Electronics & Computers

Avoid the High Cost of Quality Failure

In this whitepaper, Arena highlights the pertinent best practices for, and benefits of, managing quality as an integrated part of your business to build a culture of collaboration and innovation. Topics covered:

Posted in: Electronics & Computers, White Papers

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Thin Films Self-Assemble in One Minute

Researchers with the U.S. Department of Energy (DOE)'s Lawrence Berkeley National Laboratory (Berkeley Lab) have devised a technique whereby self-assembling nanoparticle arrays can form a highly ordered thin film over macroscopic distances in one minute.

Posted in: Electronics & Computers, Electronic Components, Photonics, Optics, Manufacturing & Prototyping, Materials, Coatings & Adhesives, Composites, Nanotechnology, News

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New Supercapacitor Could Make Structural Energy Storage A Reality

Imagine a future in which our electrical gadgets are no longer limited by plugs and external power sources. This intriguing prospect is one of the reasons for the current interest in building the capacity to store electrical energy directly into a wide range of products, such as a laptop whose casing serves as its battery, or an electric car powered by energy stored in its chassis, or a home where the dry wall and siding store the electricity that runs the lights and appliances. It also makes the small, dull grey wafers that graduate student Andrew Westover and Assistant Professor of Mechanical Engineering Cary Pint have made in Vanderbilt's Nanomaterials and Energy Devices Laboratory far more important than their nondescript appearance suggests.

Posted in: Electronics & Computers, Electronic Components, Power Management, Energy Storage, Energy, Semiconductors & ICs, News

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New Way To Make Sheets Of Graphene Discovered

Graphene's promise as a material for new kinds of electronic devices, among other uses, has led researchers around the world to study the material in search of new applications. But one of the biggest limitations to wider use of the strong, lightweight, highly conductive material has been the hurdle of fabrication on an industrial scale.

Posted in: Electronics & Computers, Electronic Components, Materials, Coatings & Adhesives, Solar Power, Energy, Semiconductors & ICs, News

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Getting the Most Out Of Your Next Generation Digital Security Surveillance System

As current DSS (digital security surveillance) systems more and more demand real-time analytics, operations benefit greatly from clearer and more information-rich video and maximized computing power.

Posted in: Electronics & Computers, White Papers

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CCSDS Telemetry Decoder VHDL Core

Costly ground support equipment can be eliminated. Goddard Space Flight Center, Greenbelt, Maryland A flexible Telemetry Decoder Core (TDC) has been designed to decode Consultative Committee for Space Data Systems (CCSDS) encoded telemetry data. The TDC can be used to eliminate costly ground support equipment by placing the telemetry decoding functions in an inexpensive, commercially available field programmable gate array (FPGA) integrated circuit instead of special-purpose printed circuit boards. The TDC can also be used in the design of telemetry systems by enabling end-toend simulation of these systems’ upfront simulation before any hardware is built. The TDC was developed for the Global Precipitation Measurement (GPM) project and because of its success on that project, it will be used to verify telemetry on the Magnetospheric Multiscale (MMS) project.

Posted in: Electronics & Computers, Briefs, TSP

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Thermal Response of a High-Power Switch to Short Pulses

Simulations are used to calculate temperature changes that occur inside semiconductor switch modules, where measurement is not possible. Army Research Laboratory, Aberdeen Proving Ground, Maryland Semiconductor switch modules composed of Super Gate Turn-Off Thyristors (SGTOs) have been evaluated. The switches are intended to handle kiloamplevel currents and may dissipate peak powers measured in megawatts. Recent experiments measured the response of a switch module composed of eight SGTOs to single-short, high-current pulses. Simulations of those experiments were performed to calculate the temperature changes that occur inside the devices, where measurement is not possible. Worst-case operating conditions in which the switches handle several pulses within the space of 4 or 5 seconds (s) also were simulated. Modeling and simulation were performed with SolidWorks 3D modeling software and SolidWorks Simulation computational fluid dynamics software from Dassault Systèmes.

Posted in: Electronics & Computers, Briefs, TSP

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