Multiphysics Modeling and Simulation

COMSOL Multiphysics® version 5.5 multiphysics modeling and simulation software from COMSOL, Burlington, MA, features a Design Module with a new sketching tool for easier creation and parametric control of geometry models. The Porous Media Flow Module gives users a range of transport analysis capabilities for porous media. The Metal Processing Module makes metal phase transformation analysis accessible within the COMSOL Multiphysics environment.

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Machine Simulation

CGTech, Irvine, CA, released VERI-CUT 9.0 3D solids-based CNC machine simulation and optimization software. It detects errors, potential collisions, or areas of inefficiency and depicts multiaxis milling/drilling as well as multi-axis turning and combination mill/turn machining. It operates independently but can also be integrated with leading CAM systems. Inefficient motion or programming errors that could potentially ruin a part, damage the fixture, or break the cutting tool can be corrected before the program is run on a CNC machine tool.

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3D Printing Platform

The Essentium High Speed Extrusion (HSETM) 3D printing platform from Essentium, Austin, TX, is designed for large-scale additive manufacturing. It uses electrostatic discharge (ESD)-safe 3D printing material that protects electrostatic-sensitive devices in electronics manufacturing, oil and gas, and aerospace. The platform offers print speeds greater than 500 mm a second by utilizing a non-slip, high-torque extruder system and linear motor.

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Adapter Boards

ACCES I/O Products, San Diego, CA, announced the 104e-mPCIe family of PCIe/104 carrier modules. The adapter boards allow users to install PCI Express Mini Cards (mPCIe) into new and existing PCIe/104 embedded systems. The boards are Type 1 or Type 2 PCIe/104 carrier boards designed to support up to four PCI Express mini cards in either half or full lengths. The advanced model converts one PCIe x1 lane from the PCIe/104 stack into four mPCIe sockets, while the standard version converts four PCIe x1 lanes from the stack into four mPCIe sockets.

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Pico Technology, Tyler, TX, introduced the PicoScope 9404-16 SXRTO, a 16-GHz, sampler-extended, real-time oscilloscope. It features four high-resolution, 12-bit channels, each supported by real-time sampling to 500 MS/s per channel and up to 5 TS/s (0.2 ps) equivalent-time sampling. The wideband inputs can display and measure transitions as fast as 22 ps and pulses and impulses down to 45 ps wide. The USB-controlled instrument is supplied with PicoSample 4 software that controls the instrument and presents waveforms, measurements, and statistics.

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UnitedSiC, Princeton, NJ, released the UF3C1202150K4S 1200-V SiC field-effect transistor (FET) device that offers typical on-resistance of 150 m |. With a maximum operating temperature of 175°C, the FET offers reverse recovery, low gate charge, and low intrinsic capacitance. The ESD-protected, 4-pin Kelvin package avoids gate ringing and false triggering. This device is suited for electric vehicle charging, photovoltaic inverters, switch mode power supplies, motor drives, and induction heating.

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Tektronix, Beaverton, OR, introduced the 6 Series low-profile 4-channel digitizer with up to 8-GHz bandwidth, 25-GS/s sampling rate, and a 12-bit ADC on every channel. It is available in multiple bandwidth options ranging from 1 to 8 GHz. Analog-to-digital converter (ADC) and Digital Down Conversion (DDC) signal paths allow users to acquire 2 GHz of RF capture bandwidth.

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Thin-Film Resistors

Stackpole Electronics, Raleigh, NC, offers RNCF AEC-Q200-qualified thin-film resistors available in tolerances down to ±0.01% and ±5 PPM temperature coefficient. Resistance values range from 24.9 ohm up to 49.9K ohm in sizes 0402, 0603, 0805, 1206, and 2512. They are suited for medical monitoring, precision controls, and avionics.

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Battery Holder

Keystone Electronics Corp., New Hyde Park, NY, introduced the Vibra-Fit vertical-mount coin cell holder.

The device allows for top entry of 2032, 2025, or 2x 2016 lithium batteries.

The holder is designed to retain cells securely under shock and vibration.

Features include tin-plated brass contacts for low-contact-resistant and simplified thru-hole mounting on PCBs.

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Pressure Sensors

Bourns, Riverside, CA, offers the Model BPS140 pressure sensors based on MEMS technology. They can handle high pressure ranges (15 to 500 PSI) even at high temperatures. The sensors’ structure is combined with back-side pressure measurement that minimizes the number of media-sensitive wetted materials, ensuring that the measured media only touches the back side of the measurement element. The sensors work in a temperature range of -40 to 150 °C.

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Proximity Sensors

Omron Automation Americas, Hoffman Estates, IL, offers E2E NEXT proximity sensors that include an enhanced sensing distance to minimize target contact during production. IO-Link functionality enables the sensors to indicate the location and cause of failures in real time. They can also detect warning signs of impending failures and notify users via the network.

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AC-DC Converter ICs

Power Integrations, San Jose, CA, offers gallium nitride (GaN)-based InnoSwitch3 AC-DC converter ICs.

The components combine primary, secondary, and feedback circuits in a single surface-mounted package.

GaN switches replace silicon high-voltage transistors on the primary side of the IC.

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