Semiconductors & ICs

‘Impossible’ Millimeter Wave Sensor Has Wide Potential

Researchers at the University of California, Davis, have developed a proof-of-concept sensor that may usher in a new era for millimeter wave radars. They call its design a “mission impossible” made possible. Read on to learn more.

Smaller Skin-Like Stretchable Electronics for Wearables

Researchers at Stanford have been working on skin-like, stretchable electronic devices for over a decade. Recently, they presented a new design and fabrication process for skin-like integrated circuits that are five times smaller and operate at one thousand times higher speeds than earlier versions. Read on to learn more about it.

How Much Do You Know About Op Amps?

Op amps have been ubiquitous for decades, originally built with vacuum tubes, then discrete transistors, then monolithic IC chips, such as the µA741, which is still in wide use today. How much do you know about op amps? Test your knowledge with this quiz.

New Products

See the new products, including TRIOPTICS' expansion of its OptiCentric® 101 centration measurement system, a new type of laser-based immersion probe, LightSolver's breakthrough in quantum-inspired high-performance computing, Teledyne FLIR's next-generation embedded software for the ITAR-free Boson+ thermal camera module, IDS Imaging Development Systems' all essential camera components for the uEye ACP series, and much more.

Rapidly Testing Stretchable Sensors

Engineers have developed a new technique for making wearable sensors that enables medical researchers to prototype and test new designs much faster and at a far lower cost than existing methods. Read on to learn more.

Closing the Design-to-Manufacturing Gap for Optical Devices

A new method enables optical devices that more closely match their design specifications, boosting accuracy and efficiency. Read on to learn more.

3D Processors May Revolutionize Wireless Communication

Scientists have pioneered a method for using semiconductor technology to manufacture processors that significantly enhance the efficiency of transmitting vast amounts of data across the globe. The innovation is poised to transform the landscape of wireless communication. Read on to learn more.

New Transistor Could Shrink Communications Devices on Smartphones

After announcing a ferroelectric semiconductor at the nanoscale thinness required for modern computing components, a University of Michigan team has demonstrated a reconfigurable transistor using that material. Read on to learn more.

New Chip May Lead to AI Computing at Light Speed

Penn Engineers have developed a new chip that uses light waves, rather than electricity, to perform the complex math essential to training AI. The chip has the potential to radically accelerate the processing speed of computers while also reducing their energy consumption. Read on to learn more.

Unique Amplifier Could Change Optical Communication

Researchers at Chalmers University of Technology have developed an optical amplifier that they expect will revolutionize both space and fiber communication.

A Method to Accurately Center Quantum Dots Within Photonic Chips

Researchers have developed standards and calibrations for optical microscopes that allow quantum dots to be aligned with the center of a photonic component to within an error of 10 to 20 nanometers (about one-thousandth the thickness of a sheet of paper). Such alignment is critical for chip-scale devices that employ the radiation emitted by quantum dots to store and transmit quantum information. Read on to learn more.

How Much Do You Know About Semiconductors?

Semiconductors are the brains of modern electronics. They enable advances in medical devices and healthcare, communications, computing, defense and aerospace, transportation, and myriad others. How much do you know about semiconductors? Find out with this quiz.

New on the Market

See what's new on the market, including ASM's posiwire® sensors WST61, WST85, and WST21; Allegro MicroSystems' third product in its High Voltage Power-Thru™ portfolio; Sumida America's CDPQ/T150 Series of high-current power inductors; the advanced new series of USB Type C Plugs and Sockets from Keystone Electronics Corp.; Analog Devices, Inc.'s IMU; and binder's latest enhancements to its panel mount connectors in M12 size.

Product of the Month

See the product of the month: Dewesoft's OBSIDIAN®, a breakthrough data acquisition (DAQ) instrument that combines the best features of a high-end DAQ system, a long-term datalogger, a real-time EtherCAT data server, and a signal conditioning front end.

Improved GaN-Based Semiconductor Devices for Power Electronics

A study led by Nagoya University in Japan revealed that a simple thermal reaction of gallium nitride (GaN) with metallic magnesium (Mg) results in the formation of a distinctive...

Researchers Demonstrate Cutting-Edge Chip Technology for Ultra-Low Power AI Connected Devices

Researchers from NUS, together with industry partners Soitec and NXP Semiconductors, have demonstrated a new class of silicon systems that...

Opening Up the Potential of Thin-Film Electronics for Flexible Chip Design

Silicon semiconductors have become the ‘oil’ of the computer age, as was demonstrated recently by the chip shortage crisis. However, one of the disadvantages of...

How Intelligent Battery Management Drives EV Buyer Confidence

Battery management systems are poised to become a key competitive differentiator in an EV market that is seeking to grow and thrive on a global level. And by tapping into smarter BMS, automotive manufacturers are future-proofing their resources by embracing, even anticipating, trends in EV battery design. Read on to learn more.

EV Energy Management Powers Up

Future electric vehicles will be more efficient, more powerful, and will be able to hold more energy in their batteries than today’s EVs. Those big “mores” require countless small improvements beyond the headline component — batteries. Read on to learn more.

AI-Powered Optical Inspection Can Find Nanoscale PCB Defects

Most PCB manufacturers use automatic optical inspection (AOI) to monitor defects in their printed circuit boards. This delivers strong results when there are defects in the soldering, connections, pads, and traces on printed boards.

Product of the Month

See the product of the month: The new multi-purpose ICAM-B charge amplifier from Kistler, which is ideal for use with piezoelectric sensors.

New Adhesive Tape Easily Picks Up and Sticks Down 2D Materials

A research team from Kyushu University, in collaboration with Japanese company Nitto Denko, has developed a tape that can be used to stick 2D materials to many different surfaces, in an easy and user-friendly way.

A Novel Technique to Create Energy-Efficient Microelectronics

Microelectronics face a key challenge because of their small size. To avoid overheating, microelectronics need to consume only a fraction of the electricity of conventional electronics while still operating at peak performance. Researchers have achieved a breakthrough that could allow for a new kind of microelectronic material to do just that.

Products of Tomorrow

See the products of tomorrow, including a new DC-DC power converter developed by engineers at the Kobe University, a haptic device capable of reproducing the softness of various materials developed by EPFL researchers, and three-dimensional embroidery techniques from engineers from NC State University.

A New Affordable Sensor for Lead Contamination

Engineers at MIT, Nanyang Technological University, and several companies have developed a compact and inexpensive technology for detecting and measuring lead concentrations in water,...

Can Lithium Tantalate Lower the Cost of Manufacturing Photonic Integrated Circuits?

Researchers at the École Polytechnique Fédérale de Lausanne (EPFL) — or Swiss Federal Institute of Technology in Lausanne — have leveraged the use of...

Properly Tolerancing Aspheric Lenses to Balance Cost and Performance

Understanding how to effectively tolerance aspheres is an incredibly useful communication tool to get the most out of your lens. In this article, we will provide some context behind asphere tolerances, exploring the factors that influence cost and performance.

Flexible Artificial Intelligence Optoelectronic Sensors for Health Monitoring

Researchers from Tokyo University of Science (TUS) led by Associate Professor Takashi Ikuno have developed a flexible paper-based sensor that operates like the human brain. The researchers fabricated a photo-electronic artificial synapse device composed of gold electrodes on top of a 10 μm transparent film consisting of zinc oxide (ZnO) nanoparticles and cellulose nanofibers (CNFs).