Magazine cover

Here are links to this issue's Features, Tech Briefs, Products and more.

You can download the complete issue.

You can view this issue online.

Don't have an account?

Subscribe to future issues.

Inside this issue


Overview

The February 2026 issue of Tech Briefs magazine comprehensively explores cutting-edge innovations and research across various technology domains, focusing primarily on addressing the challenges posed by rapid advances in artificial intelligence, robotics, and power systems. With a forward-looking perspective, the issue highlights new materials, robotic systems, and industrial applications aimed at enhancing efficiency, performance, and sustainability in tech-driven environments.

A central theme of this issue is the urgent need to mitigate the escalating energy consumption resulting from AI and cloud computing. The magazine features an in-depth article from the University of Houston, spotlighting a revolutionary ultra-thin two-dimensional thin-film dielectric material designed to dramatically reduce the power consumption of AI processors. This advance addresses a critical bottleneck at the chip level by lowering electrical signal loss and heat generation, thus enabling faster, cooler, and more energy-efficient AI hardware. The material, created through self-assembled polymer structures, achieves uniform nanoscale pores that reduce the dielectric constant — a key factor in power consumption. With AI workloads growing exponentially and data centers predicted to consume up to nine percent of U.S. electricity by 2030, this innovation promises to alleviate pressure on power grids, lower carbon footprints, and reduce operating costs, enabling sustainable AI advancement.

Complementing this focus on efficiency, the issue introduces a variety of new products and technologies with practical applications. For example, Altech Corporation’s C-TEC Series of uninterruptible power supplies utilize long-life ultracapacitors instead of traditional lead-acid batteries, offering improved backup power reliability and maintenance-free operation for industrial and IT applications. Other products include HMS Networks’ rugged unmanaged Ethernet switches tailored for industrial environments, Novotechnik’s Vert-X 26 series magnetic angle sensors designed for harsh conditions, and igus®’s injection-molded E1 series energy chains for compact cable management solutions. These innovations enhance the resilience and performance of industrial hardware, reflecting the ongoing push toward robust, scalable systems.

Robotics and automation receive strong coverage, notably through new approaches enabling more intuitive, human-centric robot assistance. Researchers at MIT have developed a novel “Relevance” framework inspired by the brain’s Reticular Activating System, allowing robots to filter sensory data and identify objects or actions most pertinent to human objectives. Demonstrated in scenarios like a conference breakfast buffet, robots using this approach showed up to 90 percent accuracy in predicting human intent and significantly reduced collisions, improving safety and user experience. This groundwork sets the stage for robots that can seamlessly assist in household, workplace, and warehouse contexts, potentially revolutionizing collaborative robotics and human-robot interaction.

In another robotics highlight, the issue discusses biohybrid robots enhanced by artificial tendons made from tough hydrogels developed by MIT. These tendons increase the mechanical power and speed of muscle-based robotic components dramatically, suggesting future applications in adaptable, high-function bio-robots. Additionally, other features showcase light-powered soft robots capable of aerial load transport along predefined tracks and nanosatellite clusters with enhanced real-time monitoring and control capabilities, emphasizing the vast scope of robotic innovation.

The magazine also covers NASA’s continued technological leadership, spotlighting a project from Ames Research Center that evolved a digital infrastructure platform from a NASA flight test. This platform enables data aggregation and management for autonomous air taxis and other vehicles, underpinning smart city infrastructure initiatives. The story highlights the platform’s progression into an agentic, AI-driven tool used globally across diverse fields like agriculture and real estate development, evidencing how space agency research spins off into practical terrestrial applications.

In addition to technology articles, the issue includes insightful discussions on broader industry challenges. An interview with Alamgir Karim from the University of Houston delves into the broader implications of skyrocketing AI power demands, emphasizing the necessity for breakthroughs at the chip materials and fabrication level to sustainably support AI’s future. Karim’s team’s development of the novel thin film dielectric is featured as a prime example of such a breakthrough, potentially enabling orders-of-magnitude improvements in energy efficiency.

The issue also presents a Products of Tomorrow section, featuring promising early-stage innovations such as NASA’s Planetary Accumulation of Dust Sensor (PADS) for space missions, artificial tendons enabling stronger biohybrid robots, and Stanford’s room-temperature quantum optical device made from molybdenum diselenide for quantum communication. These advances demonstrate the breadth of ongoing research and the potential to reshape industries from space exploration to quantum computing.

Overall, the February 2026 edition of Tech Briefs delivers a rich blend of technical insight and practical innovation, with a distinct spotlight on solving the critical energy and efficiency challenges posed by AI, while also advancing robotics, sensor technologies, and smart infrastructure. The issue underscores how interdisciplinary science and engineering — from chip-level materials engineering to machine learning and aerospace applications — converge to create smarter, safer, and more sustainable technological systems for the future.


Features



Tech Briefs



Products



Topics: