Board-Level Electronics

The scenario: You’ve been assigned the task of designing and producing an embedded device. You’ve been given time, cost and size constraints that impact your design. An initial analysis of the requirements leads you to the conclusion that a 32-bit processor with a relatively small amount of RAM...

Multicore® LF600, a halide-free, no-clean Pb-free solder paste from Henkel (Düsseldorf, Germany), has been designed for humidity-resistance, making it best suited for varying manufacturing climates. Its formula allows for printing and reflow performance in regions where temperatures...

Inphi® (Westlake Village, CA) released the INSSTE32882, a JEDEC compliant Double Data Rate (DDR3) Configurable Integrated Register device from the Inphi ExacTik® Family of timing devices. The INSSTE32882 supports all existing DDR3- 800, DDR3-1066, and DDR3-1333...

Multiprocessing system architectures come in all shapes and sizes, so it is dangerous to make any generalizations. But perhaps there's agreement that most systems can be classified as either symmetric multiprocessing (SMP) or asymmetric multiprocessing (AMP).

High performance multi-core processors are providing opportunities to consolidate multiple applications into a single system. However, embedded applications often have real-time requirements that cannot be put in jeopardy by other software clamoring for the same system resources such as CPU...

Avionics systems are becoming more powerful and more dependent upon data exchanged between instruments. These instruments and subsystems reside on a network and must share time-critical data to achieve their mission. For example, targeting systems require real-time input of...