Ceramic column grid array (CCGA) packages have been increasing in use based on their advantages of high interconnect density, very good thermal and electrical performance, and compatibility with standard surface-mount packaging assembly processes. CCGA packages are used in space applications such as in logics and microprocessor functions, telecommunications, flight avionics, and payload electronics. As these packages tend to have less solder joint strain relief than leaded packages, the reliability of CCGA packages is very important for short- and long-term space missions.
Certain planetary satellites require operations of thermally uncontrolled hardware under extremely cold and hot temperatures with large diurnal temperature change from day to night. The planetary protection requires the hardware to be baked at +125 ºC for 72 hours to kill microbugs to avoid any biological contamination, especially for sample return missions. Therefore, the present CCGA package reliability research study has encompassed the temperature range of –185 to +125 ºC to cover various NASA deep space missions.
Advanced 1152 and 1272 CCGA packaging interconnects technology test hardware objects have been subjected to extreme temperature thermal cycles from –185 to +125 ºC. X-ray inspections of CCGA packages have been made before thermal cycling. No anomalous behavior and process problems were observed in the x-ray images. The change in resistance of the daisy-chained CCGA interconnects was measured as a function of increasing number of thermal cycles. Electrical continuity measurements of daisy chains have shown no anomalies, even until 596 thermal cycles. Optical inspections of hardware have shown a significant fatigue for CCGA 1152 packages over CCGA 1272 packages.
No catastrophic failures have been observed yet in the results. Process qualification and assembly are required to optimize the CCGA assembly processes. Optical inspections of CCGA boards have been made after 258 and 596 thermal cycles. Corner columns have started showing significant fatigue per optical inspection results.
This work was done by Rajeshuni Ramesham of Caltech for NASA’s Jet Propulsion Laboratory. NPO-48505
This Brief includes a Technical Support Package (TSP).
Reliability of CCGA 1152 and CCGA 1272 Interconnect Packages for Extreme Thermal Environments
(reference NPO-48505) is currently available for download from the TSP library.
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Overview
The document is a Technical Support Package prepared by the National Aeronautics and Space Administration (NASA) under the Commercial Technology Program, focusing on the reliability of CCGA (Controlled Collapse Chip Connection) 1152 and CCGA 1272 interconnect packages designed for extreme thermal environments. It is part of the SPIE MEMS-MOEMS Reliability conference proceedings from January 24, 2012, and is associated with research conducted at the Jet Propulsion Laboratory (JPL) of the California Institute of Technology.
The document outlines the objectives and requirements for evaluating the performance of these interconnect packages under thermal cycling conditions, which are critical for aerospace applications where components are subjected to significant temperature variations. The reliability of these packages is essential for ensuring the longevity and functionality of electronic systems in space missions.
Key sections of the document include experimental details, results, and discussions. Microscopic imaging is utilized to assess the physical condition of the interconnect columns after undergoing thermal cycling. Notably, images show that the CCGA 1152 columns exhibit slight bending after 258 cycles, indicating some degradation, while the CCGA 1272 columns remain straight after 596 cycles, suggesting better performance under similar conditions.
The document emphasizes the importance of these findings in understanding the mechanical reliability of interconnects in extreme environments. It also highlights the potential for broader technological, scientific, and commercial applications stemming from this research, as the insights gained can inform the design and manufacturing of more robust electronic components.
In conclusion, the Technical Support Package serves as a valuable resource for researchers and engineers involved in aerospace technology, providing critical data on the reliability of interconnect packages under thermal stress. It underscores NASA's commitment to advancing aerospace technology through rigorous research and development, ultimately contributing to the success of future space missions. For further inquiries or assistance, the document provides contact information for the Innovative Technology Assets Management at JPL.
