An integrated waveguide-to-MMIC (monolithic microwave integrated circuit) chip operating in the 300-GHz range is designed to operate well on highpermittivity semiconductor substrates typical for an MMIC amplifier, and allows a wider MMIC substrate to be used, enabling integration with larger MMICs (power amplifiers). The waveguide-to- CBCPW (conductor-backed coplanar waveguide) transition topology is based on an integrated dipole placed in the Eplane of the waveguide module. It demonstrates low loss and good impedance matching. Measurement and simulation demonstrate that the loss of the transition and waveguide loss is less than 1-dB over a 340-to-380-GHz bandwidth. A transition is inserted along the propagation direction of the waveguide. This transition uses a planar dipole aligned with the maximum E-field of the TE10 waveguide mode as an inter face between the waveguide and the MMIC. Mode conversion between the coplanar striplines (CPS) that feed the dipole and the CBCPW transmission line is accomplished using a simple air-bridge structure. The bottom side ground plane is truncated at the same reference as the top-side ground plane, leaving the end of the MMIC suspended in air.
This work was done by Kevin M. Leong, William R. Deal, Vesna Radisic, Xiaobing Mei, Jansen Uyeda, and Richard Lai of Northrop Grumman Corporation, and Lorene A. Samoska, King Man Fung, and Todd C. Gaier of Caltech for NASA’s Jet Propulsion Laboratory. The work was sponsored under the DARPA SWIFT program and the contributors would like to acknowledge the suppor t of Dr. Mark Rosker (DARPA) and Dr. H. Alfred Hung (Army Research Laboratory). For more infor mation, download the Technical Support Package (free white paper) at www.techbriefs.com/tsp under the Semi - conductors & ICs category. NPO-46237
This Brief includes a Technical Support Package (TSP).
Waveguide Transition for Submillimeter-Wave MMICs
(reference NPO-46237) is currently available for download from the TSP library.
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Overview
The document is a Technical Support Package from NASA’s Jet Propulsion Laboratory (JPL) detailing a Waveguide Transition for Submillimeter-Wave Monolithic Microwave Integrated Circuits (MMICs), identified by the reference NPO-46237. This work was sponsored under the Defense Advanced Research Projects Agency (DARPA) SWIFT program, with acknowledgments to key contributors, including Dr. Mark Rosker from DARPA and Dr. H. Alfred Hung from the Army Research Laboratory.
The primary focus of the document is on the development and performance of a dipole-based conductor-backed coplanar waveguide (CB-CPW) transition designed for submillimeter-wave applications. The transition facilitates the connection between waveguides and MMICs, which is crucial for efficient signal transmission in high-frequency applications, particularly in the range of 300-500 GHz. The document includes measured data from experiments conducted on two transitions connected by a CB-CPW thru-line of 875 μm in length, showcasing the performance characteristics of the waveguide input and output.
Additionally, the document references a related publication titled “A 340–380 GHz Integrated CB-CPW-to-Waveguide Transition for Sub Millimeter-Wave MMIC Packaging,” which appeared in the IEEE Microwave and Wireless Components Letters in June 2009. This reference provides further insights into the technical details and applications of the waveguide transition technology.
The Technical Support Package emphasizes the importance of this technology in advancing aerospace-related developments that have broader technological, scientific, or commercial applications. It serves as a resource for researchers and industry professionals interested in the latest innovations in microwave and submillimeter-wave technologies.
For further inquiries or assistance, the document provides contact information for the Innovative Technology Assets Management team at JPL, encouraging collaboration and exploration of the technology's potential applications.
Overall, this document encapsulates significant advancements in waveguide transition technology, highlighting its relevance to both aerospace and other fields, while also ensuring compliance with U.S. export regulations and proprietary information considerations.
