On-Demand Webinars: AR/AI

From PCB to Rack: Fastening Technologies for Reliable AI Server Design

SPONSORED BY:

Modern AI servers can contain more than 10,000 fasteners — each one critical to performance, reliability, and serviceability. As computer systems grow denser and more complex, engineers face mounting challenges to ensure mechanical integrity, thermal performance, and ease of maintenance. Common risks include fastener loosening from vibration, thread damage, and failures from over-tightening or poor material selection — and each has the potential to compromise uptime and increase costs.

This 60-minute webinar explores how next-generation fastening technologies are evolving to meet the demands of high-density server environments. Attendees will learn how to mitigate failure modes through smarter fastener selection, improved joint design, and tool-less, vibration-resistant solutions. An audience Q&A session will follow the technical presentation.

Key topics include:

  • Recognizing and mitigating common fastener failure modes in server environments
  • Strategies to reduce assembly complexity
  • Best practices for PCB and electromechanical joint fastening
  • Design considerations and tips for high-density systems

Speakers:

Jesse Atlas, Global Market Manager – Datacom and Telecom, PennEngineering

Jesse Atlas is Global Market Manager for Datacom and Telecom at PennEngineering, where he drives product development and go-to-market strategy for server, switch, and router mechanical hardware. Jesse partners with OEMs and ODMs to navigate the full product lifecycle, from NPI to mass production, aligning engineering execution with global market demand and supply chain readiness.

Dustin Hallenbeck, Director – Engineering, PennEngineering

Dustin Hallenbeck is the Director of Engineering at PennEngineering, where he oversees product design, product development, and engineering support for North America. Dustin is known for his customer-focused approach to engineering and knowledge around self-clinching fasteners for unique applications.

Moderator:

Amanda Hosey, Editor, SAE Media Group

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