Test & Measurement - February 2023
From the racetrack to the battlefield to deep space missions, test innovations are improving device and system reliability while speeding time to market. Read about the latest advances – including the laser-based accelerometer for self-driving cars pictured on the cover – in this compendium of recent articles from the editors of Tech Briefs, Aerospace & Defense Technology, and Medical Design Briefs magazines.
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Overview
The February 2023 Special Report on Test & Measurement delves into the evolving landscape of semiconductor manufacturing and testing, particularly in the context of the automotive industry. As vehicles become increasingly autonomous, electrified, and connected, the demand for advanced testing solutions has surged. This report highlights the challenges faced by test equipment manufacturers and engineers in meeting the rigorous requirements of modern automotive technologies.
One of the key themes of the report is the need for speed in product development and delivery. Semiconductor buyers are now presented with a plethora of options from various chip manufacturers, leading to heightened competition. This competition has significantly reduced the time required for product development—from years to just a few months. As a result, clients expect faster turnaround times from their chip providers, which places immense pressure on manufacturers to streamline their processes.
The report emphasizes that while the demand for speed is critical, the complexity of chips has also increased dramatically. Modern chips are expected to integrate more features into the same silicon, which complicates the development, testing, and manufacturing processes. Companies that successfully manage this complexity through effective data and testing strategies can significantly accelerate their time to market. Conversely, those that fail to adapt may face delays and costly redesigns after extensive testing.
In addition to the challenges of speed and complexity, the report discusses the evolving testing requirements in the semiconductor industry. As technology advances, the testing protocols must also adapt to ensure accuracy and reliability. This includes the need for innovative testing solutions that can handle high voltages and currents, particularly in electric vehicles. The report highlights the importance of precision in measurements and the role of advanced technologies in achieving this goal.
Among the featured innovations is a groundbreaking "Lab on a Chip" spectrometer developed by researchers at Oregon State University and Aalto University in Finland. This ultra-tiny spectrometer, which can fit on a microchip and is operated using artificial intelligence, represents a significant advancement in optical spectrometry. Its potential applications range from smartphone cameras to environmental monitoring, showcasing the versatility and impact of miniaturized testing technologies.
The report also includes various application briefs and tech briefs that explore specific advancements in measurement technology. These include a UV-Visible-NIR range microscope-spectrometer, laser-light-based accelerometers, RFID-enabled wireless instrumentation, and bio-friendly sensors for temperature measurement. Each of these innovations contributes to the broader goal of enhancing testing capabilities across different sectors.
In conclusion, the February 2023 Special Report on Test & Measurement provides a comprehensive overview of the current state of semiconductor testing and measurement technologies. It underscores the critical balance between speed and complexity in product development, the evolving testing requirements, and the innovative solutions that are emerging to meet these challenges. As the automotive industry continues to advance, the insights and technologies discussed in this report will play a vital role in shaping the future of testing and measurement.
