The new assembly temperatures make the HV14 compatible with eutectic gold-tin (AuSn) solder - the industry standard process for packaging optoelectronic devices that require tight tolerances. AuSn solder provides excellent joint strength, strain resistance, and thermal conductivity. Specific applications include laser diodes, semiconductor optical amplifiers, and sensors.
At 85°C, the HV14 operates at a maximum of 2.7V and can pump 1.7 watts of heat in a footprint of only 3mm². The module can create a temperature differential of up to 50°C between its hot and cold sides, making it suited for the cooling and temperature control of optoelectronic devices.
