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Inside this issue


Overview

The March 2026 issue of Tech Briefs (Vol. 50, No. 3) delivers a comprehensive look at cutting-edge technologies and innovations spanning aerospace, automotive design, power & energy, communications, and more. It combines in-depth feature articles, product spotlights, and industry updates that highlight engineering breakthroughs shaping future technologies.

Cover Story and Features

The cover features NASA’s Artemis II mission—an upcoming crewed lunar flyby that will send four astronauts on a roughly 10-day journey around the Moon before returning to Earth. The issue includes a detailed countdown to Artemis II, capturing the excitement and challenges of space exploration. Additional feature articles discuss the growing role of AI-driven simulation in automotive design, showcasing how artificial intelligence enhances vehicle engineering from concept to production.

A highlight in materials science introduces a breakthrough from McGill University on all-solid-state lithium batteries designed for electric vehicles (EVs). The researchers tackled a key performance barrier—interfacial resistance between ceramic electrolytes and electrodes—by developing a porous ceramic membrane filled with polymer. This advancement promises safer, longer-lasting batteries, ideal for increased EV adoption.

Other featured technologies include Firefly Aerospace’s integration of wireless power receivers for lunar landers, and NASA spinoffs bringing hybrid power solutions to rescue operations. The issue also showcases innovations in lubrication technology for aerospace components, improving reliability in harsh conditions.

Communications and Sensor Technology

A featured study addresses overcoming multipath propagation in wireless communications, a phenomenon that degrades signal quality by causing interference from signals arriving via multiple routes. Engineers at Nagoya Institute of Technology developed a passive metasurface-based filtering system using time-varying mechanisms to suppress these interferences, breaking through conventional physical limits without requiring additional power.

CMOS image sensors from Omnivision equipped with TheiaCel® technology are highlighted for their support on NVIDIA’s DRIVE AGX Hyperion platform, enabling autonomous vehicles to reach Level 4 readiness through scalable AI and sensor integration.

Rohde & Schwarz expanded their RF power sensor portfolio to cover automotive radar frequencies up to 150 GHz, enabling measurement across emerging radar bands critical for next-generation vehicle safety and satellite communications.

Industrial and Power Innovations

The issue details Yokogawa’s release of the SL2000 High-Speed Data Acquisition Unit, a modular and versatile ScopeCorder series instrument engineered to handle both long-term data logging and capture of fast transients, supporting evaluation and testing across various industries.

Keysight Technologies debuted a new range of high-power Automated Test Equipment (ATE) supplies, delivering between 1.5 kW and 12 kW, designed for precise validation of multi-kilowatt devices such as batteries. These enable complex tests like long-duration cycling and state-of-charge emulation for energy systems.

Physicists at the University of Colorado Boulder introduced MOCHI, a mesoporous optically clear heat insulation material for windows that dramatically improves building energy efficiency. Its nearly transparent silicone gel includes air-trapping micro-pores that block heat transfer effectively, potentially revolutionizing sustainable architecture.

Robotics, HMI/SCADA, and Software

Researchers from the University of Washington developed IRIS, a smart interactive ring that houses a miniature camera allowing users to control smart home devices via pointing and clicking. This innovative device bypasses many voice-command limitations, proving faster and more intuitive for adjusting IoT-enabled appliances.

Emerson announced Movicon.NExT™ Version 4.4, an advanced human-machine interface (HMI) and SCADA software platform engineered to strengthen interoperability and flexibility for automation systems across discrete and process manufacturing.

Integration of large language models into autonomous vehicle systems and other AI advancements in test and measurement workflows are also explored, along with webinars slated to educate engineers on data analysis without programming and strategies for multiport VNA measurement architectures.

New Products and Market Updates

Walter’s Drion·tec® D-Spade exchangeable tip drill series now spans diameters up to 31.75 mm and drills holes up to 8× diameter depth. Bosch Sensortec unveiled the BMI423 low-power inertial measurement unit (IMU) that combines a wide measurement range with energy efficiency, optimized for wearables and robotics.

WolfSSL updated security products wolfHSM and wolfBoot to include post-quantum algorithms and FIPS140-3 compatibility, enhancing cryptographic protections for automotive ECUs.

Flir’s new app-enabled iXX-Series thermal cameras, built on the ACE platform and integrated with cloud software, support industrial inspection workflows by combining structured asset data with infrared imaging.

Industry Insights and Webinars

The issue previews upcoming webinars covering topics from rapid data analysis beyond spreadsheet limitations, to advanced AI integration in test and measurement workflows, and strategic considerations for multiport vector network analyzers (VNAs) versus switch matrices.

Also featured is a Q&A with Yilu Liu of Oak Ridge National Laboratory on their Universal Grid-Edge Analyzer, a secure sensing device analyzing U.S. power grid dynamics in real-time, helping operators anticipate grid disturbances and integrate renewable energy sources reliably.

Conclusion

Overall, the March 2026 issue of Tech Briefs provides readers with a well-rounded view of next-generation engineering tools, materials, and systems. From space exploration milestones and automotive AI simulations, to breakthroughs in battery technology, wireless communications, and smart device controls, this edition showcases the diversity and rapid pace of innovation driving the future of technology across multiple sectors.

For more detailed technical insights, product specifications, and contact information, the issue directs readers to the respective organizations and upcoming events, fostering opportunities to engage with the latest engineering advancements.


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