A document presents an update on the innovation reported in “Integrated Radial Probe Transition From MMIC to Waveguide” (NPO-43957), NASA Tech Briefs Vol. 31, No. 5 (May 2007), page 38. To recapitulate: To enable operation or testing of a monolithic microwave integrated circuit (MMIC), it is necessary to mount the MMIC in a waveguide package that typically has cross-sectional waveguide dimensions of the order of a few hundred microns. A radial probe transition between an MMIC operating at 340 GHz and a waveguide had been designed (but not yet built and tested) to be fabricated as part of a monolithic unit that would include the MMIC.
The radial probe could readily be integrated with an MMIC amplifier because the design provided for fabrication of the transition on a substrate of the same material (InP) and thickness (50 μm) typical of substrates of MMICs that can operate above 300 GHz. As illustrated in the updated document by drawings, photographs, and plots of test data, the concept has now been realized by designing, fabricating, and testing several MMIC/radial-probe integrated-circuit chips and designing and fabricating a waveguide package to contain each chip.
This work was done by Lorene Samoska, Goutam Chattopadhyay, David Pukala, Mary Soria, King Man Fung, and Todd Gaier of Caltech for NASA’s Jet Propulsion Laboratory, and Vesna Radisic, Stella Makishi, William Deal, and Richard Lai of Northrop Grumman Corporation (NGC). The work was sponsored under the DARPA SWIFT program and the contributors would like to acknowledge the support of Dr. Mark Rosker (DARPA) and Dr. H. Alfred Hung (Army Research Laboratory). NPO-45460
This Brief includes a Technical Support Package (TSP).
MMICs With Radial Probe Transitions to Waveguides
(reference NPO-45460) is currently available for download from the TSP library.
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Overview
The document is a Technical Support Package from NASA's Jet Propulsion Laboratory (JPL) concerning Monolithic Microwave Integrated Circuits (MMICs) with radial probe transitions to waveguides, identified as NPO-45460. It is part of the NASA Tech Briefs, which aims to disseminate aerospace-related technological advancements with potential broader applications.
The document outlines the collaborative efforts of a team from JPL and Northrop Grumman Corporation (NGC), including notable contributors such as Lorene Samoska, Goutam Chattopadhyay, and others. Their work was sponsored under the DARPA SWIFT program, highlighting the support from key figures in the defense and research sectors.
Key technical aspects discussed include the performance of MMICs when interfaced with waveguides, specifically focusing on the design and measurement of various configurations, such as microstrip lines and grounded coplanar waveguides. The document features performance data, including insertion loss and return loss metrics, which are critical for evaluating the efficiency and effectiveness of these transitions in high-frequency applications.
Illustrations, such as diagrams of the WR2.2 MMIC module, provide visual context for the technical specifications and designs being discussed. The document emphasizes the importance of these technologies in advancing communication systems, radar, and other applications that require high-frequency signal processing.
Additionally, the Technical Support Package includes a notice regarding the proprietary nature of the information and the necessity to comply with U.S. export regulations. It also provides contact information for further inquiries, directing interested parties to the Innovative Technology Assets Management office at JPL.
Overall, this document serves as a comprehensive resource for understanding the advancements in MMIC technology, particularly in the context of their integration with waveguides, and underscores the collaborative efforts between NASA and industry partners to push the boundaries of microwave technology. It reflects a commitment to innovation and the potential for these developments to have significant implications in both aerospace and commercial sectors.
