Thermal Management
Heat-Conducting Plastic Dissipates Ten Times Better
Posted in News, Electronics, Thermal Management, Composites, Plastics on Monday, 08 December 2014
Engineers at the University of Michigan, Ann Arbor, have developed a plastic blend that, they say, can dissipate heat up to 10 times better than its conventional counterparts. While plastics are inexpensive, lightweight, and flexible, they tend to restrict the flow of heat, so their use has been limited in technologies like computers, smartphones, and other devices. This new research could lead to light, versatile, metal-replacement materials for more powerful electronics.
Read More >>
Unmanned Ocean Drone
Posted in Application Briefs, Thermal Management, Data Acquisition on Monday, 01 December 2014
Liquid Robotics
Sunnyvale, CA
408-636-4200
www.liquidr.com
Accurately forecasting weather conditions and currents prior to mission deployment is an invaluable intelligence tool for the warfighter. Being able to accurately predict a Category-5 typhoon or hurricane, instead of a tropical storm, also saves lives, saves property, and saves time in evacuations. The Liquid Robotics' Wave Glider®, a surfboard-sized ocean drone filled with sensors, computers, and communications equipment, can survive a Category-5 typhoon while continuously collecting and transmitting meteorological and oceanographic data. Previously this type of data was unobtainable because it was too risky to send manned ships out in the middle of a hurricane/typhoon; buoys can become severely damaged or come off their moorings in such conditions; and satellites have difficulty seeing through the dense cloud cover.
Read More >>
A Graphene-Metal Sandwich Could Improve Electronics
Posted in News, Electronic Components, Electronics, Thermal Management, Coatings & Adhesives, Metals on Thursday, 20 March 2014
Researchers have discovered that creating a graphene-copper-graphene “sandwich” enhances copper’s heat conducting properties, which could help in shrinking electronics. Engineers at the University of California, Riverside, and the University of Manchester, UK, in collaboration, found that adding a layer of graphene, a one-atom thick material on each side of a copper film increased heat conducting properties by up to 24 percent.
Read More >>
MELF Resistor Series
Posted in Products, Board-Level Electronics, Electronic Components, Electronics, Thermal Management on Wednesday, 01 January 2014
Stackpole Electronics Inc., Raleigh, NC, announces that its surface mount metal film MELFs, the MLF and MLFM Series offers cooler operating temperatures at full rated power. The cylindrical shape provides a termination that is far more thermally efficient than comparable size flat chip resistors. They are ideally suited for medical instrumentation, monitoring, and test equipment.
Read More >>
Transistor for High-Performance Devices at Low Voltage
Posted in News, Electronic Components, Electronics, Power Management, Power Supplies, Thermal Management, Implants & Prosthetics, Patient Monitoring on Tuesday, 17 December 2013
A team of scientists at Penn State, University Park, PA, say that a new type of transistor could make fast, low-power computing devices possible for energy-constrained applications such as implantable medical electronics, smart sensor networks, and ultra-mobile computing. Called a near broken-gap tunnel field effect transistor (TFET), the new device uses the quantum mechanical tunneling of electrons through an ultrathin energy barrier to provide high current at low voltage.
Read More >>
How to Optimize Carbon Nanotube Arrays
Posted in News, Thermal Management on Tuesday, 10 December 2013
When designing devices, engineers often must join together materials that expand and contract at different rates as temperatures change. Such thermal differences can cause problems if, for instance, a semiconductor chip is plugged into a socket that can’t expand and contract rapidly enough to maintain an unbroken contact over time.
Read More >>
Thermally Optimized Medical Devices Improve Patient Outcomes
Posted in Features, Electronics, Manufacturing & Prototyping, Features, Electronic Components, Electronics, Thermal Management on Tuesday, 12 November 2013
Today’s medical device and equipment designs are highly influenced by continuous technological advances that affect their size, power consumption, and communication capabilities. But patient safety and comfort are also critical considerations, forcing designers to balance the demands of new technology with the demands of new forms of patient care. From addressing industry-wide concerns over bioburden to adhering to strict noise limitations and biocompatibility needs, the list of requirements is becoming increasingly long. In order to provide the best possible solutions, medical device designers need a working knowledge of the thermal management technologies available to them. Armed with a thorough understanding of both passive and active thermal management systems, including their components, benefits, and applications, designers can more effectively address all the needs of the medical industry.
Read More >>

White Papers

Maintenance Free Linear Guides
Sponsored by IKO
Reverse Engineering
Sponsored by Servometer
Windows CE Development for RISC Computers Made Easy
Sponsored by Sealevel
R&S® SMB100A, NRP, FSW-K6, ZVL Radar Educational Videos
Sponsored by Rohde and Schwarz A and D
The Self-Driving Car
Sponsored by HP
Noncontact Differential Impedance Transducer
Sponsored by Kaman

White Papers Sponsored By: