Two short reports describe a micromachined quantum-mechanical-tunneling accelerometer and radiation-hardened support electronics designed for use in outer space. Like the micromachined tunneling accelerometers described previously in NASA Tech Briefs, this device is based on the use of electronic sensing/feedback control circuitry that measures acceleration in terms of an electrostatic-deflection voltage necessary to maintain a small constant distance (typically a few Angstroms) between a membrane and a tunneling tip in a mechanical acceleration-sensing/electron-tunneling device.
This work was done by Vardkes Victor Boyadzhyan-Sevak of Caltech for NASA's Jet Propulsion Laboratory. To obtain copies of the reports, "ATC Electron Tunneling Accelerometer Integrated Sensor Circuitry for Space Applications" and "Tunneling Accelerometer Multichip Module (Integrated Sensor) Thin Film Technology Radiation Hardened MCM," access the Technical Support Package (TSP)free on-line at www.techbriefs.com under the Electronic Compoments and Circuits category, or circle no. 188 on the TSP Order Card in this issue to receive a copy by mail ($5 charge).
In accordance with Public Law 96-517, the contractor has elected to retain title to this invention. Inquiries concerning rights for its commercial use should be addressed to
Technology Reporting Office
JPL
Mail Stop 122-116
4800 Oak Grove Drive
Pasadena, CA 91109
(818) 354-2240
Refer to NPO-20013, volume and number of this NASA Tech Briefs issue, and the page number.
This Brief includes a Technical Support Package (TSP).
Micromachined tunneling accelerometer for use in outer space
(reference NPO20013) is currently available for download from the TSP library.
Don't have an account?
Overview
The document is a technical support package from NASA, specifically detailing a micromachined tunneling accelerometer developed for use in outer space. Authored by Victor Boyadzhyan and published in June 1998, it is part of the NASA Tech Brief Vol. 22, No. 6, Item #188, and is associated with the JPL New Technology Report NPO-20013.
The primary focus of the document is on the design, development, fabrication, and operational capabilities of the tunneling accelerometer, which is a critical component for spacecraft navigation and control. This accelerometer is notable for its radiation-hardened multichip module (MCM) technology, which ensures reliable performance in the harsh conditions of space, including exposure to high levels of radiation and extreme temperatures.
The document outlines the extensive testing and validation processes that the accelerometer underwent to ensure its functionality and reliability. It emphasizes the use of thin film technology in its construction, which contributes to its lightweight and compact design—essential features for space applications where weight and space are at a premium.
Additionally, the document includes a disclaimer stating that neither the United States Government nor NASA makes any warranties regarding the accuracy or completeness of the information provided, nor do they assume any liabilities for its use. This is a standard notice in technical documents to clarify the limitations of the information presented.
The accelerometer is intended for use on the Maple Space Technology Research Vehicle-2 (STRV-2), highlighting its practical application in ongoing and future space missions. The document serves as a comprehensive resource for understanding the technological advancements in spacecraft instrumentation and the specific innovations introduced by the JPL in the field of micromachined sensors.
Overall, this technical support package encapsulates significant advancements in space technology, showcasing the efforts of NASA and its collaborators in developing robust and efficient instruments for exploration beyond Earth. The tunneling accelerometer represents a leap forward in sensor technology, promising enhanced capabilities for future spacecraft.
