Electronic Components

How Through-Hole Reflow Technology Transforms Production

A new technology closes the gap and combines PCB production into a single process, leveraging the capabilities of SMT. The resulting through-hole reflow (THR) process allows for components to be mounted through those pre-drilled holes — but secured during the same soldering process as the SMT-designed components. Read on to learn more.

Better Images for Humans and Computers

Maksym Kovalenko and his team have proposed a novel solution that allows them to utilize every photon of light for color recognition. For nearly a decade, they have been researching perovskite-based image sensors. In a new study published in Nature, they show that their new technology works. Read on to learn more.

Finding the Length ‘Sweet Spot’ for Yarn-Shaped Supercapacitors

Researchers at North Carolina State University have now identified a “sweet spot” at which the length of a threadlike energy storage technology called a “yarn-shaped supercapacitor” yields the highest and most efficient flow of energy per unit length. Read on to learn more.

World’s Fastest, Low-Cost, Ultraefficient Silicon Carbide Power Module

Global energy demands are surging, pushed by energy-intensive data centers powering artificial intelligence and increased manufacturing. How will the world meet these...

Scalable Supercapacitor Technology Made from Graphene

Supercapacitors are siblings of batteries. Both technologies store electrical energy. Batteries have a high energy density but a low power density. In other words, they can store a lot...

New Products

See the new products, including Corning Incorporated's Corning® Gorilla® Glass Ceramic; Epoxy Technology's EPO-TEK®353NDP, a high-performance, humidity-resistant epoxy; Edmund Optics' off-the-shelf HOLO/OR Diffractive Diffusers and Beamsplitters; Teledyne Technologies subsidiary FLIR's advanced multispectral imaging solution; and much more.

Optimizing Laser Cutting in Semiconductor Advanced Packaging

DPSS lasers are a critical enabling technology for meeting the precision materials processing demands of advanced packaging. Both nanosecond and USP lasers can achieve excellent results, but the right choice depends on specific requirements. Read on to learn more.

How to Optimize for Isolation and Performance Using Advanced Digital Isolators

This article briefly examines why isolation is required, emphasizing the need in sensor-based circuits. It then looks at various aspects of isolation using state-of-the-art digital isolators from Analog Devices and shows how they can be applied.

Positioning Wafers with Micrometer Precision for PECVD Coating

For loading and unloading workpiece carriers containing wafers of different sizes in an automated process prior to PECVD coating, acp systems has developed a robotic solution aided by image processing for a leading manufacturer of space solar technology. Read on to learn more.

A New Computer Vision Method Enables Faster Screening of Electronic Materials

A new computer vision technique developed by MIT engineers significantly speeds up the characterization of newly synthesized electronic materials. The technique automatically analyzes images of printed semiconducting samples and quickly estimates two key electronic properties for each sample. Read on to learn more.

Next-Gen Automotive Semiconductors Are Critical for Level 5 Driverless Cars

The driverless robotaxis chauffeuring around San Francisco, and the advanced driver assistance features on more than half of new vehicles sold this year show just...

Tiny But Mighty: Next-Gen Transistors Hold Great Promise

As electronics become smaller, it is becoming increasingly difficult to continue scaling down silicon-based transistors. Now, a research team led by the Institute of Industrial...

Researchers Develop Recyclable, Healable Electronics

Between upgrades and breakdowns to cellphones, tablets, laptops, and appliances, so many electronic devices are getting tossed in the trash that they've taken on a name of their own:...

New Tech May Lead to Smaller, More Powerful Wireless Devices

A new class of synthetic materials could herald the next revolution of wireless technologies, enabling devices to be smaller, require less signal strength and use less power.

New Products

See the new products, including Bosch Rexroth’s space-optimized SMS screw-driven small modules; the updated capabilities of PI's PICMA® piezo stack actuator series via the introduction of the new PICMA® Plus actuators; Beckhoff's expanded MX-System control cabinet-free automation platform; and more.

Product of the Month

See the product of the month: Weidmuller USA's CUBESERIES Industrial Relay Modules, which, due to their durability and robust design, can reliably switch a multitude of small loads, decouple systems, and multiply signals. Read on to learn more.

New Products

See the new products, including Shin-Etsu Silicones of America's SDP-6560 A/B liquid-dispensed gap filling, a non-adhesive curing silicone thermal interface material; Navitas Semiconductor's new portfolio of Gen-3 ‘Fast’ (G3F) 650 V SiC MOSFETs; Freudenberg Sealing Technologies' optimized sealing material for e-mobility applications; and more.

Substrate Engineering to Improve Power Electronics

As the growth in global electricity need and supply continues to accelerate, efficient power electronics will be key to improving grid efficiency, stability, integration, and resilience for...

Superconducting Diode Bridge Efficiently Converts AC to DC for Quantum Circuits

Superconductivity is an advantageous property observed in some materials. It entails an electrical resistance of zero at extremely low temperatures....

Careful Heating Unlocks Unprecedented Sensitivity to Pressure in Semiconductor Materials

Stronger cell phone signals, more accurate sensors, and cleaner energy may be achieved by adding a simple step to the industrial fabrication process of...

Fast-Charging, Long-Running, Bendable Supercapacitor

This technology has potential as a portable power supply in several applications, including electric vehicles, cellphones, and wearable technology.

Product of the Month

See the product of the month: Lanner Electronics' ICS-P770 rugged industrial-grade computer with ICS/SCADA security. It is designed to power mission-critical substation automation, virtualization, and network security.

Advanced Microelectronics: Why A Next-Gen Semiconductor Doesn’t Fall to Pieces

The mechanism holding new ferroelectric semiconductors together produces a conductive pathway that could enable high power transistors. A new class of...

Sustainable Computing for AI Processing

AI-driven computing is at a turning point. The old paradigm — squeezing ever-smaller transistors onto silicon chips — is becoming infeasible. Just increasing the chip size and with it the power consumption is unsustainable. The future lies in photonic processors that operate without electrical resistance, minimize heat dissipation, and deliver unmatched computational speed and efficiency. Read on to learn more.

New on the Market

See what's new on the market, including SBG Systems' expansion of its high-performance inertial navigation systems, Ekinox, Apogee, and Navsight, with new GNSS receiver options; Littelfuse's 823A Series fuse, an AEC-Q200-qualified, high-voltage-rated surface-mount fuse; Würth Elektronik's Thyone-e radio module; the new handheld scanner from FARO Technologies; and more.

Revolutionizing High-Performance Computer Memory Storage

Magnets generate invisible fields that attract certain materials. Far more important to our everyday lives, magnets also can store data in computers. Exploiting the direction of the magnetic field, microscopic bar magnets each can store one bit of memory as a zero or a one — the language of computers.

Thin-Film Electronics for Flexible Chip Design

The mass production of conventional silicon chips relies on a successful business model with large “semiconductor fabrication plants” or “foundries.” New research by KU Leuven and imec shows that this “foundry” model can also be applied to the field of flexible, thin-film electronics. Read on to learn more.