alloy structure, DC voltage input of 9V to about 32Vdc, dual HDMI and VGA display, a Mini-PCIe with USIM socket, an mSATA socket, a USB 3.0/2.0 port, and three USB 2.0 sockets.

The GNV-720 and GNV-725 humidity temperature meters from Global Specialties (Yorba Linda, CA) are portable, dual-function meters with three environmental sensors: one for humidity and two for temperature. Capacitance and semiconductor sensors are incorporated directly into the remote wand. The thermocouple sensor is attached and all three measurements are displayed simultaneously on the LCD screen. Features include min/max and auto off functionality, and relative measurement functionality.

Maplesoft™ (Waterloo, ON, Canada) released Maple™ 2019 software that analyzes, explores, visualizes, and solves math problems. It includes improvements to core functionality such as solving equations, integration, and factoring, and finds symbolic solutions to partial differential equations. The new version supports tensor computations, classical and quantum mechanics, special and general relativity, and standard tensor notation for input and output. Other enhancements are group theory tools for constructing, computing with, and visualizing more groups as well as additional signal processing including new algorithms, manipulation tools, and visualization techniques.

nTopology (New York, NY) offers the nTop Platform, a unifying technique for design, simulation, and manufacturing data to be intelligently embedded directly into a part. The approach removes geometry bottlenecks in design by achieving more efficient workflows. The Design for Additive Manufacturing (DfAM) workflow enables users to capture, reuse, and deploy engineering workflows to increase collaboration across teams. Spatially varying structures control density, orientation, and spacing of micro, macro, and mesoscale structures.

OnLogic (South Burlington, VT) introduced the Karbon 700 high-performance rugged computer for use as a data logger, NVR, or edge device in heavy industrial, in-vehicle, or remote installations in the manufacturing, physical security, and energy management industries. Two models are available: Model K700-SE is a standard model and K700-X2 adds dual PCIe slots and support for a range of full-size dedicated graphics cards. It has been tested to MIL-STD-810G standards to resist damage from prolonged vibration and shock up to 50G.

S. Himmelstein and Company (Hoffman Estates, IL) announced Model 700+ Series signal conditioners that are flexible, one- or two-channel signal conditioners/displays. They feature user-settable digital filters, real-time cross-channel calculations, built-in data acquisition and control functions, serial communications interface, user-assignable logic I/O, and auto-scaled ±5 and/or ±10-Volt analog outputs. Additional features include six active display digits and 0.001% display resolution.

Toposens (Sunnyvale, CA) released the TS3, a 3D ultrasonic sensor suitable for autonomous systems including robotics, autonomous vehicles, and other positioning applications that require reliable object detection and situational awareness. In comparison to common ultrasonic sensors that measure the distance to the closest reflecting surface, these 3D sensors achieve a field of view of up to 160° and provide simultaneous 3D measurements for multiple objects within the scanning area.

Watlow® (St. Louis, MO) introduced the PM PLUS™ version of the EZ-ZONE® PM temperature controller that features a full-color front-panel display with color coding, making the display visible from many angles. A touch keypad eliminates legacy rubber buttons that can wear out from use and harsh environments. The controller is backward-compatible with EZ-ZONE PM controllers and offers user upgrades including an intuitive menu flow allowing the controller to be easily configured. It also offers Bluetooth® connectivity with the EZ-LINK™ mobile app for remote access capability.