Powering the Future: NGMM Sparks a New Era in U.S. Microelectronics

The Next-Generation Microelectronics Manufacturing (NGMM) program is launching the first national center dedicated to advancing U.S.-based 3D heterogeneous integration (3DHI), a game-changing technology for future microelectronics. By enabling rapid prototyping and uniting diverse materials, devices, and circuits through advanced packaging, NGMM aims to secure U.S. leadership in next-gen tech and build a self-sustaining hub for 3DHI innovation and pilot production.