Using the Dam & Fill Method to Protect Electronic Components

Get an up-close look at how the dam and fill process works to protect electronic components on a circuit board. This two-step method utilizes a damming compound such as Master Bond  Supreme 3HTND-2DM-1 to create a barrier around the component, while the flowable filler material, EP3UF-1, covers the component for protection.

Transcript

00:00:03 [Music] one of the ways to protect components on a circuit board is by utilizing the dam and fill process the process starts by applying a damming compound such as supreme 3 HT ND - 2 DM - 1 around the component supreme 3 HT ND - 2 DM - 1 is readily dispensed to create a structurally sound barrier this material will not run and will cure in place in

00:00:42 five to ten minutes at 300 degrees Fahrenheit in essence forming a dam after the damming compound has been applied and cured a filling compound such as ep 3 UF - 1 is dispensed to fill the area inside the dam and cover the component to be protected this system cures in 10 to 15 minutes at 300 degrees Fahrenheit and features low shrinkage and high

00:01:08 dimensional stability once cured ep 3 UF - 1 is a specialized low viscosity one part system with a filler that has ultra small particle sizes enabling it to flow even in tiny spaces both supreme 3 HT and D - 2 DM - Juan and ep 3 UF - 1 are thermally conductive electrically insulating compounds and are available for use in syringes for automated or manual dispensing

00:01:40 despite being a two-step process damn and Phil offers the following advantages over glob topping flow of the filling compound is controlled and restricted it can be applied to larger sections of the board filling compound flows better than a glob top allowing better protection underneath and around component for more information contact us to discuss your application

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