AR Waveguide Testing
TRIOPTICS (Munich, Germany) has introduced the new ImageMaster® PRO AR Reflection waveguide testing solution. It offers manufacturers and integrators a comprehensive solution for the image quality validation of optical components for augmented reality (AR) applications. Using a conoscope as core technology in the system, the image details are captured using a wide field of view (70° × 52.5°). It is capable of functioning as either a standalone instrument or integrating seamlessly into existing production processes. This includes robot sample handling and the system can be flexibly adapted to changing requirements. The system is capable of a wide range of measurement parameters including Modulation Transfer Function (MTF), Effective Focal Length (EFL), Virtual Image Distance (VID), Distortion, Uniformity, and Chief Ray Angle (CRA). Its 8 degrees of freedom enable comprehensive scanning of the sample under test, covering the complete field of view, eye-box, and focus adjustments.
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CLS Clock Laser System
The rapid evolution of quantum computing and optical clocks has precipitated a demand for an unparalleled degree of stability, pushing the boundaries of contemporary laser technology. TOP-TICA’s (Bayern, Germany) Clock Laser System (CLS) has been developed to address these challenges. The system is capable of a wide range of measurement parameters including Modulation Transfer Function (MTF), Effective Focal Length (EFL), Virtual Image Distance (VID), Distortion, Uniformity, and Chief Ray Angle (CRA). Its 8 degrees of freedom enable comprehensive scanning of the sample under test, covering the complete field of view, eye-box, and focus adjustments. Featuring diode lasers with an ultra-narrow linewidth below 1 Hz, stabilized to high-finesse optical ULE cavities, the CLS achieves exceptional frequency stability far beyond 1-second integration time.
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Mini Hexapod
Aerotech Inc. (Pittsburgh, PA) has introduced the HexGen® HEX150-125HL Miniature Hexapod, a six degree-of-freedom (DOF) precision positioning system. This compact, cost-effective hexapod, with a 150 mm base diameter and a nominal height of 125 mm, achieves minimum incremental motion to 15 nm and payload capacity up to 12 kg for applications requiring multi-DOF motion – especially those with constricted operational environments. HEX150-125HL’s advanced features and capabilities include maximum speeds up to 30 mm/s and 30 °/s, a robust design and superior peak-to-peak repeatability over a large travel range. Its minimalistic two-cable connectorization design allows for easy installation and straightforward integration with our motion controller – ultimately enabling seamless coordination with other motion axes.
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5D Imaging Module
Teledyne e2v (Chelmsford, UK) announced its new Optimom™ 5D turnkey imaging module. The new imaging module features the recently announced Topaz5D™ image sensor, a compact board, standard connector, and a pre-assembled lens. This comprehensive board-level vision extension seamlessly integrates full-HD 2D vision with the generation of 3D depth data. It excels in challenging light conditions enabling the delivery of 3D objects or human visualization based on the detected contrast. Teledyne e2v’s Optimom 5D imaging module features an innovative 2 Megapixel resolution, 2.5 µm global shutter pixel image sensor with unique angular sensitive pixels. It is the first commercially available module to affordably offer this new type of 3D vision technology.
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Optical Transceiver Analyzer
Coherent Corp. (Santa Clara, CA) announces the introduction of a set of pluggable optical transceivers optimized for use in data centers that incorporate optical circuit switches (OCSs). OCSs are being increasingly adopted in artificial intelligence (AI) and machine learning (ML) applications to reduce cost, latency, and power consumption of these architectures, but the OCS introduces up to 3 dB additional insertion loss beyond what was envisioned in the standards that typically define these transceivers. Coherent has adapted three of the most relevant optical standards to produce transceivers that meet the original IEEE-defined network insertion losses in addition to the insertion losses caused by an OCS.
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Extreme ULE Glass
Corning (Corning, NY) has unveiled Corning® EXTREME ULE® Glass, a next-generation material that will support chip manufacturers in meeting the rapidly growing demand for advanced and intelligent technologies. The new material will help chipmakers improve photomasks – the stencils for chip design – which are critical for the mass production of today’s most advanced and cost-efficient microchips. Corning designed EXTREME ULE® Glass to withstand the highest intensity extreme ultraviolet (EUV) lithography, including high numerical aperture (High NA) EUV, which is rapidly becoming an industry standard. EUV lithography allows manufacturers to use the most advanced photomasks to pattern and print the smallest, most complex chip designs. This process requires extreme thermal stability and a uniform glass material to help ensure consistent manufacturing performance.
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VisiLED Controller
SCHOTT (Mainz, Germany) expands its portfolio for microscopy applications with the launch of the VisiLED Controller MC-D 1100. The fully digital controller integrates the direct LED illumination of the VisiLED series into professional microscopy systems. The VisiLED series is a modular LED-based illumination system developed by SCHOTT specifically for stereomicroscopy. The series offers various controllers, light heads, and a wide range of accessories for a variety of applications. The new controller has been developed especially for system integrators and enables VisiLED light heads to be integrated into individual software environments. The MC-D 1100 provides precise and flexible illumination control for stereomicroscopy.
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LiDAR Sensor on Chip
Voyant Photonics (New York, NY) announced the availability of “CARBON” FMCW LiDAR sensor, featuring the world’s first truly effective and affordable LiDAR on a chip with solid state beam steering. Carbon’s highly integrated silicon photonic chip is fingernail-sized and provides high-resolution, millimeter precision, object detection and static/dynamic segmentation up to 200m – All that, at a fraction of the cost of current best in class LiDAR makers. Voyant has achieved this exceptional performance and affordability by integrating optics on a LiDAR photonic integrated circuit (PIC). This low-cost 4D LiDAR sensor was developed to revolutionize machine perception capabilities in industrial, robotics and security applications.
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6-Axis Hexapod
PI’s (Auburn, MA) new H-815 High Precision 6-Axis Hexapod is a compact and robust, parallel kinematic motion system engineered for continuous 24/7 operation in industrial environments. Designed for high-precision alignment tasks, it offers six degrees of freedom (6-DOF) — X, Y, Z, pitch, roll, and yaw — providing exceptional flexibility for applications that demand high accuracy across multiple independent axes. With a low-profile design (155 mm height, 222 mm baseplate diameter) and a 10 kg load capacity, the H-815 integrates seamlessly into existing production lines while maintaining robust performance in various orientations. Unveiled at Photonics West 2025, this hexapod is ideal for camera lens alignment, micro-assembly, fiber optic alignment, and other demanding precision tasks.
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High-Thrust Direct Drive Linear Motor
IKO (Parsippany, NJ) announced its LT170H2 direct drive linear motor stage for dynamic applications such as semiconductor fabrication which require high thrust forces and long strokes. This latest addition to the LT family of linear motor stages delivers 260N of rated force and up to 500N maximum, exceeding the thrust ratings of previous LT stages and expanding the linear stage series’ range of suitable applications — especially those that involve positioning heavy objects in tight spaces. Its redesigned linear motor leverages direct drive technology that is free of mechanical power transmission parts that can otherwise hinder positioning accuracy. The LT170H2 also comes with C-Lube linear bearings for guidance. Together, they allow the positioning stage to achieve higher thrust forces and high speeds with exceptional precision.
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InGaAs PIN Photodiodes
Hamamatsu Photonics (Bridgewater, NJ) has introduced their new InGaAs PIN photodiodes, G17190/G17191/G17192/G17193 series. A surface-mount ceramic package type has been added to the lineup of InGaAs PIN photodiodes for long wavelengths (up to 2.6 μm). The new product offers the same low dark current as conventional metal package products, and its small size makes it suitable for installation in hand-held devices and mobile equipment. The lineup includes 4 different sensitivity wavelength ranges and 3 different photosensitive area sizes in the same shape. The new photodiodes are compatible with lead-free reflow soldering.
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