Implementing High Density Embedded Computing (HDEC) Solutions

High Density Embedded Computing solutions are solving large data throughput needs in signals intelligence, ground control, and homeland security applications. This guide focuses on how to efficiently implement these technologies including the expanded availability of native PCI Express 3.0 interfaces.

Posted in: White Papers, Defense, Electronics, Electronics & Computers, Electronics & Computers, Software


Full-Wave Matching Circuit Optimization Shortens Design Iterations

Full-wave matching circuit optimization (FW-MCO) is a new technology introduced by Remcom, which combines full wave 3D EM simulation and circuit optimization to solve an age-old RF problem:determining which component values provide the desired match for a given matching network layout.

Posted in: White Papers, Communications, Electronics, Electronics & Computers, Electronics & Computers, Software


Stencil-less Jet Printing for PCB Assembly

Imagineering, Inc. introduces stencil-less Jet Printing to facilitate quick turn around Printed Circuit Board Assembly.

Posted in: White Papers, Electronics, Electronics & Computers


Full RF Signal Chains from 0 Hz to 110 GHz

Analog Devices (ADI) has expanded its RF capabilities in the full signal chain, including companion products, in the full bandwidth from 0 Hz to 110 GHz.This white paper provides examples of the wider frequency spectrum covered by ADI, and explains that true DC is important. Off signal chain performance is also critical, and this paper shows how low-noise, high-stability control and power components are important to overall RF signal performance.

Posted in: White Papers, Electronics, Semiconductors & ICs, Data Acquisition, Sensors, Test & Measurement


Microelectronics Package for Extreme Environments

Anaren’s MSK Products Division designed, built, and tested a high-temperature, co-fired ceramic (HTCC) electronics package for use in oil and gas drilling that proved Anaren’s ability to push the boundaries for developing microelectronics packages to survive in difficult high-temperature environments.

Posted in: White Papers, White Papers, Aeronautics, Defense, Electronics, Electronics & Computers


Development of a Multi-User Modem for Space Telecommunications

This technology has applications in the cellphone industry. NASA’s Jet Propulsion Laboratory, Pasadena, California Efficient support of planetary surface missions typically requires an orbiting asset that acts as a relay point to/from Earth. Orbital relay passes are normally 5 to 15 minutes in duration over any specific landed site. When multiple landed assets are co-located or near-located in the same coverage circle of a single relay orbiter, their telecom relay support opportunities will overlap. This will be the case with cooperative lander missions, a lander-rover operations pair, distributed intelligent lander missions, and future deployment of multiple equipment components for support of complex sample return or manned operations. In these situations, the capability of simultaneous support to multiple landers is very valuable for mission performance and operations flexibility. This technology work enables simultaneous telecom support to multiple landers (Mars, Titan, Europa), and provides single-radio, multi-mode support to Entry, Descent & Landing (EDL) and emergency operations (e.g., demodulation + Open Loop Recording).

Posted in: Briefs, TSP, Electronics & Computers


Wire Bonding to Pads in Tilted Planes

This technique can be used in industries where devices need to be made smaller and lighter, such as medical, aerospace, automotive, and military. NASA’s Jet Propulsion Laboratory, Pasadena, California Scientific imaging arrays need to have their individual imaging elements arranged in a close-spaced mosaic. The typical single imaging element is a silicon chip mounted on a larger support frame. This excess area of the support frame takes away valuable imaging space from the mosaic. This appears as a grid of black (no data) in the overall mosaic image. Making the support frame smaller makes the amount of lost data smaller, and the imaging elements can be spaced more closely together. Eliminating the support frame altogether brings the imaging elements even closer. This is referred to as four-side buttable.

Posted in: Briefs, TSP, Electronics & Computers


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