Electronic Components
Reducing Interconnection Weight in Autosports
Posted in Articles, Electronic Components, Electronics, Composites, Fiber Optics on Wednesday, 01 April 2015
In Formula 1 and other autosports, weight reduction is critical to competitive advantage. A few grams saved here and a few more saved there can add up to significant savings. There is also a move toward high-density packaging of electronics parts. As the electronics content of cars increases, the natural drive is to miniaturize the package to gain maximum efficiency in the use of space.
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0T Series – Watertight Connector
Posted in Products, Electronic Components, Electronics, Power Management, Power Supplies on Wednesday, 01 April 2015
LEMO USA, Inc., Rohnert Park, CA, introduces the 0T Series Connector, a small sized watertight connector using the same original LEMO Push-Pull technology. Based on the LEMO B Series, the 0T Series Connector includes a special construction with an inner sleeve and extra sealing to enable IP68 water protection. The 0T Series is available in 2- to 9-contact configurations. Contacts can be terminated by soldering to the wire, crimping onto the wire, or directly to a PCB. For Free Info, Visit http://info.hotims.com/55588-175
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International Power Cords and Cord Sets
Posted in Products, Electronic Components, Electronics, Power Management, Power Supplies on Wednesday, 01 April 2015
Qualtek, Mentor, OH, announces that it now fully stocks a comprehensive selection of 2- and 3-conductor North American power cords, international power cords, and hospital-grade power cords in various configurations. A wide selection of plugs and connectors are available with various cable jackets including outdoor rated, colors, temperature rating, lengths, and shielding. Custom configurations, value added termination, and strain reliefs are available upon request. For Free Info, Visit http://info.hotims.com/55588-176
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Capacitively Coupled, High-Voltage Current Sensing for Extreme Environments
Posted in Briefs, TSP, Electronic Components, Power Supplies, Thermal Management, Sensors on Sunday, 01 March 2015
NASA’s Jet Propulsion Laboratory, Pasadena, California Wide-temperature and extreme-environment electronics are crucial to future missions. These missions will not have the weight and power budget for heavy harnesses and large, inefficient warm boxes. In addition, extreme-environment electronics, by their inherent nature, allow operation next to sensors in the ambient environment, reducing noise and improving precision over the warm-box-based systems employed today.
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DOEs Rescue Questionable Medical Electronics PCBs
Posted in Features, Board-Level Electronics, Electronic Components, Electronics on Sunday, 01 March 2015
Board cleaning is perhaps one of the most overlooked aspects of printed circuit board (PCB) assembly. But savvy medical electronics original equipment manufacturers (OEMs) have a keen sense of the importance it plays to ensure their products are free of miniscule flaws, defects, debris, and dust. In special cases, critical examinations must be performed to assure the correct cleaning solvents and processes are implemented to avoid damaging contaminants.
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Using Surge Testers for Design Verification and Production Testing
Posted in Features, Electronic Components, Power Management, Power Supplies, FDA Compliance/Regulatory Affairs, Measuring Instruments, Monitoring on Sunday, 01 March 2015
Not only are medical devices expected to function as intended, they must meet ergonomic, safety, FDA and functional requirements. They must be designed to function in adverse environments; sometimes in the operating room; sometimes in an emergency vehicle for example. If a device is patient connected, it is also expected to function within proscribed parameters in the presence of a defibrillation pulse. These parameters differ depending on the type of device. All devices must pass an isolation test designed to ensure that the pulse will not affect the device’s signal input part/signal output part (SIP/SOP) ports; and effective with the Third Edition of IEC 60601-1, they must demonstrate that they absorb less than 10 percent of the defibrillation pulse. ECG monitoring equipment either for hospital (IEC 60601-2-27) or emergency use (IEC 60601-2-25) is additionally subject to performance requirements after a defibrillation pulse is applied.
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Product of the Month: Custom Tuned and Terminated Micro-coaxial Assemblies
Posted in Products, Electronic Components, Displays/Monitors/HMIs, Surgical Robotics/Instruments on Sunday, 01 March 2015
High Speed Interconnects, Scottsdale, AZ, announces custom, fine-wire and fine-pitch diagnostic imaging assemblies for medical device OEMs producing next-generation ultrasound equipment.
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