Semiconductors & ICs

Access our comprehensive library of technical briefs on semiconductors & ICs, from engineering experts at NASA and major government, university, and commercial laboratories.

54
-1
0
30
Briefs: Materials
In a paper published in Science, Stanford researchers show that niobium phosphide can conduct electricity better than copper in films that are only a few atoms thick. Moreover, these films can be created and deposited at sufficiently low temperatures to be compatible with modern computer chip fabrication. Read on to learn more.
Feature Image
Briefs: Power
The Korea Research Institute of Standards and Science has developed equipment that monitors the quality of hydrogen fuel supplied to vehicles through hydrogen refueling stations in real-time. This equipment is expected to prevent hydrogen vehicle accidents caused by impurities in the hydrogen fuel and improve the quality of hydrogen production. Read on to learn more.
Feature Image
Briefs: Materials
In a world first, researchers have used 2D materials, which are only an atom thick and retain their properties at that scale, unlike silicon, to develop a computer capable of simple operations. The development represents a major leap toward the realization of thinner, faster and more energy-efficient electronics. Read on to learn more.
Feature Image
Briefs: RF & Microwave Electronics
A new transceiver invented by electrical engineers at the University of California, Irvine boosts radio frequencies into 140-gigahertz territory, unlocking data speeds that rival those of physical fiber-optic cables and laying the groundwork for a transition to 6G and FutureG data transmission protocols. Read on to learn more about it.
Feature Image
Briefs: Electronics & Computers
Scientists are striving to discover new semiconductor materials that could boost the efficiency of solar cells and other electronics. But the pace of innovation is bottlenecked by the speed at which researchers can manually measure important material properties. A fully autonomous robotic system developed by MIT researchers could speed things up. Read on to learn more.
Feature Image
Briefs: Electronics & Computers
MIT engineers have developed a technique to grow and peel ultrathin “skins” of electronic material. The method could pave the way for new classes of electronic devices, such as ultrathin wearable sensors, flexible transistors and computing elements, and highly sensitive and compact imaging devices. Read on to learn more.
Feature Image
Briefs: Semiconductors & ICs
In a milestone for scalable quantum technologies, scientists from Boston University, UC Berkeley, and Northwestern University have reported the world’s first electronic–photonic–quantum system on a chip, according to a study published in Nature Electronics. Read on to learn more about it.
Feature Image
Briefs: Imaging
In a new study, researchers at CU Boulder have used doughnut-shaped beams of light to take detailed images of objects too tiny to view with traditional microscopes. The new technique could help scientists improve the inner workings of a range of “nanoelectronics,” including the miniature semiconductors in computer chips. Read on to learn more.
Feature Image
Briefs: Imaging
By folding AI algorithms into a camera’s sensor itself, researchers at the Department of Energy’s Lawrence Berkeley National Laboratory have now eliminated a data-processing bottleneck that has long plagued the performance of spectral imaging technology. The result is an intelligent sensor capable of identifying chemicals and characterizing materials quickly and efficiently. Read on to learn more.
Feature Image
Briefs: Design
In two papers, one released in Nature Materials and a second in ACS Nano, researchers describe a new methodology for fabricating targeted 3D nanoscale structures via self-assembly that can find use in a variety of applications, and they provide a design algorithm for others to follow suit. And it’s all based on the most basic biomolecular building blocks: DNA. Read on to learn more.
Feature Image
Briefs: Software
A new study from NC State University combines three-dimensional embroidery techniques with machine learning to create a fabric-based sensor that can control electronic devices through touch. Read on to learn more.
Feature Image
Briefs: Photonics/Optics
Optics researchers in the Harvard John A. Paulson School of Engineering and Applied Sciences created specially designed metasurfaces — flat devices etched with nanoscale light-manipulating patterns — to act as ultra-thin upgrades for quantum-optical chips and setups. Read on to learn more.
Feature Image
Briefs: Semiconductors & ICs
Cornell researchers have developed a low-power microchip they call a “microwave brain,” the first processor to compute on both ultrafast data signals and wireless communication signals by harnessing the physics of microwaves. Read on to learn more about it.
Feature Image
Briefs: AR/AI
Researchers at Fuzhou University in China created a machine vision sensor that uses quantum dots to adapt to extreme changes in light far faster than the human eye can — in about 40 seconds — by mimicking eyes’ key behaviors. Their results could be a game changer for robotic vision and autonomous vehicle safety. Read on to learn more.
Feature Image
Briefs: Electronics & Computers
Maksym Kovalenko and his team have proposed a novel solution that allows them to utilize every photon of light for color recognition. For nearly a decade, they have been researching perovskite-based image sensors. In a new study published in Nature, they show that their new technology works. Read on to learn more.
Feature Image
Briefs: Power
University of California San Diego and CEA-Leti scientists have developed a ground-breaking piezoelectric-based DC-DC converter that unifies all power switches onto a single chip to increase power density. Read on to learn more about this new power topology, which extends beyond existing topologies and blends the advantages of piezoelectric converters with capacitive-based DC-DC converters.
Feature Image
Briefs: Semiconductors & ICs
Engineers at MIT, Nanyang Technological University, and several companies have developed a compact and inexpensive technology for detecting and measuring lead concentrations in water, potentially enabling a significant advance in tackling this persistent global health issue. Read on to learn more.
Feature Image
Briefs: Photonics/Optics
AI systems like ChatGPT are notorious for being power-hungry. To tackle this challenge, a team from the Centre for Optics, Photonics and Lasers has come up with an optical chip that can transfer massive amounts of data at ultra-high speed. As thin as a strand of hair, this technology offers unrivaled energy efficiency. Read on to learn more.
Feature Image
Briefs: Photonics/Optics
Researchers have invented a new type of tunable semiconductor laser that combines the best attributes of today’s most advanced laser products, demonstrating smooth, reliable, wide-range wavelength tuning in a simple, chip-sized design. Read on to learn more about it.
Feature Image
Briefs: Software
A research team led by scientists at Lawrence Berkeley National Laboratory (Berkeley Lab) has developed a new fabrication technique that could improve noise robustness in superconducting qubits, a key technology for enabling large-scale quantum computers. Read on to learn more.
Feature Image
Briefs: Electronics & Computers
A new computer vision technique developed by MIT engineers significantly speeds up the characterization of newly synthesized electronic materials. The technique automatically analyzes images of printed semiconducting samples and quickly estimates two key electronic properties for each sample. Read on to learn more.
Feature Image
Briefs: Sensors/Data Acquisition
An invention that uses microchip technology in implantable devices and other wearable products such as smart watches can be used to improve biomedical devices including those used to monitor people with glaucoma and heart disease. Read on to learn more.
Feature Image
Briefs: Semiconductors & ICs
Researchers have designed and synthesized a unique material with controllable capabilities that make it promising for future electronics including cellphones and computers. Read on to learn more.
Feature Image
Briefs: RF & Microwave Electronics
Artificial intelligence systems promise transformative advancements, yet their growth has been limited by energy inefficiencies and bottlenecks in data transfer. Researchers at Columbia Engineering have unveiled a groundbreaking solution: a 3D photonic-electronic platform that achieves unprecedented energy efficiency and bandwidth density, paving the way for next-generation AI hardware. Read on to learn more.
Feature Image
Briefs: RF & Microwave Electronics
Researchers have developed a photonic chip-based traveling wave parametric amplifier that achieves ultra-broadband signal amplification in an unprecedentedly compact form. Read on to learn more about it.
Feature Image
Briefs: Semiconductors & ICs
A joint research effort led by the University of Illinois Urbana-Champaign has shown how coal can play a vital role in next-generation electronic devices. Read on to learn more about it.
Feature Image
Briefs: Design
The mass production of conventional silicon chips relies on a successful business model with large “semiconductor fabrication plants” or “foundries.” New research by KU Leuven and imec shows that this “foundry” model can also be applied to the field of flexible, thin-film electronics. Read on to learn more.
Feature Image
Briefs: Materials
A Duke University team's approach takes a metallic nanotube, which always lets current through, and transforms it into a semiconducting form that can be switched on and off. Read on to learn more.
Feature Image
Briefs: Semiconductors & ICs
Manufacturing More Efficient Spintronics Devices
Researchers have developed a breakthrough process for making spintronic devices that has the potential to become the new industry standard for semiconductors chips that make up computers, smartphones, and many other electronics. The new process will allow for faster, more efficient spintronics devices that can be scaled down smaller than ever before. Read on to learn more about it.

Videos