Electronics & Computers

Dual-Channel Electromechanical Shutter Driver (ESD)

This device controls the electromechanical shutter in a digital or photographic camera. This electronic device is designed to provide optimal control of an electromagnetically actuated shutter used on a digital or photographic camera. The SD36B1 Electromechanical Shutter Driver is designed to provide the drive pulses for opening and closing an electromagnetically actuated shutter. Electromechanical shutters are used when the exposure period for an electronic camera needs to be controlled outside of the range of electronic shuttering capabilities offered by the camera itself.

Posted in: Electronics & Computers, Briefs

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Sub-Nanosecond, Compact, Low-Power Time-Interval Measurement

This innovation is a sub-nanosecond time-interval measurement that is compact and inexpensive, implemented in a field-programmable gate array (FPGA). Currently, high-speed count ers or semi-custom or custom ASICs (application specific integrated circuits) are used for time-interval measurements. They are not nearly as powerful for automatic delay control for the environment (manufacturing, temperature, voltage, aging, and radiation).

Posted in: Electronics & Computers, Semiconductors & ICs, Briefs

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Improvised Diagnostic Strategy for High-Side Switch Power Stage

This technique enables detection of when a power stage fault occurs, and the type of fault. Robert Bosch Engineering & Business Solutions Ltd., Bangalore, India A vehicle electronic control unit consists of various high-side power stages for driving different loads. Common faults that these power stages experience are Short Circuit to Battery (SCB), Short Circuit to Ground (SCG), and Open Load (OL). These faults can occur during either on-state or off-state of the power stage output. It is essential to diagnose a fault such as SCB during switch off-state, SCG during switch on-state, and OL during both on- and off-state of the switch in order to avoid system malfunction or power stage damage.

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Dual-Leadframe Transient Liquid Phase Bonded Power Semiconductor Module Assembly and Bonding Process

This module package and bonding process enable device operation at temperatures exceeding 400 °C. A high-temperature-capable widebandgap semiconductor power module package, coupled with a new high-temperature- capable bonding process (with an optimized assembly and manufacturing process), has been developed that, together, can allow device operation at temperatures exceeding 400 °C, with the potential for higher-temperature operation depending on the semiconductor device characteristics. The semiconductor module is an ultracompact, hybrid power module that uses double leadframes and direct lead-frame-to- chip transient liquid phase (TLP) bonding. The unique advantages include very high current-carrying capability, low package parasitic impedance, low thermomechanical stress at high temperatures, double-side cooling, and modularity for easy system-level integration. The new power module will have a very small form factor with 3 to 5× reduction in size and weight from the prior art, no failure-prone bond wires, and will be capable of operating from 450 to –125 °C.

Posted in: Electronics & Computers, Semiconductors & ICs, Briefs

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Methods for Mitigating Space Radiation Effects, Fault Detection and Correction, and Processing Sensor Data

A combination of three innovations enables increased efficiency, stability, and flexibility of data management and systems functionality. The Integrated Modular Avionics (IMA) architecture being developed for space applications requires that sensor data be autonomously sampled and transmitted to the system network. This transmission needs to occur on a predetermined, fixed schedule to avoid conflicts on the network. It needs to be capable of building packets of sensor data for individual application partitions (i.e., environmental control, propulsion, and vehicle management). It must be easily configured for flexibility in system scheduling.

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Quad First Stage Processor: A Four-Channel Digitizer and Digital Beam-Forming Processor

A 4-channel digitizer was designed, built, and tested. The very large, complex board enables SweepSAR. The proposed Deformation, Eco-Systems, and Dynamics of Ice Radar (DESDynl-R) Lband SAR instrument employs multiple digital channels to optimize resolution while keeping a large swath on a single pass. High-speed digitization with very fine synchronization and digital beam forming are necessary in order to facilitate this new technique.

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Compact Ka-Band Antenna Feed with Double Circularly Polarized Capability

This design could be used for the feed component in highgain antennas. NASA has an interest in utilizing the Ka-band frequency allocation. One of the main reasons for migrating to Kaband is the need for higher frequency bandwidth to enable higher data rates. A dual circular polarized wideband antenna for Ka-band communications applications was designed leveraging a novel Ka-band polarizer design used in Lunar Reconnaissance Orbiter/Solar Dynamics Observatory (LRO/SDO). The proposed design merges two components (polarizer and antenna) into one unit, reducing its overall size. Its simulated bandwidth extends beyond the allocated bandwidth for NASA at Ka-band. This novel design could be used as well for the feed component in high-gain antennas (HGAs).

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