A paper discusses the successful development of a miniaturized radiation hardened high-voltage switching module operating at 2.5 kV suitable for space application. The high-voltage architecture was designed, fabricated, and tested using a commercial process that uses a unique combination of 0.25 μm CMOS (complementary metal oxide semiconductor) transistors and high-voltage lateral DMOS (diffusion metal oxide semiconductor) device with high breakdown voltage (>650 V). The high-voltage requirements are achieved by stacking a number of DMOS devices within one module, while two modules can be placed in series to achieve higher voltages.
Besides the high-voltage requirements, a second generation prototype is currently being developed to provide improved switching capabilities (rise time and fall time for full range of target voltages and currents), the ability to scale the output voltage to a desired value with good accuracy (few percent) up to 10 kV, to cover a wide range of high-voltage applications. In addition, to ensure miniaturization, long life, and high reliability, the assemblies will require intensive high-voltage electrostatic modeling (optimized E-field distribution throughout the module) to complete the proposed packaging approach and test the applicability of using advanced materials in a space-like environment (temperature and pressure) to help prevent potential arcing and corona due to high field regions.
Finally, a single-event effect evaluation would have to be performed and single-event mitigation methods implemented at the design and system level or developed to ensure complete radiation hardness of the module.
This work was done by Philippe C. Adell, Mohammad Mojarradi, Linda Y. Del Castillo, and Tuan A. Vo of Caltech for NASA’s Jet Propulsion Laboratory. NPO-47784
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Rad-Hard, Miniaturized, Scalable, High-Voltage Switching Module for Power Applications
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Overview
The document outlines the development of a Rad-Hard, Miniaturized, Scalable High-Voltage Switching Module for power applications, spearheaded by NASA's Jet Propulsion Laboratory (JPL). The project aims to address the need for high voltage DC power supplies ranging from 1 kV to 30 kV, which are essential for various space applications, including image detectors, mass spectrometers, and ion propulsion systems. Current high voltage solutions are typically bulky, designed for fixed output voltages, and lack the modularity and scalability required for modern missions.
The project emphasizes a reliability-by-design approach to create high voltage modules that are not only compact and lightweight but also radiation-hardened (rad-hard) to withstand the harsh conditions of space. The first generation of the high voltage module was successfully developed using chip-on-board technology, achieving functionality at 2.5 kV. This module was tested in ambient conditions and demonstrated proof-of-concept, paving the way for further advancements.
Key objectives include the design and fabrication of DMOS devices capable of operating above 500 V, with a focus on radiation hardness. The document details the experimental results, including the successful testing of a first-generation DMOS device that showed total dose hardness up to 15 krad, with plans for a second generation targeting 100 krad. The methodology involves stacking multiple modules to achieve higher voltage and power applications, with a focus on minimizing size and weight.
The document also highlights the challenges faced in utilizing standard CMOS processes for developing these high voltage modules, particularly concerning device reliability, packaging, and material integrity under radiation exposure. The proposed guidelines aim to facilitate the design and fabrication of reliable, rad-hard, miniaturized high voltage modules suitable for future space missions, such as next-generation Cloudsat and Chemin.
In summary, this document presents a comprehensive overview of the innovative efforts at JPL to create scalable, reliable, and efficient high voltage power supplies for space applications, addressing a critical gap in current technology and ensuring the success of future aerospace missions.
