Electrical/Electronics

Recovering Metals from Electronic Waste

This process dissolves the major metals found in electronics, including materials that have been shredded, magnetically separated, or milled to a particle size less than one millimeter.

End-of-life electronic devices such as smartphones, computers, televisions, and other electronics contain significant amounts of valuable metals including base metals (zinc, tin, lead, nickel, and copper), precious metals (silver, gold, and palladium), and rare earth magnets (neodymium, yttrium, samarium). Some electronic scrap is currently landfilled or incinerated, and there is a need to develop more effective processes to capture these valuable metals along with keeping them out of the environment.

Posted in: Briefs, Electronics & Computers
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Solder Bond Packaging for High-Voltage Pulsed Power Devices

This invention is a superior switching component for pulsed power applications.

The huge demand for switching components exceeding silicon's (Si) current density limitation of 200 A/cm2 has pushed the enhancement of alternative semiconductor materials such as silicon carbide (SiC), gallium nitride, and diamond. The enhanced material properties of SiC, such as high thermal conductivity, large critical field, wide bandgap, large elastic modulus, and high saturation velocity, make it a viable candidate for pulsed power systems. Using SiC would increase both current and power densities, improve dI/dt and dV/dt capabilities, reduce recovery time, and minimize switching losses in various power electronic systems. Furthermore, a significant reduction in the volume and weight of pulsed power systems can be realized by implementing SiC SGTOs, reducing the thermal management requirements of the pulsed power system.

Posted in: Briefs, Electronics & Computers
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Virtual Fabrication and Assembly Documentation

Over the years, the term “virtual” has become associated with many different domains. Virtual machines are now commonplace as a substitute for physical laptops or desktops, allowing for the emulation of computer systems. Of course, virtual reality is in the news daily as new headsets, apps, and games provide a substitute for images and sounds, allowing for the simulation of a three-dimensional environment. In the printed circuit board (PCB) space, some fabrication and assembly information such as artwork, drill, netlist, test, and component placement have been conveyed virtually to manufacturing for more than 30 years.

Posted in: Articles, Electronics & Computers
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Chip-Sized Terahertz Modulator for Faster Data Transmission

This modulator is suitable for THz transmitters/receivers on a single chip.

Tufts University engineers have invented a chip-sized, high-speed modulator that operates at terahertz (THz) frequencies at room temperature and at low voltages without consuming DC power. The discovery could transmit data at significantly higher speeds than currently possible.

Posted in: Briefs, Electronics & Computers
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Applying Wiring Harness Changes Without Damaging Your Electric System Design Flow

When an engineering change must be made to a wiring harness—and let’s face it, there is always going to be late-stage changes—it means you will make a change in multiple design steps. This Tech Talk discusses the challenges of applying changes and how to better handle them. For example, you might need to change an electric component that drives more current than the previous one. A change such as this can cause issues throughout your design flow: System Design, Wiring Design, and the Harness Design. The resulting inconsistencies lead to poor quality and prevent you from achieving your design cycle goals.

Posted in: Tech Talks, Electronics
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Overcoming RF Signal Generation Challenges with New DAC Technologies

This features our new AWG5200, with high signal fidelity and the ability to scale up to 32 or more channels with multi-unit synchronization, all at an affordable price.

Posted in: White Papers, White Papers, Aerospace, Electronics & Computers, RF & Microwave Electronics
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Architectures for Implementing a Hardware-in-the-Loop System

Safety, availability, or cost considerations can make it impractical to perform all the necessary tests with the complete embedded control system. Using hardware-in-the-loop (HIL) simulation, you can simulate the parts of the system that pose these challenges. By thoroughly testing the embedded control device in a virtual environment before proceeding to real-world tests of the complete system, you can maintain reliability and time-to-market requirements in a cost-effective manner even as the systems you are testing become more complex. Download this whitepaper to find out more about implement a HIL system into your test environment.

Posted in: White Papers, Automotive, Electronics & Computers, Test & Measurement
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A Modular Apparatus and Method for Attaching Multiple Devices

This technology improves the real-time monitoring of high-temperature or other harsh environments.

Posted in: Briefs, Electronics & Computers, Electronic equipment, Sensors and actuators, Fabrication, Silicon alloys, Protective structures
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Product of the Month: May 2017

Spectrum Instrumentation Corp., Hackensack, NJ, introduced the DN6.44x, a range of 12 highspeed, 14- and 16-bit LXI-based digitizers with up to 24 fully synchronized channels. The 16-bit ADC models offer sampling rates of either 130 MS/s or 250 MS/s, and the 14-bit units feature sampling rates of 500 MS/s. The units are suitable for applications where arrays of receivers, sensors, detectors, rectifiers, antennas, and other electronic devices are to be used and tested. Each channel is equipped with its own front-end amplifier that features six input ranges (from ±200 mV to ±10 V full scale), switchable input impedance (50 Ω and 1 MΩ), and programmable positive input offset for unipolar signals. Analog bandwidth is as high as 250 MHz (for 500 MS/s models), enabling the units to capture electronic signals in the DC to 200-MHz frequency range. The instruments are equipped with onboard acquisition memory of 512 MSamples per channel, and feature an industrial chassis with integrated cooling, a replaceable dust filter, and low-noise power supplies.

Posted in: Products, Electronics & Computers
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Conquering Radar Signal Generation

This Webinar will focus on the challenges related to the creation and generation of complex radar signals and provide you with some tools to help make this task more efficient. This 60-minute webinar features Tektronix expert Christopher Skach, who will share his insights on the key factors to consider when creating and generating these complex signals.

Posted in: On-Demand Webinars, Electronics & Computers
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