Tech Briefs - February 2019 - Vol. 43 No. 2

Overview

The February 2019 issue of Tech Briefs, Volume 43, No. 2, presents a comprehensive overview of the latest advancements and trends in technology, particularly focusing on electronics design, innovative materials, and significant developments in various engineering fields.

Key Highlights:

1. NASA's Lunar Landers Initiative: The issue opens with an announcement from NASA regarding its plans to collaborate with American companies to develop reusable systems for landing astronauts on the Moon. This initiative aims to fund industry-led development and flight demonstrations of lunar landers, supporting critical studies and risk reduction activities to advance technology requirements. The goal is to enhance the capabilities for future lunar missions, emphasizing the importance of public-private partnerships in space exploration.

2. CES 2019 Insights: The magazine features highlights from the International CES 2019, where over 4,500 exhibitors showcased innovations in artificial intelligence, health monitoring, and robotics. Notable advancements included AI applications in famine forecasting and improvements in robotic capabilities, such as enhanced performance in ping pong. The coverage underscores the growing intersection of technology and everyday life, showcasing how these innovations can address global challenges.

3. Ultrafast Memory Devices: A significant feature discusses the development of ultrafast memory devices that utilize hybrid technology combining light and magnetic hard drives. Researchers at the Eindhoven University of Technology have created a method using ultra-short light pulses to write data directly into magnetic memory. This approach promises to enhance data storage efficiency and speed, addressing the limitations of traditional magnetic hard drives.

4. Electronics Design Executive Forum: The issue includes an Executive Forum where industry leaders share insights on the evolving landscape of electronics design. Topics discussed include miniaturization, the Internet of Things (IoT), and green manufacturing practices. The executives provide perspectives on the challenges and opportunities facing the electronics industry, emphasizing the need for innovation and sustainability.

5. Innovative Materials: The magazine features a special section on materials and lightweighting, highlighting advancements such as:

   • Nanocardboard: A new material that recovers its shape after bending, showcasing potential applications in packaging and product design.
   • Resin Transfer Molding (RTM) 370: A high-temperature resin designed for demanding applications, enhancing the performance of composite materials.
   • Electrically Conductive Carbon: A lightweight and strong material that could revolutionize various applications, including electronics and structural components.

6. Manufacturing Techniques: The issue also covers innovative manufacturing techniques, such as a scalable process for creating spools of graphene and a method that improves the even delivery of ink in inkjet printers. These advancements highlight the ongoing efforts to enhance manufacturing efficiency and product quality.

7. Sensors and Software Innovations: The magazine discusses various sensor technologies, including a self-powering sensor using a nano-energy harvester and ultrasensitive chip-based sensors. Additionally, it features software solutions for complex mold design and rocket nozzle side-load analysis, showcasing the integration of software and hardware in modern engineering.

8. Application Briefs and Solutions: The issue includes application briefs that provide insights into specific technologies and their practical applications. Topics range from electromagnetic interference solutions to advanced manufacturing processes, offering readers a glimpse into the real-world implications of the technologies discussed.

9. Upcoming Events and Contests: Looking ahead, the March issue is set to feature special coverage on materials and lightweighting, along with a preview of the SAE WCX19 World Congress Experience. The magazine will also kick off the 2019 Create the Future Design Contest, highlighting innovative designs and inventions from previous winners.

In summary, the February 2019 issue of Tech Briefs serves as a valuable resource for engineers, designers, and technology enthusiasts, providing insights into the latest trends and innovations across various fields. From NASA's lunar exploration efforts to cutting-edge materials and manufacturing techniques, the issue encapsulates the dynamic nature of technology and its potential to shape the future. Readers are encouraged to engage with the content and explore the highlighted advancements that are driving progress in the engineering and technology sectors.