University of Utah engineers devised a new way to slice thin wafers of the chemical element germanium for use in the most efficient type of solar power cells. The new method should lower the cost of such cells by reducing the waste and breakage of the brittle semiconductor. Primarily used on NASA, military, and commercial satellites, germanium- based solar cells may become competitive with less efficient, but less expensive silicon-based solar cells for uses on Earth.
The new method for slicing solar cell wafers - known as wire electrical discharge machining (WEDM) - was shown to waste 22% less germanium than the conventional wire saw method, and produce more wafers. The method uses an extremely thin molybdenum wire with an electrical current running through it. It has been used previously for machining metals during tool-making.
