Cooling an embedded computing system for military vehicles, weapon systems, and other platforms becomes more challenging every year. The newest generation of COTS modules and AI-centric processors are smaller and more capable than their predecessors. However, these newer designs are susceptible to overheating — especially with some of the newer 3U OpenVPX modules operating within the 50W-75W range, while other GPU and high-end FPGAs can hit the 175W range. These OpenVPX architectures, defined and maintained under VITA standards such as VITA 46 and VITA 48, continue to evolve to support higher power densities and corresponding thermal-management requirements. Thermal loads are ramping up faster than ever.
This 60-minute webinar from the editors of Aerospace & Defense Technology will feature a panel of industry experts discussing new approaches to cooling modern embedded computing systems that are operating inside of today’s aerospace and defense platforms. An audience Q&A session will follow the technical presentation.
Highlights include:
- Key thermal challenges for rugged embedded computing
- Cooling approaches in rugged systems
- The critical role VITA plays in enabling interoperable, standards-based cooling solutions
- High-performance liquid-cooling approaches like 6U VPX LFT that are defined by VITA
Speakers:
David Jedynak, Vice President of Strategic Planning, Curtiss-Wright
David Jedynak is Vice President of Strategic Planning for Curtiss-Wright and a Technical Fellow. Previously, he served as Chief Technology Officer for Curtiss-Wright Defense Solutions for many years and continues to provide technology leadership for the group. David joined Curtiss-Wright in 2008 and has focused his expertise in network-centric systems, COTS solutions, and assured position, navigation, and timing. He actively drives and supports the adoption of modular open standard approach (MOSA) architectures for the defense industry to accelerate technology deployment. Prior to joining Curtiss-Wright, David worked in both the automotive electronics and film industries on the forefront of industry-wide migrations to cutting-edge open-standard digital architectures. He holds a bachelor’s degree in electrical engineering as well as certificates in astronautical engineering and project management, all from UCLA.
Austin Lindquist, Ph.D., Director of Innovation, WOLF Advanced Technology
As the Director of Innovation at WOLF Advanced Technology, Dr. Austin Lindquist leads research and development, rapid prototyping, and new product design for edge computing and AI imaging solutions in aerospace and defense. He joined WOLF in 2024 and previously served as Senior Engineer of Innovation, developing thermal solutions for high-power embedded systems. Austin’s prior experience spans research from automotive thermal system design to implementing quantum algorithms using advanced spectroscopy. His expertise plays a vital role in driving WOLF’s continued success with mission-critical innovation and R&D work. Austin holds a Ph.D. in condensed matter physics from the University of Toronto, where he studied quantum systems.
Moderator:
Amanda Hosey, Editor, SAE Media Group
