White Paper: Information Technology
Powering and Cooling Next-Generation Data Centers
SPONSORED BY: ![]()
The development and use of AI models create demand for new data centers, more data racks, and faster processing speeds, requiring more electricity. High-power, high-density data centers will still rely on a consistent, controlled environment as these increasing power and processing requirements contribute to increased heat. Reliable, effective, and more efficient cooling systems are necessary, and HVAC systems remain important for cooling servers, managing data center humidity, improving airflow, and avoiding hot spots. This white paper presents connector and cable solutions for the increased power and robust thermal management needed for next-generation data centers.
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Overview
The document discusses the advancements in powering and cooling next-generation data centers, particularly in the context of artificial intelligence (AI) applications. As AI technology evolves, the demand for data centers has surged, necessitating more data racks and higher processing speeds, which in turn require significantly more electricity. For instance, while a typical data rack may need 20 to 25 kW, racks designed for AI can demand up to 120 kW, highlighting the increasing power requirements.
TE Connectivity plays a crucial role in addressing these challenges by offering a comprehensive range of connector and cable solutions tailored for high-power, high-density environments. Their products support the entire power flow within data center racks, from AC power connection to the distribution of DC power through vertical busbars. TE’s solutions comply with Open Compute Project (OCP) standards, including the Open Rack version 3 (ORv3) and High Power Rack (HPR) specifications, ensuring efficiency, scalability, and reliability across various designs.
The document emphasizes the importance of effective cooling systems in managing the heat generated by these high-power setups. TE Connectivity has partnered with Cooler Master to develop innovative cooling solutions, such as liquid-cooled power busbar assemblies and immersion cooling technologies, which are essential for maintaining optimal operating conditions in data centers. These technologies aim to improve thermal management and energy efficiency, addressing the challenges posed by increased power and processing demands.
Moreover, TE Connectivity’s products are designed to support various applications, including servers, storage, and switches, with a focus on reducing overall energy consumption. The company collaborates closely with customers to create custom designs that meet specific needs within the OCP framework.
In summary, the document highlights the critical role of TE Connectivity in the evolution of data centers, particularly those focused on AI. By providing innovative power and cooling solutions, TE is helping to meet the growing demands of modern data centers while ensuring efficient and reliable operations. The ongoing collaboration with industry partners and adherence to open-source standards further positions TE as a leader in the data center technology landscape.