New on the Market

Wafer Management System

The Industrial Metrology Business Unit of Nikon Corporation, Brighton, MI, has released the automatic wafer measurement system NEX-IV VMZ-NWL 200 to solve the challenges of wafer metrology in the semiconductor back-end process, where more work is traditionally carried out manually than in front-end process control. It automatically measures 6-inch or 8-inch wafers held in a carrier according to a measurement program.

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CNC Jig Grinder

The high-performance Model J350G jig grinder from Mitsui Seiki, Franklin Lakes, NJ offers a combination of application flexibility, accuracy, and reliability. The machine’s grinding infeed stroke is the largest available among competing machines, with a U-axis range of -3 mm to +50 mm relative to the spindle center. This provides the flexibility to grind small and large diameter holes, as well as multiple features, using a single wheel in a continuous, automatic mode.

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Planetary Reducer

DieQua Corporation, Bloomingdale, IL, a manufacturer of solution-based mechanical integration solutions and components such as motion control reducers, power transmission solutions, and screw jack systems, has announced the release of their PHCH-Planetary Reducer, designed for packaging machinery applications. It has eight single stage ratios, 3:1 through 10:1, and 13 double stage ratios 15:1 through 100:1, with torque capacity through 600 Nm.

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Mechanical Pushbutton

SCHURTER, Santa Rosa, CA, is extending its MSM momentary pushbutton switch series to include the MSM II, which uses a subminiature microswitch. It provides a shallower mounting depth for switching currents from 100 mA to 3 A for SPDT and DPDT circuits. It features increased ESD resistance (contact: ± 8kV; air: ± 15kV), increased impact resistance IK 08, and a wider temperature range from -30 °C to +85 °C.

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Hazardous Location Position Sensor

Newtek Sensor Solutions, Pennsauken, NJ, is offering its HL-750 series of Intrinsically Safe Position Sensors to monitor valve position in the harsh and hazardous environments of chemical plants. They provide highly accurate displacement feedback to determine if valves are properly opened/ closed, leaking, or even failed. With stainless-steel construction and ¾” hermetic seals, these AC-operated position sensors are certified for use in Class 1, Zone 0, Zone 1, and Zone 2 locations.

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3D-MID Component Carrier

The 3D Mechatronic Integrated Device (MID) Chip Carrier from HARTING, Biel, Switzerland, addresses challenges such as vertical placement of electronic components. They are smaller, lighter, and easier to manufacture than piggyback PCBs — they can be processed fully automatically with SMT machines. They can also be used as adapters for alternative packaging, adapting the footprint of the alternative package to the footprint of the original component.

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Power Stage IC

ROHM Semiconductor, Santa Clara, CA, announced the BM3G0xxMUV-LB series of power stage ICs with built-in 650V GaN HEMTs and gate drivers. The devices are ideal for primary power supplies. The difficulty of handling the gate of GaN HEMTs compared to silicon MOSFETs, however, requires the use of a dedicated gate driver. As a solution, ROHM developed power stage ICs that integrate GaN HEMTs and gate drivers into a single package.

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HPLC Column Oven

HPLC Column Oven Model CO20 from Torrey Pines Scientific Carlsbad, CA has a temperature range from room temperature to 90.0 °C readable and settable to 0.1 °C. The PID temperature control software regulates temperatures to ±0.1 °C. Temperature accuracy and stability are ±0.1 °C. A stable temperature indicator lamp on the front panel lights when the target temperature is stable to within ±0.2 °C.

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Programmable Temperature Transmitter

AutomationDirect, Cumming, GA, has added the ProSense XTD2 series DIN rail-mounted and XTH2 head-mounted universal programmable temperature transmitters to their lineup of temperature transmitters/signal conditioners. They can be used with a variety of sensor and process inputs and provide a linearized two-wire current loop output that can be configured for 4 to 20 mA or 20 to 4 mA using the free ProSense field device configuration software.

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Non-Isolated Flyback Switcher ICs

Power Integrations, San Jose, CA, has introduced the Link-Switch™-XT2SR family of off-line, constant-voltage (CV), non-isolated flyback switcher ICs. They feature exceptionally high efficiency of up to 90 percent for small open-frame power supplies. With no-load consumption below 5 mW, they surpass the requirements of the European Union’s Energy-Related Products (ErP) Directive for standby power consumption. They deliver 250 mW to the load within the 300 mW ErP allowance.

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Sintering Paste

MacDermid Alpha, Waterbury, CT, is adding Argomax^® 2141, to their portfolio. It is ideal for sintering large packages or components on gold or silver substrates. A key advantage is its firm attachment to the inverter, and ability to cope with marginal component surfaces. Utilizing a pure silver bond line, the dispensable silver sintering paste exhibits excellent bond line thickness and adhesion. It delivers excellent performance and reliability for inverters in extreme temperature swings.

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Hardware-Accelerated Oscilloscope

Keysight Technologies, Santa Rosa, CA, announces the expansion of its portfolio of Infiniium oscilloscopes with the new, hardware-accelerated Infiniium MXR B-Series, offering automated analysis tools, enabling engineers to find anomalies quickly and shorten time to market. It has built-in, automated debug tools such as zone triggering, fault detection, real-time spectrum analysis, and a 50 MHz waveform generator. In addition, the MXR B-Series offers eight instruments in a single comprehensive, benchtop solution.

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Wireless Drive Shaft Torque Measurement

Kistler, Winterthur, Switzerland, has developed a torque measuring system for automotive drive shafts that features wireless data transmission. The transmitter is attached to the shaft via adapter sleeves, which allows users to remove the unit to change and recharge the batteries or reuse the transmitter on another vehicle. The receiver unit can process inputs from two transmitters and receive the signal of the type CWPT wheel pulse transducer to directly measure wheel speed, acceleration, and calculate power.

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Touch Technology Chip

The AX54A chip from TouchNetix, Trondheim, Norway, has been selected for the newly released KIA EV9 electric SUV. The chip enables a row of surface touch buttons, with a hidden back-lighted smart surface on the dashboard, actuated by touching. Its patented force sensing technology provides an additional layer of functional safety during user interaction. The single chip technology enables touch, force sensing, and haptic triggering, all integrated in a single chip.

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