Electronic Components

New Products

See the new products, including Shin-Etsu Silicones of America's SDP-6560 A/B liquid-dispensed gap filling, a non-adhesive curing silicone thermal interface material; Navitas Semiconductor's new portfolio of Gen-3 ‘Fast’ (G3F) 650 V SiC MOSFETs; Freudenberg Sealing Technologies' optimized sealing material for e-mobility applications; and more.

Substrate Engineering to Improve Power Electronics

As the growth in global electricity need and supply continues to accelerate, efficient power electronics will be key to improving grid efficiency, stability, integration, and resilience for...

Superconducting Diode Bridge Efficiently Converts AC to DC for Quantum Circuits

Superconductivity is an advantageous property observed in some materials. It entails an electrical resistance of zero at extremely low temperatures....

Careful Heating Unlocks Unprecedented Sensitivity to Pressure in Semiconductor Materials

Stronger cell phone signals, more accurate sensors, and cleaner energy may be achieved by adding a simple step to the industrial fabrication process of...

Fast-Charging, Long-Running, Bendable Supercapacitor

This technology has potential as a portable power supply in several applications, including electric vehicles, cellphones, and wearable technology.

Product of the Month

See the product of the month: Lanner Electronics' ICS-P770 rugged industrial-grade computer with ICS/SCADA security. It is designed to power mission-critical substation automation, virtualization, and network security.

Advanced Microelectronics: Why A Next-Gen Semiconductor Doesn’t Fall to Pieces

The mechanism holding new ferroelectric semiconductors together produces a conductive pathway that could enable high power transistors. A new class of...

Sustainable Computing for AI Processing

AI-driven computing is at a turning point. The old paradigm — squeezing ever-smaller transistors onto silicon chips — is becoming infeasible. Just increasing the chip size and with it the power consumption is unsustainable. The future lies in photonic processors that operate without electrical resistance, minimize heat dissipation, and deliver unmatched computational speed and efficiency. Read on to learn more.

New on the Market

See what's new on the market, including SBG Systems' expansion of its high-performance inertial navigation systems, Ekinox, Apogee, and Navsight, with new GNSS receiver options; Littelfuse's 823A Series fuse, an AEC-Q200-qualified, high-voltage-rated surface-mount fuse; Würth Elektronik's Thyone-e radio module; the new handheld scanner from FARO Technologies; and more.

Revolutionizing High-Performance Computer Memory Storage

Magnets generate invisible fields that attract certain materials. Far more important to our everyday lives, magnets also can store data in computers. Exploiting the direction of the magnetic field, microscopic bar magnets each can store one bit of memory as a zero or a one — the language of computers.

Thin-Film Electronics for Flexible Chip Design

The mass production of conventional silicon chips relies on a successful business model with large “semiconductor fabrication plants” or “foundries.” New research by KU Leuven and imec shows that this “foundry” model can also be applied to the field of flexible, thin-film electronics. Read on to learn more.

Best Practices for Securing Medical Devices

Strategies and best practices for securing medical devices.

Advancing Semiconductor Devices for Artificial Intelligence

Researchers from the National University of Singapore (NUS) have demonstrated that a single, standard silicon transistor, the fundamental building block of microchips used in...

New Wearable Tech Simulates Realistic Touch

When it comes to haptic feedback, most technologies are limited to simple vibrations. But our skin is loaded with tiny sensors that detect pressure, vibration, stretching, and more. Now,...

New on the Market

See what's new on the market, including Endress+Hauser's FMR63B 80 GHz radar level sensor; the TP-108 Series, the smallest of all test points from Components Corporation; Sumida America's family of Resin-Shielded Surface-Mount Power Inductors; Coilcraft's XGL3020 series of ultra-low loss power inductors; Yokogawa Electric Corporation's OpreX™ Intelligent Manufacturing Hub; and much more.

New Research Sheds Light on Using Multiple CubeSats for In-Space Servicing and Repair Missions

As more satellites, telescopes, and other spacecraft are built to be repairable, it will take reliable trajectories for service spacecraft to...

New Material To Make Next Generation of High-Power Electronics Faster and More Efficient

Researchers at the University of Minnesota have achieved a new material that will be pivotal in making the next generation of high-power electronics...

Is Advanced Packaging the Next Large Leap for Mission-Critical Microelectronics?

The U.S. government’s microelectronics needs have evolved significantly over the decades. Now, we have entered the era of Advanced Packaging. This is the next microelectronics evolution to enhance and extend the performance of modern military and commercial systems. Read on to learn more about this.

New on the Market

See what's new on the market, including electronic control products from NORD DRIVESYSTEMS; the new F-141 photonics alignment system from PI; InnoPhase IoT's expansion of its Talaria platform; Aerotech, Inc.'s HexGen® HEX150-125HL Miniature Hexapod; and more.

Soft, Bioelectronic Sensor Implant

Researchers at the University of California, Irvine and New York’s Columbia University have embedded transistors in a soft, conformable material to create a biocompatible sensor implant that monitors...

Neuromorphic Semiconductor Chip Learns and Corrects Itself

Existing computer systems have separate data processing and storage devices, making them inefficient for processing complex data like AI. A Korea Advanced Institute of Science and...

Levitating Objects with Light

Researchers have designed a way to levitate and propel objects using only light by creating specific nanoscale patterning on the objects' surfaces. The work could be a step toward developing a spacecraft that could reach the nearest planet outside of our solar system in 20 years, powered and accelerated only by light. Read on to learn more.

Product of the Month

See the product of the month: Darveen Co.'s SPC-9000 Series IP66 stainless steel touch panel PCs, which are specifically designed to meet high hygiene standards, making them ideal for food processing, pharmaceutical, and chemical industries, and humid or hot kitchen environments.

Providing Robots a Soft Touch Using 3D Printing

A recent study demonstrates that soft skin pads doubling as sensors made from thermoplastic urethane can be efficiently manufactured using 3D printers. Read on to learn more.

Product of the Month

See the product of the month: L. S. Starrett's AVR400 CNC Vision System, the largest benchtop platform to date from Starrett.