Sublimation is a major cause of degradation of thermoelectric power generation systems. Most thermoelectric materials tend to have peak values at the temperature where sublimation occurs. A sublimation barrier is needed that is stable at operating temperatures, inert against thermoelectric materials, and able to withstand thermal cycling stress.
A porous alumina paste layer is suitable as a sublimation barrier for Yb14MnSb11. It can accommodate stress generated by the thermal expansion discrepancy between the suppression layer and thermoelectric materials. Sublimation suppression is achieved by filling pores naturally with YbO2, a natural byproduct of sublimation. YbO2 generated during the sublimation of Yb14MnSb11 fills the porous structure of the alumina paste, causing sublimation to decrease with time as the pores become filled. During testing, it was found that application of this paste caused an initial ten-fold decrease in sublimation, but this factor increased with time. At 1,500 hours of burnout time at 1,273 K, the decrease in sublimation was measured as much as 1,000 times lower.
A commercial alumina paste was applied to Yb14MnSb11. Both elements were polished to remove oxidation, then the paste was applied to the Yb14MnSb11. The Yb14MnSb11 exhibited 2 × 10–6 to 3 × 10–6 g/cm2 sublimation rate at 1,000 °C after initial burnout. With this rate, the sublimation barrier becomes suitable for 14-year operation, with less than 10 percent cross-section reduction at the hot side junction.
Using scanning electron microscope imaging, the alumina layer was found to be converted into a denser composite of alumina and ytterbia. This clogged, dense layer makes an effective sublimation barrier.
This work was done by Jong-Ah Paik and Thierry Caillat of Caltech for NASA’s Jet Propulsion Laboratory. For more information, download the Technical Support Package (free white paper) at www.techbriefs.com/tsp under the Materials category.
In accordance with Public Law 96-517, the contractor has elected to retain title to this invention. Inquiries concerning rights for its commercial use should be addressed to:
Innovative Technology Assets Management JPL Mail Stop 202-233 4800 Oak Grove Drive
Pasadena, CA 91109-8099 E-mail: This email address is being protected from spambots. You need JavaScript enabled to view it.
Refer to NPO-46845, volume and number of this NASA Tech Briefs issue, and the page number.
This Brief includes a Technical Support Package (TSP).
Alumina Paste Layer as a Sublimation Suppression Barrier for Yb14MnSb11
(reference NPO-46845) is currently available for download from the TSP library.
Don't have an account?
Overview
The document discusses the use of alumina paste as a sublimation suppression barrier for Yb14MnSb11, a compound of interest in aerospace applications. The alumina paste, specifically Resbond 989FS from Cotronics, is applied to Yb14MnSb11 to prevent sublimation, which can occur during storage and handling. The preparation of the alumina paste is crucial, as it tends to form sediments over time; thus, thorough mixing is required to achieve a uniform consistency before application.
Prior to applying the alumina paste, the surface of Yb14MnSb11 must be polished to remove any oxidized layers that may have formed during air exposure. The application process involves bonding graphite blocks to the end of a cut Yb14MnSb11 puck and then coating the surface with the alumina paste, ensuring coverage at the boundary between the Yb14MnSb11 and graphite. The initial thickness of the alumina paste layer is approximately 300 micrometers. After application, the paste is allowed to dry at room temperature for over an hour, during which it cures to a hardness suitable for polishing.
The document includes figures illustrating the sublimation coupon preparation and the measurement of sublimation rates with the alumina paste layer. It also features a scanning electron microscope (SEM) image of a Yb14MnSb11 sublimation coupon after eight weeks at a high temperature of 1273K, showcasing the effectiveness of the alumina paste in maintaining the integrity of the material.
This technical support package is part of NASA's efforts to disseminate information on aerospace-related developments that have broader technological, scientific, or commercial applications. It emphasizes the importance of innovative materials in enhancing the performance and longevity of aerospace components. The document is intended for stakeholders interested in the research and technology surrounding sublimation suppression and its implications for future aerospace missions.
For further inquiries or assistance, the document provides contact information for the Innovative Technology Assets Management at JPL, highlighting NASA's commitment to sharing knowledge and fostering partnerships in technology development.
