Browse the innovative developments in electronic components that are enabling advancements in passives, semiconductors, electromechanical, power and circuit protection. Access technical briefs and articles that provide essential applications for cellphones, laptops, tablets, and other electronics.
See what's new on the market, including Boker’s stamped metal components custom manufactured to fit into developed mold designs; the CRH03 tactical-grade gyroscope from Silicon Sensing Systems; Keysight Technologies' enhanced physical layer compliance test solution for high-definition multimedia interface; and more.
With increasing demands and requirements for building complex embedded systems that involve complex machines, the demand for resilient embedded systems is even higher today. Building safe and secure embedded systems is paramount in the context of pervasive embedded systems across multiple domains and industries. Read on to learn more.
Transistors, the building blocks of modern electronics, are typically made of silicon. Because it’s a semiconductor, this material can control the flow of electricity in a...
A research team led by physicists Ming Yi and Emilia Morosan from Rice University has developed a new material with unique electronic properties that could enable more powerful and...
Researchers from MIT and elsewhere have designed a novel transmitter chip that significantly improves the energy efficiency of wireless communications, which could boost the...
See the new products, including the VITA 93 QMC Mezzanine Modules from Acromag; fiber-optic sensors of the optoCONTROL CLS1000 series from Micro-Epsilon; AW-Lake's TG Series Gas Turbine Flow Meter; NewTek Sensors' advanced Linear Variable Differential Transformer specifically designed to withstand the extreme environments found in next-gen molten salt reactors; and more.
MIT researchers have developed a method that anyone can use to design an energy management interface between the harvester and the sensor load to minimize the drain on the harvester and maximize the amount of data that can be transmitted by the sensor. Read on to learn more via this Q&A with Daniel Monagle and Steven B. Leeb.
A new technology closes the gap and combines PCB production into a single process, leveraging the capabilities of SMT. The resulting through-hole reflow (THR) process allows for components to be mounted through those pre-drilled holes — but secured during the same soldering process as the SMT-designed components. Read on to learn more.
Maksym Kovalenko and his team have proposed a novel solution that allows them to utilize every photon of light for color recognition. For nearly a decade, they have been researching perovskite-based image sensors. In a new study published in Nature, they show that their new technology works. Read on to learn more.
Researchers at North Carolina State University have now identified a “sweet spot” at which the length of a threadlike energy storage technology called a “yarn-shaped supercapacitor” yields the highest and most efficient flow of energy per unit length. Read on to learn more.
Global energy demands are surging, pushed by energy-intensive data centers powering artificial intelligence and increased manufacturing. How will the world meet these...
Supercapacitors are siblings of batteries. Both technologies store electrical energy. Batteries have a high energy density but a low power density. In other words, they can store a lot...
See the new products, including Corning Incorporated's Corning® Gorilla® Glass Ceramic; Epoxy Technology's EPO-TEK®353NDP, a high-performance, humidity-resistant epoxy; Edmund Optics' off-the-shelf HOLO/OR Diffractive Diffusers and Beamsplitters; Teledyne Technologies subsidiary FLIR's advanced multispectral imaging solution; and much more.
DPSS lasers are a critical enabling technology for meeting the precision materials processing demands of advanced packaging. Both nanosecond and USP lasers can achieve excellent results, but the right choice depends on specific requirements. Read on to learn more.
This article briefly examines why isolation is required, emphasizing the need in sensor-based circuits. It then looks at various aspects of isolation using state-of-the-art digital isolators from Analog Devices and shows how they can be applied.
For loading and unloading workpiece carriers containing wafers of different sizes in an automated process prior to PECVD coating, acp systems has developed a robotic solution aided by image processing for a leading manufacturer of space solar technology. Read on to learn more.
A new computer vision technique developed by MIT engineers significantly speeds up the characterization of newly synthesized electronic materials. The technique automatically analyzes images of printed semiconducting samples and quickly estimates two key electronic properties for each sample. Read on to learn more.
The driverless robotaxis chauffeuring around San Francisco, and the advanced driver assistance features on more than half of new vehicles sold this year show just...
As electronics become smaller, it is becoming increasingly difficult to continue scaling down silicon-based transistors. Now, a research team led by the Institute of Industrial...
Between upgrades and breakdowns to cellphones, tablets, laptops, and appliances, so many electronic devices are getting tossed in the trash that they've taken on a name of their own:...
A new class of synthetic materials could herald the next revolution of wireless technologies, enabling devices to be smaller, require less signal strength and use less power.
See the new products, including Bosch Rexroth’s space-optimized SMS screw-driven small modules; the updated capabilities of PI's PICMA® piezo stack actuator series via the introduction of the new PICMA® Plus actuators; Beckhoff's expanded MX-System control cabinet-free automation platform; and more.
See the product of the month: Weidmuller USA's CUBESERIES Industrial Relay Modules, which, due to their durability and robust design, can reliably switch a multitude of small loads, decouple systems, and multiply signals. Read on to learn more.
See the new products, including Shin-Etsu Silicones of America's SDP-6560 A/B liquid-dispensed gap filling, a non-adhesive curing silicone thermal interface material; Navitas Semiconductor's new portfolio of Gen-3 ‘Fast’ (G3F) 650 V SiC MOSFETs; Freudenberg Sealing Technologies' optimized sealing material for e-mobility applications; and more.
Modern data center architectures, particularly those aligned with the Open Compute Project (OCP), demand far more from power delivery systems than ever before. As compute...
As the growth in global electricity need and supply continues to accelerate, efficient power electronics will be key to improving grid efficiency, stability, integration, and resilience for...
Superconductivity is an advantageous property observed in some materials. It entails an electrical resistance of zero at extremely low temperatures....
Stronger cell phone signals, more accurate sensors, and cleaner energy may be achieved by adding a simple step to the industrial fabrication process of...
