Existing technologies [Loop Heat Pipe (LHP) and passive Thermal Control Valve (TCV)] are integrated and made to work together to provide a passive variable thermal link. The result is a novel LHP with passive TCV that was developed to provide variable heat rejection (turn-down) allowing efficient operation during periods of low dissipation and cold environments, as well as periods of peak loads and warm environments. The thermal control valve installed in the vapor line routes the vapor flow to the radiator during normal operation, or directly to the compensation chamber during periods of cold radiator sink temperatures or low power. The vapor bypassing the condenser cancels the circulation to the radiator, thereby minimizing heat transport and rejection.

Conventional LHPs can provide the required variable thermal conductance needed to maintain the WEB and battery temperature. During the lunar day, the LHP will transfer the thermal load to the radiator for heat rejection. During the 14-day-long lunar night, the sink temperature drops, potentially lowering the LHP and the WEB/battery temperatures. Without a variable thermal link, the LHP will continue to remove heat during the lunar night, cooling the electronics and batteries to unacceptably low temperatures.
An ammonia LHP with TCV is shown in Figure 1, where the TCV is marked with “3.” In addition to the TCV, tubing and valves were added so that the behaviors of the LHP with and without the TCV could be compared. The test plan was as follows:
- Set the power input to the evaporator to 100 W and allow the evaporator temperature to reach a steady state.
- Decrease the condenser temperature in stepwise increments until a steady state of –60 °C is achieved.
- Decrease the power input to the evaporator to 0 W and allow the evaporator to reach a steady state condition.

In a thermal vacuum chamber, this LHP with TCV design demonstrated a heat rejection conductance turn-down capability in excess of 50:1. Current state-of-the-art LHPs can provide variable heat rejection, but at the cost of electrical power required to minimize heat rejection, which makes them unattractive for resource-limited landers and rovers. A major benefit of the LHP with TCV is that it passively provides a variable heat rejection capability, without requiring any electrical power or control to modulate the LHP.
This work was done by John R. Hartenstine, William G. Anderson, and Kara Walker of Advanced Cooling Technologies for Marshall Space Flight Center. For more information, contact Sammy Nabors, MSFC Commercialization Assistance Lead, at

