Tech Talks With Max: Electronic Device Assembly

Max invites you behind the screens of your electronic devices and ventures into the deep dark depths of flip chip underfills. He explains how specific compounds can fill tight spaces and to ruggedize components and improve their performance.

Transcript

00:00:02 hi I'm max master bonds representative for adhesives sealants and coatings I like to welcome you behind the scenes of your electronic devices today we will explore the deep dark depths of flip chip under fills let's go in this electronic application the engineer must find a suitable epoxy compound to fill the gaps between the chip solder balls in circuit board these tiny gaps

00:00:26 actually look pretty big from where I stand master bond offers many flowable systems which allow you to get into every nook and cranny of these crevices for example our latest product development EP 62 dash 1l PSP is an ultra low viscosity formulation so we can get deep into tight spaces additionally it features a long working life at room temperature and it only

00:00:49 requires moderate heat to cure basically to extend the life of your electronic device our adhesive successfully ruggedized the flip chip component for mechanical and thermal stresses masturba doesn't just stop at under fills we have formulations for potting surface mount die attach conformal coating and so much more so give us a call today we'd love to hear about your electronic assembly

00:01:12 application and help you meet your goals