Electronics Design & Assembly - May 2020
The latest advances in chip and board-level design and manufacturing are spotlighted in this compendium of recent articles from the editors of Tech Briefs and Aerospace & Defense Technology magazines.
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Overview
The Electronics Design & Assembly Special Report from May 2020 presents a collection of innovative advancements and techniques in the field of electronics, focusing on improving efficiency, performance, and functionality in electronic devices.
One of the standout features is the discovery of new functionality in a two-dimensional material called molybdenum ditelluride, which allows for faster data storage and retrieval on computer chips while simultaneously saving battery life. This advancement is crucial for the development of smart objects that require rapid data processing without excessive power consumption. The ability to stack this material into multiple layers to create memory cells could revolutionize how data is managed in electronic devices.
Another significant development highlighted in the report is a low-energy device designed to rapidly reroute light in computer chips. This innovation represents a major step toward the creation of optical computers that utilize light instead of electricity for processing information, potentially leading to faster and more efficient computing systems.
The report also discusses the importance of time-correlated measurements in confirming the single photon nature of certain light emissions. These emitters are essential for emerging applications in quantum photonics, where deterministic placement and real-time design of quantum emitters can enhance the integration with photonic waveguides and cavities. The use of a nano-imprinting approach for creating large arrays of quantum emitters is particularly noteworthy, as it supports wafer-scale manufacturing of quantum photonic systems.
In addition to these technological advancements, the report covers various manufacturing techniques, including in-house PCB prototyping with additive manufacturing. This method allows for rapid prototyping and testing of printed circuit boards, streamlining the design process and reducing time to market. The report also touches on rad-hard microelectronics designed for space applications, ensuring that electronic components can withstand the harsh conditions of space environments.
Other topics include the use of laser metal printing to enhance cooling in computer chips, the mixing and matching of materials to create new stretchy electronics, and advancements in metallization for silicon carbide (SiC) semiconductors. These innovations are critical for improving the performance and reliability of electronic devices in various applications.
The report also highlights the development of ultra-thin transistors that promise faster processing speeds for computer chips, as well as an improved model for predicting heat loss in gallium nitride semiconductors, which is vital for managing thermal performance in high-power applications.
Overall, the Electronics Design & Assembly Special Report serves as a valuable resource for professionals in the electronics industry, providing insights into the latest trends, technologies, and methodologies that are shaping the future of electronics design and assembly. With a focus on efficiency, performance, and innovative materials, the report underscores the ongoing evolution of the electronics landscape and the potential for groundbreaking advancements in the years to come.
