Electronics & Computers

When Wire Feedthroughs Make Sense

Engineers who work with pressure and vacuum chambers usually reach for off-the-shelf sealed bulkhead connectors when they need to pass power and signal wires through the chamber wall. And while these connectors may seem like the best or only way to breach the chamber walls, they can actually drive cost, impose unnecessary mechanical design constraints and trigger electrical problems. So what’s the alternative? Wire feedthroughs hermetically sealed with epoxy.

Posted in: Electronics & Computers, White Papers

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Reworked CCGA-624 Interconnect Package Reliability for Extreme Thermal Environments

The effect of the number of reworks is examined on the reliability of this technology for harsh, extreme thermal environments. During the past two decades, large, high-density, high-input/output (I/O) electronic interconnect SMT (surface mount technology) packages such as ceramic column grid arrays (CCGAs) have increased usage in avionics hardware of NASA projects. The test boards built with CCGA packages are expensive and often require rework to replace reflowed, reprogrammed, failed, or redesigned CCGA packages. Theoretically, a good rework process should have a similar temperature- time profile as that used for the original manufacturing process of solder reflow. A multiple rework process may be implemented with CCGA packaging technology to understand the effect of the number of reworks on the reliability of this technology for harsh, extreme, thermal environments.

Posted in: Electronics & Computers, Briefs

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Windows CE Development for RISC Computers Made Easy

Windows CE (a.k.a. Windows Embedded Compact), originally released in 1996, can be an attractive alternative to the full Windows operating system offering system designers the ability to control power, size, and cost in a new product. For example, the runtime license cost of the CE operating system alone can save as much as $150 over the license cost for standard Windows.

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Guidelines for Ensuring PCB Manufacturability

The rules of PCB design have changed little over the years, but the demands on the boards themselves keep increasing. The need for smaller, more complex boards used in smartphones, tablets, and other handheld devices translates into less real estate for greater functionality.

Posted in: Electronics & Computers, White Papers

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Thermally Conductive Epoxies Optimize Electronic Assemblies

The use and selection process of thermally conductive epoxies can make or break your application. Too much heat can lead to component malfunction or prematurecomponent failure while the inability to stay below specified temperature limits may result in irreversible damage and permanent performance shifts. Master Bond’s white paper compiles the most important considerations for the selection of epoxies for efficient thermal management.

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Ultra-Wideband, Dual-Polarized, Beam- Steering P-Band Array Antenna

The novel design geometry can be scaled with minor modifications. A dual-polarized, wide-bandwidth (200 MHz for one polarization, 100 MHz for the orthogonal polarization) antenna array at P-band was designed to be driven by NASA’s EcoSAR digital beam former. EcoSAR requires two wide P-band antenna arrays mounted on the wings of an aircraft, each capable of steering its main beam up to 35° off-boresight, allowing the twin radar beams to be steered at angles to the flight path. The science requirements are mainly for dual-polarization capability and a wide bandwidth of operation of up to 200 MHz if possible, but at least 100 MHz with high polarization port isolation and low cross-polarization. The novel design geometry can be scaled with minor modifications up to about four times higher or down to about half the current design frequencies for any application requiring a dual-polarized, wide-bandwidth steerable antenna array.

Posted in: Electronics & Computers, Briefs

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Centering a DDR Strobe in the Middle of a Data Packet

The Orion CEV Northstar ASIC (application-specific integrated circuit) project required a DDR (double data rate) memory bus driver/receiver (DDR PHY block) to interface with external DDR memory. The DDR interface (JESD79C) is based on a source synchronous strobe (DQS\) that is sent along with each packet of data (DQ). New data is provided concurrently with each edge of strobe and is sent irregularly. In order to capture this data, the strobe needs to be delayed and used to latch the data into a register.

Posted in: Electronics & Computers, Briefs

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