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White Paper: Electronics & Computers

Critical Challenges of BBU and PSU Design in OCP-based Data Centers

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Modern data center architectures, particularly those aligned with the Open Compute Project (OCP), demand far more from power delivery systems than ever before. As compute density increases and rack-level power thresholds rise, there is a need to deliver efficient, scalable, and maintainable power under highly constrained spatial and thermal envelopes. The accelerating adoption of AI/ML workloads, high-density servers, and energy-aware architectures demand agile connector solutions. As compute density increases and rack-level power thresholds rise, there is a need to deliver efficient, scalable, and maintainable power under highly constrained spatial and thermal envelopes.

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Communications Connectivity Electronic Components Electronics & Computers

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Overview

The white paper discusses the evolving challenges in the design of Battery Backup Units (BBUs) and Power Supply Units (PSUs) within modern data centers, particularly those aligned with the Open Compute Project (OCP). As data centers face increasing compute density and higher rack-level power requirements, the need for efficient, scalable, and maintainable power delivery systems has become paramount.

Key challenges highlighted include:

  1. High Current Density: The transition from 12V to 48V systems necessitates connectors that can handle increased current levels without enlarging in size, ensuring efficiency and reducing conduction losses.

  2. Space Constraints: Compact server designs, such as 1U and 2U enclosures, require low-profile solutions that do not compromise airflow or thermal performance.

  3. Modularity and Standardization: Compliance with OCP specifications demands plug-and-play modularity, allowing for easy upgrades and maintenance while adhering to rack-level power delivery standards.

  4. Serviceability: Features like hot-swap capabilities and blind-mate tolerances are critical for minimizing downtime during maintenance.

  5. Thermal and Electrical Reliability: Maintaining low contact resistance and stable impedance over thousands of mating cycles is essential for reliable performance.

Amphenol’s power connector solutions are designed to meet these challenges, offering a range of products optimized for high-density applications. The white paper details various connector systems, including the PwrBlade® series, which supports high-current applications with modular tooling for flexible configurations. Additionally, the document emphasizes the importance of reliable interconnects in ensuring uninterrupted power supply, particularly during outages, where UPS systems and BBUs play a crucial role in conditioning power surges and maintaining data integrity.

Overall, the white paper serves as a comprehensive guide for engineers and designers in the data center industry, outlining the critical considerations for developing robust power distribution systems that can adapt to the demands of modern computing environments.