RF & Microwave Electronics - October 2023
From the battlespace to outer space, RF electronics are at the heart of new mil/aero solutions. Read about the latest innovations in this compendium of articles from the editors of Aerospace & Defense Technology and Tech Briefs magazines.
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Overview
The October 2023 Special Report on RF & Microwave Electronics provides a comprehensive overview of the current trends, challenges, and innovations in the field of radio frequency (RF) and microwave technologies. It emphasizes the critical role these technologies play in various applications, particularly in the context of 5G networks and military operations.
One of the key highlights of the report is the discussion on Non-Terrestrial Networks (NTN), which aim to eliminate global coverage gaps. These fifth-generation (5G) cellular networks are not only pivotal for commercial applications but also for mission-critical communications in military settings. The report underscores the importance of RF system measurement science in ensuring the performance of NTN equipment. It advocates for the use of virtual engineering to expedite the development and deployment of networks, allowing for effective simulation and emulation to verify performance and support future advancements.
The report also addresses the evolving needs of the Department of Defense (DoD) as it prepares for modern battlefield requirements. The focus is on emerging technologies that facilitate all-domain operations, including cyber and electromagnetic spectrum management. The DoD is keen on integrating smaller, cost-effective solutions into future weapons systems, which necessitates innovation in RF miniaturization and the integration of RF and digital controls within compact packages. This integration is crucial for enhancing the capacity of systems to accommodate more transmit/receive channels while managing the complexities that arise from such densification.
A significant theme throughout the report is the need to break down the silos that traditionally separate RF and digital engineering teams. The report argues that collaboration between these teams is essential for creating unified solutions that meet the demands of modern applications. It calls for a new approach to design, materials, packaging, and manufacturing processes to overcome the limitations of traditional Integrated Microwave Assemblies (IMAs), which often lack digital control circuitry due to isolation issues.
In addition to these overarching themes, the report includes application briefs that provide insights into specific technologies and challenges. For instance, it discusses the qualification of multi-channel direction-finding radar receivers and the unique RF interconnect requirements for ultra-demanding applications such as hypersonic missiles and satellites. These briefs highlight the critical nature of RF cable assemblies in mission-critical scenarios, emphasizing the need for robust and reliable interconnect solutions.
Overall, the Special Report serves as a valuable resource for professionals in the RF and microwave electronics field, offering insights into the latest advancements, challenges, and strategies for innovation. It emphasizes the importance of collaboration, technological integration, and the need for continuous evolution in design and engineering practices to meet the demands of an increasingly complex and interconnected world. As the industry moves forward, the report suggests that embracing these changes will be vital for success in both commercial and defense applications.
