Semiconductors & ICs

A Resistive, High-Voltage, Differential Input Interface in a 3.3-V BiCMOS 0.5-μm Process for Extreme Environments

NASA’s Jet Propulsion Laboratory, Pasadena, California

Wide-temperature and extreme-environment electronics are crucial to future missions. These missions will not have the weight and power budget for heavy harnesses and large, inefficient warm boxes. In addition, extreme-environment electronics, by their inherent nature, allow operation next to sensors in the ambient environment, reducing noise and improving precision over the warm-box-based systems employed today.

Posted in: Briefs, TSP, Electronics & Computers, Power Management, Semiconductors & ICs, Sensors, Electronic equipment, Electronic equipment
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Motor Driver ICs

Toshiba America Electronic Components (San Jose, CA) offers four motor driver ICs, ranging from precision stepper motor drivers to sensorless brushless DC motor drivers. The TB67S269FTG bipolar stepping motor driver has a maximum rating of 50V and 2.0A. Three brushless DC motor drivers — the TB67B001FTG, TB67B008FTG, and TB67B008FNG — feature maximum rating of 25V and 3.0A. The TB67S269FTG targets applications requiring high-speed, high-precision motor drives. The driver’s high-resolution, 1/32-step motor driving technology lowers noise and vibration, while heat generation is reduced via low ON resistance (0.8Ω or less, upper + lower) MOSFET H-bridges and featuring Toshiba’s Advanced Mixed Decay (ADMD) technology that optimizes the drive capability of complex motor currents.

Posted in: Articles, Products, Motion Control, Motors & Drives, Semiconductors & ICs
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Wearable Nanowire Sensors Monitor Electrophysiological Signals

Researchers from North Carolina State University have developed a new, wearable sensor that uses silver nanowires to monitor electrophysiological signals, such as electrocardiography (EKG) or electromyography (EMG). The new sensor is as accurate as the “wet electrode” sensors used in hospitals, but can be used for long-term monitoring and when a patient is moving.

Posted in: News, News, Electronic Components, Electronics & Computers, Medical, Patient Monitoring, Nanotechnology, Semiconductors & ICs, Sensors
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Technology Diagnoses Brain Damage from Concussions, Strokes, and Dementia

New optical diagnostic technology developed at Tufts University School of Engineering promises new ways to identify and monitor brain damage resulting from traumatic injury, stroke, or vascular dementia in real time and without invasive procedures.

Posted in: News, Electronic Components, Electronics & Computers, Diagnostics, Medical, Fiber Optics, Optics, Photonics, Semiconductors & ICs, Measuring Instruments, Test & Measurement
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Researchers Develop a Way to Control Material with Voltage

A new way of switching the magnetic properties of a material using just a small applied voltage, developed by researchers at MIT and collaborators elsewhere, could signal the beginning of a new family of materials with a variety of switchable properties. The technique could ultimately be used to control properties other than magnetism, including reflectivity or thermal conductivity. The first application of the new finding is likely to be a new kind of memory chip that requires no power to maintain data once it’s written, drastically lowering its overall power needs. This could be especially useful for mobile devices, where battery life is often a major limitation.

Posted in: News, Batteries, Board-Level Electronics, Electronic Components, Electronics & Computers, Power Management, Materials, Metals, Semiconductors & ICs
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Garnet Ceramics Could Be the Key to High-Energy Lithium Batteries

Scientists at the Department of Energy’s Oak Ridge National Laboratory have discovered exceptional properties in a garnet material that could enable development of higher-energy battery designs. The ORNL-led team used scanning transmission electron microscopy to take an atomic-level look at a cubic garnet material called LLZO. The researchers found the material to be highly stable in a range of aqueous environments, making the compound a promising component in new battery configurations.

Posted in: News, Batteries, Electronic Components, Electronics & Computers, Power Management, Energy, Energy Efficiency, Ceramics, Materials, Semiconductors & ICs
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Radiation Hard By Design (RHBD) Electronics

Under certain conditions, a false signal will be absorbed and a correct signal will be generated.

Goddard Space Flight Center, Greenbelt, Maryland

Current RHBD electronics are limited to speeds that approximate 250 MHz, regardless of the electronic process. The fact that determines the final speed is based on the nature of the current SEU (single-event upsets) radiation-tolerant latches, and the data flow between the latches through combinational logic.

Posted in: Briefs, TSP, Semiconductors & ICs, Electronic equipment, Electronic equipment
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Detecting Loss of Configuration Access of Reprogrammable FPGA Without External Circuitry

The configuration of the reprogrammable field-programmable gate array (FPGA) currently on the market is very susceptible to single event upset when it operates in radiation environments. The current state-of-the-art approach is to refresh the configuration while the FPGA is operating. When using this approach, it is essential to detect the loss of configuration access while the FPGA is operating in a radiation environment, allowing the system to initiate a configuration access recovery.

Posted in: Briefs, TSP, Semiconductors & ICs, Electronic control systems, Electronic control systems
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Micro-Coil Spring Interconnection for Ceramic Grid Array Packaged Integrated Circuits

This interconnection method extends the useful life of ceramic area array integrated circuits.

Marshall Space Flight Center, Alabama

This method of interconnecting ceramic integrated circuits to organic printed circuit boards (PCBs) is designed to substantially increase the life of the interconnections. This is accomplished by providing a means of compensating for the shear stresses produced by thermal excursions as a result of the large mismatch of coefficients of thermal expansion between the integrated circuit and the printed circuit board.

Posted in: Briefs, Semiconductors & ICs, Electronic equipment, Electronic equipment, Ceramics
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Method for Formal Verification of Polymorphic Heterogeneous Multicore Processors

John H. Glenn Research Center, Cleveland, Ohio

Amethod was developed to model polymorphic heterogeneous multicore processors at a high level of abstraction, and formally verify them. The Bahurupi polymorphic heterogeneous multi-core architecture allows the combination of multiple simple processor cores — which can be superscalar — in order to form a coalition that behaves like a wider superscalar processor. This is done at runtime under software directives, allowing the architecture to adapt to the needs of executed applications with high instruction level parallelism. Such coalitions of cores were found to have comparable or better performance than that of a wide superscalar processor with issue width equal to the sum of the issue widths of the simple cores in the coalition, while avoiding the complexity, reliability issues, and high power consumption of wide superscalar cores. All of these are highly desirable advantages of future microprocessors that will be optimized for aerospace applications.

Posted in: Briefs, TSP, Semiconductors & ICs, Architecture, Architecture, Semiconductors
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