A document presents data from tests of a low-noise amplifier module operating in the frequency range from 290 to 340 GHz — said to be the highest-frequency low-noise, solid-state amplifier ever developed. The module comprised a three-stage monolithic microwave integrated circuit (MMIC) amplifier integrated with radial probe MMIC/waveguide transitions and contained in a compact waveguide package, all according to the concepts described in the immediately preceding article and in the referenced prior article, “Integrated Radial Probe Transition From MMIC to Waveguide” (NPO-43957), NASA Tech Briefs Vol. 31, No. 5 (May 2007), page 38.

The tests included measurements by the Y-factor method, in which noise figures are measured repeatedly with an input noise source alternating between an “on” (hot-load) condition and an “off” (cold-load) condition. (The Y factor is defined as the ratio between the “on” and “off” noise power levels.) The test results showed that, among other things, the module exhibited a minimum noise figure of about 8.7 dB at 325 GHz and that the gain at that frequency under the bias conditions that produced the minimum noise figure was between about 9 and 10 dB.

This work was done by Todd Gaier, Lorene Samoska, and King Man Fung of Caltech for NASA’s Jet Propulsion Laboratory, and William Deal, Xiaobing Mei, and Richard Lai of Northrop Grumman Corporation (NGC). The work was sponsored under the DARPA SWIFT program and the contributors would like to acknowledge the support of Dr. Mark Rosker (DARPA) and Dr. H. Alfred Hung (Army Research Laboratory). NPO-45461



This Brief includes a Technical Support Package (TSP).
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Tests of Low-Noise MMIC Amplifier Module at 290 to 340 GHz

(reference NPO-45461) is currently available for download from the TSP library.

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NASA Tech Briefs Magazine

This article first appeared in the October, 2009 issue of NASA Tech Briefs Magazine (Vol. 33 No. 10).

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Overview

The document is a Technical Support Package from NASA's Jet Propulsion Laboratory (JPL) detailing the tests conducted on a Low-Noise MMIC (Monolithic Microwave Integrated Circuit) Amplifier Module operating in the frequency range of 290 to 340 GHz. This work is part of the NASA Tech Briefs, specifically referenced as NPO-45461, and was sponsored under the DARPA SWIFT program.

The primary focus of the document is to present the performance characteristics of the amplifier module, particularly its measured noise figure and gain across the specified frequency range. The results indicate that the amplifier demonstrates significant advancements in low-noise performance, which is crucial for applications in submillimeter-wave technology. The document includes data on drain currents at various bias conditions, showcasing the amplifier's operational efficiency and effectiveness at high frequencies.

One notable aspect mentioned is the identification of a 1 dB loss attributed to the long input waveguide in the module. The authors suggest that redesigning the module with a shorter input waveguide could further reduce the noise temperature, enhancing the overall performance of the amplifier. This insight reflects ongoing efforts to optimize the technology for better performance in practical applications.

The document also acknowledges the contributions of various individuals and organizations involved in the research, including team members from JPL and Northrop Grumman Corporation. It emphasizes the collaborative nature of the project and the support received from DARPA and the Army Research Laboratory.

In addition to the technical data, the document serves as a resource for those interested in aerospace-related developments with broader technological, scientific, or commercial applications. It provides contact information for further inquiries and highlights the importance of compliance with U.S. export regulations regarding the proprietary information contained within.

Overall, this Technical Support Package encapsulates significant advancements in low-noise amplifier technology, underscoring its potential impact on various fields, including telecommunications, remote sensing, and scientific research. The findings presented in this document contribute to the ongoing evolution of high-frequency electronic components, paving the way for future innovations in the industry.