Electronics & Software

Semiconductors & ICs

Review the latest advances and technical briefs in Semiconductor and Integrated Circuit Systems (ICS) technologies essential to Design Engineers. Find new products and applications in semiconductors, electronics, electronic components, electronic circuits, integrated circuits, and ICS.

Stories

54
0
90
30
INSIDER: Electronics & Computers
Researchers have demonstrated a new technique for self-assembling electronic devices. The proof-of-concept work was used to create diodes and transistors and paves the way for...
Feature Image
Special Reports: Software
Document cover
ADAS & Autonomous Vehicles - December 2024
Are today's sensors ready for next‐level automated driving? What will it take to realize software‐defined commercial vehicles? How will generative AI impact the autonomous vehicles market? Look for...

Briefs: Manufacturing & Prototyping
A new approach uses commercial chip fab materials and techniques to fabricate specialized transistors to serve as the building block of the timing device. Read on to learn more.
Feature Image
Application Briefs: Photonics/Optics
Photonics & Imaging Technology caught up with Dr. Mehdi Asghari, SiLC Technologies CEO, to discuss their approach to designing and manufacturing FMCW LiDAR technology. Read on for the entire interview.
Feature Image
Articles: Semiconductors & ICs
To meet the ever increasing demand for silicon carbide (SiC) crystals, the world needs much higher yields without sacrificing quality. However, without advanced metrology tools capable of promptly detecting minor flaws, the SiC crystal growing sector essentially operates blindly, resulting in unacceptable defects and costly product losses. Read on to learn more.
Feature Image
Products: Manufacturing & Prototyping
See what's new on the market, including Pi Americas' S-335 fast steering mirror; Smalley's new online shopping tool for its customers; Markforged Holding Corporation's FX10 Metal Kit, a print engine that brings metal printing capability to the FX10; Automated Precision, Inc.'s iScanMagic Composite 3D Scanner and iScanLite 3D Blue Laser Line Scanner; Navitas Semiconductor's portfolio of third-generation automotive-qualified SiC MOSFETs in D2PAK-7L (TO-263-7) and TOLL packages; and much more.
Feature Image
Products: Semiconductors & ICs
See the product of the month: Seeq Vantage, Seeq's first industrial enterprise monitoring app. Read on to learn more about it.
Feature Image
Articles: Electronics & Computers
The wearable Thin-Film Thermoelectric Cooling (TFTEC) device is one of the world’s lightest, thinnest, and fastest refrigeration devices. It's also the Electronics Finalist. Read on to learn more.
Feature Image
Briefs: Materials
It's time to rethink battery technology. Compared to other existing or developing technologies, a new lithium metal-based solid-state battery brings some significant advantages: It can be charged and discharged within one minute, lasts about 10 times as long as a Li-ion battery, and is insensitive to temperature fluctuations. Read on to learn more about it.
Feature Image
INSIDER: Materials
Physicists at the University of Cambridge Cavendish Laboratory have discovered two new ways to improve organic semiconductors by removing more electrons from the...
Feature Image
Products: Sensors/Data Acquisition
See what's new on the market, including the posirot® PRAS20 angle sensor from ASM; PCIe Designer from Keysight Technologies; a new testing procedure from Würth Elektronik; Advanced Energy's new hardware accessory for its high-power supplies, PowerPro Dongle; and Eggtronic's family of EPIC mixed-signal power conversion controller ICs.
Feature Image
Products: Semiconductors & ICs
See the product of the month, Endress+Hauser's FieldGate SWG50, a new WirelessHART gateway primed for secure communication from your field devices. Read on to learn more.
Feature Image
Briefs: Energy
Researchers at the University of California, Davis, have developed a proof-of-concept sensor that may usher in a new era for millimeter wave radars. They call its design a “mission impossible” made possible. Read on to learn more.
Feature Image
Briefs: Wearables
Researchers at Stanford have been working on skin-like, stretchable electronic devices for over a decade. Recently, they presented a new design and fabrication process for skin-like integrated circuits that are five times smaller and operate at one thousand times higher speeds than earlier versions. Read on to learn more about it.
Feature Image
Quiz: Electronics & Computers
Op amps have been ubiquitous for decades, originally built with vacuum tubes, then discrete transistors, then monolithic IC chips, such as the µA741, which is still in wide use today. How much do you know about op amps? Test your knowledge with this quiz.
Feature Image
Products: Photonics/Optics
See the new products, including TRIOPTICS' expansion of its OptiCentric® 101 centration measurement system, a new type of laser-based immersion probe, LightSolver's breakthrough in quantum-inspired high-performance computing, Teledyne FLIR's next-generation embedded software for the ITAR-free Boson+ thermal camera module, IDS Imaging Development Systems' all essential camera components for the uEye ACP series, and much more.
Feature Image
Briefs: Wearables
Engineers have developed a new technique for making wearable sensors that enables medical researchers to prototype and test new designs much faster and at a far lower cost than existing methods. Read on to learn more.
Feature Image
Briefs: Photonics/Optics
A new method enables optical devices that more closely match their design specifications, boosting accuracy and efficiency. Read on to learn more.
Feature Image
Briefs: Semiconductors & ICs
Scientists have pioneered a method for using semiconductor technology to manufacture processors that significantly enhance the efficiency of transmitting vast amounts of data across the globe. The innovation is poised to transform the landscape of wireless communication. Read on to learn more.
Feature Image
Briefs: Semiconductors & ICs
After announcing a ferroelectric semiconductor at the nanoscale thinness required for modern computing components, a University of Michigan team has demonstrated a reconfigurable transistor using that material. Read on to learn more.
Feature Image
Briefs: Electronics & Computers
Penn Engineers have developed a new chip that uses light waves, rather than electricity, to perform the complex math essential to training AI. The chip has the potential to radically accelerate the processing speed of computers while also reducing their energy consumption. Read on to learn more.
Feature Image
Briefs: Communications
Researchers at Chalmers University of Technology have developed an optical amplifier that they expect will revolutionize both space and fiber communication.
Feature Image
Briefs: Photonics/Optics
Researchers have developed standards and calibrations for optical microscopes that allow quantum dots to be aligned with the center of a photonic component to within an error of 10 to 20 nanometers (about one-thousandth the thickness of a sheet of paper). Such alignment is critical for chip-scale devices that employ the radiation emitted by quantum dots to store and transmit quantum information. Read on to learn more.
Feature Image
Quiz: Electronics & Computers
Semiconductors are the brains of modern electronics. They enable advances in medical devices and healthcare, communications, computing, defense and aerospace, transportation, and myriad others. How much do you know about semiconductors? Find out with this quiz.
Feature Image
Products: Electronics & Computers
See what's new on the market, including ASM's posiwire® sensors WST61, WST85, and WST21; Allegro MicroSystems' third product in its High Voltage Power-Thru™ portfolio; Sumida America's CDPQ/T150 Series of high-current power inductors; the advanced new series of USB Type C Plugs and Sockets from Keystone Electronics Corp.; Analog Devices, Inc.'s IMU; and binder's latest enhancements to its panel mount connectors in M12 size.
Feature Image
Products: Data Acquisition
See the product of the month: Dewesoft's OBSIDIAN®, a breakthrough data acquisition (DAQ) instrument that combines the best features of a high-end DAQ system, a long-term datalogger, a real-time EtherCAT data server, and a signal conditioning front end.
Feature Image
INSIDER: Materials
A study led by Nagoya University in Japan revealed that a simple thermal reaction of gallium nitride (GaN) with metallic magnesium (Mg) results in the formation of a distinctive...
Feature Image
INSIDER: Electronics & Computers
Researchers from NUS, together with industry partners Soitec and NXP Semiconductors, have demonstrated a new class of silicon systems that...
Feature Image
INSIDER: Sensors/Data Acquisition
Silicon semiconductors have become the ‘oil’ of the computer age, as was demonstrated recently by the chip shortage crisis. However, one of the disadvantages of...
Feature Image

Videos