CSAM Metrology Software Tool (CMeST) is a computer program for analysis of false-color CSAM images of plastic-encapsulated microcircuits. ("CSAM" signifies C-mode scanning acoustic microscopy.) The colors in the images indicate areas of delamination within the plastic packages. Heretofore, the images have been interpreted by human examiners.

Hence, interpretations have not been entirely consistent and objective. CMeST processes the color information in image-data files to detect areas of delamination without incurring inconsistencies of subjective judgement. CMeST can be used to create a database of baseline images of packages acquired at given times for comparison with images of the same packages acquired at later times. Any area within an image can be selected for analysis, which can include examination of different delamination types by location. CMeST can also be used to perform statistical analyses of image data. Results of analyses are available in a spreadsheet format for further processing. The results can be exported to any data-base processing software.

This program was written by Duc Vu, Michael Sandor, and Shri Agarwal of Caltech for NASA's Jet Propulsion Laboratory. For further information, access the Technical Support Package (TSP) free online at www.techbriefs.com/tsp under the Software category.

This software is available for commercial licensing. Please contact Karina Edmonds of the California Institute of Technology at (818) 393-2827. Refer to NPO-40475.



This Brief includes a Technical Support Package (TSP).
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CSAM Metrology Software Tool

(reference NPO-40475) is currently available for download from the TSP library.

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NASA Tech Briefs Magazine

This article first appeared in the July, 2005 issue of NASA Tech Briefs Magazine (Vol. 29 No. 7).

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Overview

The document is a Technical Support Package for the CSAM (C-mode Scanning Acoustic Microscopy) Metrology Software Tool, developed by NASA's Jet Propulsion Laboratory. It focuses on the evaluation of plastic encapsulated microcircuits (PEMs) for use in space flight hardware, emphasizing the importance of meeting mission reliability requirements.

The background highlights NASA's interest in utilizing PEMs, contingent upon their reliability, which is being assessed through extensive evaluations of various PEMs from different manufacturers. A significant concern in this evaluation is delamination within plastic packages, which can adversely affect device reliability. Delamination may be present upon receipt from vendors and can be influenced by further assembly processing, extreme environmental conditions, and manufacturing processes such as burn-in and solder reflow.

The document outlines the capabilities of the CSAM Metrology Software Tool, which includes the examination of different types of delamination based on location, transformation of imagery into quantifiable data formats, statistical processing of collected data, and comparative analysis over different time domains. Additionally, it supports device failure analysis using CMeST (CSAM Metrology Software Tool) data, assessment of vendor assembly quality and reliability, and aids in device qualification and screening methodologies.

Delamination is visually represented in the software through color coding, with red and yellow indicating areas of concern. The accuracy of analysis and interpretation of these images relies heavily on the examiner's experience and knowledge.

The document also serves as a resource under NASA's Commercial Technology Program, aiming to disseminate aerospace-related developments with broader technological, scientific, or commercial applications. It encourages further exploration of research and technology in this area through various publications available from the NASA Scientific and Technical Information (STI) Program Office.

In summary, the document provides a comprehensive overview of the CSAM Metrology Software Tool's role in assessing the reliability of PEMs, particularly concerning delamination, and underscores NASA's commitment to advancing technology for aerospace applications while ensuring the reliability of components used in space missions.