Product Focus: A Suite of Electrical, Mechanical, and Thermal Solutions by Indium Corporation

Battery & Electrification INSIDER

A novel Pb-free alloy that enables lower processing temperatures in preform soldering compared to SAC alloys. (Indium Corporation)

Indium Corporation will feature its Rel-ion™ suite of electrical, mechanical, and thermal solutions to reduce EV manufacturers’ time to market. Some of the products to be showcased include Indalloy^®301 LT Alloy, the Durafuse^® LT, the Indium8.9HF Solder Paste Series, and Heat-Spring^®solutions.

Indalloy^®301 LT Alloy for Preforms/InFORMS^® is a novel Pb-free alloy that enables lower processing temperatures in preform soldering compared to SAC alloys. Specifically designed for power module applications, this alloy prevents warpage in package-cooler attach scenarios without sacrificing reliability like traditional bismuth-containing low-temperature alloys. It is available in preforms, ribbon, or InFORMS^®.

The Durafuse^® LT is a novel solder paste mixed alloy system with highly versatile characteristics that enable it for energy savings, high-reliability, low-temperature, step soldering, and assemblies with large temperature gradients. It also provides superior drop shock performance as compared to conventional low-temperature solders, outclassing BiSn or BiSnAg alloys, and performing better than SAC305 with optimum process setup.

The Indium8.9HF Solder Paste Series, an industry-proven solder paste series that delivers no-clean, halogen-free solutions designed to achieve high surface insulation resistance (SIR) and improve stability during the printing process for high-reliability automotive electronics.

Heat-Spring^® solutions, ideal for TIM2 applications, are a compressible interface between a heat source and a heat-sink. These indium-containing TIMs offer superior thermal conductivity over non-metals — with pure indium metal delivering 86W/mK. The Battery Show Booth 3205.

For more information, visit indium.com/emobility .