In the fast-paced world of consumer goods and packaging, ensuring product quality and consistency is essential. However, traditional vision systems often struggle with irregular shapes, variable textures, subtle defects, and real-time object tracking — leading to costly errors, waste, and customer dissatisfaction.
This Tech Talk explores how cutting-edge deep learning techniques are revolutionizing visual inspection, robotics applications, and dynamic tracking in packaging environments. Attendees will gain insights into how these advanced AI approaches are replacing conventional machine vision systems, enabling smart sensors and edge devices to detect anomalies, verify packaging integrity, track and trace products in motion, and adapt to evolving product lines with greater flexibility, accuracy, and speed.
Speaker:
Alex Shteinfeld, Sr. Software Engineering Manager, SICK
Alex Shteinfeld is a seasoned engineering leader currently serving as the Senior Software Engineering Manager at SICK. With a strong background in advanced sensor solutions and system integration, Alex plays a key role in driving innovation and operational excellence across SICK’s automation solutions. Throughout his career, he has successfully led cross-functional teams in the development and deployment of cutting-edge sensor systems that enhance safety, efficiency, and productivity in manufacturing and logistics environments. His expertise spans industrial automation, smart factory design, and data-driven process optimization. As an enthusiastic advocate for artificial intelligence, Alex specializes in bridging the gap between AI theory and practical industrial implementation — transforming complex concepts into real-world solutions that deliver measurable impact.
Moderator:
Amanda Hosey, Editor, SAE Media Group
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