Review the latest advances and technical briefs in Semiconductor and Integrated Circuit Systems (ICS) technologies essential to Design Engineers. Find new products and applications in semiconductors, electronics, electronic components, electronic circuits, integrated circuits, and ICS.
Is commercial success of autonomous trucks closer than we think?...Caterpillar launches an AI assistant...lifelike simulation automates middle‐mile autonomy. Read these stories and more in...
See what's new on the market, including The Imaging Source's Aptiris, USB 3.1 autofocus cameras designed for dynamic machine vision applications; Würth Elektronik's Proteus-IV and Ophelia-IV components, two new high-performance RF modules based on the latest Nordic nRF54L15-SoC semiconductor; Novotechnik U.S.'s Vert-X 13E Series of touchless rotary sensors; and much more.
Replacing an outdated solution with a next-generation MES can radically improve user experience and eliminate obsolete IT languages, operating systems, and hardware platforms. It can expand functionality in a single system and keep pace with change, supporting the entire processing lifecycle. Read on to learn more.
A new transceiver invented by electrical engineers at the University of California, Irvine boosts radio frequencies into 140-gigahertz territory, unlocking data speeds that rival those of physical fiber-optic cables and laying the groundwork for a transition to 6G and FutureG data transmission protocols. Read on to learn more about it.
Scientists are striving to discover new semiconductor materials that could boost the efficiency of solar cells and other electronics. But the pace of innovation is bottlenecked by the speed at which researchers can manually measure important material properties. A fully autonomous robotic system developed by MIT researchers could speed things up. Read on to learn more.
Researchers at the University of California, Davis recently found that perovskites may enable a new class of light-responsive semiconductor devices. Read on to learn more.
To become a mainstream energy source, solar panels need to become more efficient, and a recent breakthrough by researchers from Kyushu University and Johannes Gutenberg University Mainz may accelerate this progress. Read on to learn more.
This compendium of articles from the editors of Tech Briefs and Aerospace & Defense Technology magazines looks at the latest advances in power electronics and energy storage for applications ranging from...
MIT engineers have developed a technique to grow and peel ultrathin “skins” of electronic material. The method could pave the way for new classes of electronic devices, such as ultrathin wearable sensors, flexible transistors and computing elements, and highly sensitive and compact imaging devices. Read on to learn more.
In a milestone for scalable quantum technologies, scientists from Boston University, UC Berkeley, and Northwestern University have reported the world’s first electronic–photonic–quantum system on a chip, according to a study published in Nature Electronics. Read on to learn more about it.
In a new study, researchers at CU Boulder have used doughnut-shaped beams of light to take detailed images of objects too tiny to view with traditional microscopes. The new technique could help scientists improve the inner workings of a range of “nanoelectronics,” including the miniature semiconductors in computer chips. Read on to learn more.
By folding AI algorithms into a camera’s sensor itself, researchers at the Department of Energy’s Lawrence Berkeley National Laboratory have now eliminated a data-processing bottleneck that has long plagued the performance of spectral imaging technology. The result is an intelligent sensor capable of identifying chemicals and characterizing materials quickly and efficiently. Read on to learn more.
Cornell researchers have used high-resolution 3D imaging to detect, for the first time, the atomic-scale defects in computer chips that can sabotage their performance. Read on to learn more.
How smart actuators are revolutionizing vehicle technology…Qualcomm's superbrains are here to help with automated driving…building smarter safety systems through sensor collaboration. Read...
Caltech scientists have developed a way to guide light on silicon wafers with low signal loss approaching that of optical fiber at visible wavelengths. Read on to learn more about it.
The world’s first automatic and adaptive, dual-mode light-emitting diode (LED)-based optical wireless power transmission system, that operates seamlessly under both dark and bright...
See the products of tomorrow, including a bio-mimetic, light-powered soft lens that mimics the human eye’s ability to refocus and adjust to varying light conditions; a new material for insulating windows that could improve the energy efficiency of buildings worldwide; and more.
Engineers face increasing pressure to design power distribution units (PDU) that can support higher complexity, greater electrification, and stricter safety...
Global energy demands are surging, pushed by energy-intensive data centers powering artificial intelligence and increased manufacturing. How will the world meet these rising energy needs? Read on to find out about one way!
Achieving accurate representations of the interactions at play in MEMS devices requires multiphysics simulation. Check out the following ebook, MEMS Device R&D, for four stories on how organizations around the world are...
In two papers, one released in Nature Materials and a second in ACS Nano, researchers describe a new methodology for fabricating targeted 3D nanoscale structures via self-assembly that can find use in a variety of applications, and they provide a design algorithm for others to follow suit. And it’s all based on the most basic biomolecular building blocks: DNA. Read on to learn more.
To address the staggering power and energy demands of AI, engineers have developed a revolutionary new thin-film material that promises to make AI devices significantly faster while dramatically cutting energy consumption. In this interview, Alamgir Karim, who is leading the research, discusses the new approach, its benefits, and how Nobel Prize-winning chemistry enabled this discovery.
A new study from NC State University combines three-dimensional embroidery techniques with machine learning to create a fabric-based sensor that can control electronic devices through touch. Read on to learn more.
Harvard research breakthrough could speed development of room‐temperature quantum computers…New generation of ultra‐lightweight, high‐res space cameras takes flight…NASA LiDAR advance gives...
The hermetic sealing of electrical and optical feedthroughs is a critical area for assuring the longevity and reliability of devices such as optical assemblies, thermocouples, EV...
The rise of electric vehicles and driver aids along with the proliferation of electronic sensors and safety features point towards continued growth in automotive electronics. Due to their lightweight,...
NVIDIA is bringing Ethernet networking with co-packaged optics to artificial intelligence (AI) factories, enabling scale-out and scale-across on the NVIDIA Rubin platform...
Scientists have long sought to make semiconductors that are also superconducting, thereby enhancing their speed and energy efficiency and enabling new quantum technologies. However,...
