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Briefs: Software
CoolSPICE: SPICE Simulator for Cryogenic Electronics

Accurate assessment of circuits at cold temperatures is extremely difficult due to lack of models and tools that can simulate circuit behavior at cryogenic temperatures. A library of cryogenic...

News: Electronics & Computers
Bending Light with a Tiny Chip

Imagine that you are in a meeting with coworkers or at a gathering of friends. You pull out your cell phone to show a presentation or a video on YouTube. But you don't use the tiny screen; your phone projects a...

News: Electronics & Computers
Scientists Demonstrate Electrical Properties of Topological Insulators

Scientists at the U.S. Naval Research Laboratory (NRL) have demonstrated for the first time that one can electrically access the remarkable properties predicted for a...

Briefs: Semiconductors & ICs
Metal-Assisted Fabrication of Biodegradable Porous Silicon Nanostructures

Porous silicon nanowires are fabricated by two-step, metal-assisted electroless chemical etching of p-type or n-type silicon wafers. This method, in combination with...

Briefs: Electronics & Computers
Dual-Leadframe Transient Liquid Phase Bonded Power Semiconductor Module Assembly and Bonding Process

A high-temperature-capable widebandgap semiconductor power module package, coupled with a new high-temperature- capable bonding process (with an...

News: Semiconductors & ICs
Head-Mounted Display Embeds an Augmented Reality Chip

Researchers at the Korea Advanced Institute of Science and Technology (KAIST) developed K-Glass, a wearable, hands-free head-mounted display (HMD).

Unlike virtual reality which...

Briefs: Semiconductors & ICs
Flexible Microstrip Circuits for Superconducting Electronics

Flexible circuits with superconducting wiring atop polyimide thin films are being studied to connect large numbers of wires between stages in cryogenic apparatus with low heat load....

Briefs: Electronics & Computers
High-Temperature, Distributed Control Using Custom CMOS ASICs

Four application specific integrated circuits (ASICs) that provide sensing, actuation, and power conversion capabilities for distributed control in a high-temperature (over 200 °C)...

Briefs: Electronics & Computers
Electron Beam Writer Enables Microfabrication

The new electron beam writer housed in the cleanroom facility at the Qualcomm Institute, previously the UCSD division of the California Institute of Telecommunications and Information Technology,...

Techs for License: Semiconductors & ICs
Low-Loss Dielectric Materials Improve PC Boards

Low-loss dielectric materials are available. The hydrocarbon- based, fiber-reinforced composite sheets can be applied to printed circuit boards and IC chip packaging. The material has a very low...

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