Photonics & Imaging

Lincoln Laboratory Laser Communications Terminal Launches on Historic Artemis II Moon Mission

As it orbits the Moon, the Orion spacecraft will carry an optical (laser) communications system developed at MIT Lincoln Laboratory in collaboration with NASA Goddard Space Flight Center. Called the Orion Artemis II Optical Communications System (O2O), the system is capable of higher-bandwidth data transmissions from space compared to traditional radio-frequency (RF) systems. Read on to learn more.

Light-Powered Soft Lens Brings Human-Like Vision to Robotics

A team of biomedical engineers at Georgia Tech has unveiled a breakthrough in adaptive optics: a bio-mimetic, light-powered soft lens that mimics the human eye’s ability to refocus and adjust to varying light conditions. Read on to learn more.

A Compact Metalens Telescope Capable of Imaging the Moon

Astronomers and amateurs alike know the bigger the telescope, the more powerful the imaging capability. To keep the power but streamline one of the bulkier components, a Penn State-led research team created the first ultrathin, compact metalens telescope capable of imaging faraway objects, including the Moon. Read on to learn more.

New on the Market

See what's new on the market, including Nikon Corporation's newest version of NEXIV software, “AutoMeasure”; the ImageIR® 6300 Z, from InfraTec; PI's new technology platform for electro-optical wafer-level testing; HORIBA's release of EzSpec-SDK, a flexible and robust software development kit; and more.

Quantum Eyes on Energy Loss: Diamond Quantum Imaging for Next-Gen Power Electronics

Improving energy conversion efficiency in power electronics is vital for a sustainable society. Wide-bandgap semiconductors like GaN and SiC power devices offer advantages due to their high-frequency capabilities. However, energy losses in passive components at high frequencies hinder efficiency and miniaturization. Find out what a research team from the School of Engineering, Institute of Science Tokyo, Japan, developed to help.

A Smart Sensor Performs AI Tricks While Capturing Spectral Images

By folding AI algorithms into a camera’s sensor itself, researchers at the Department of Energy’s Lawrence Berkeley National Laboratory have now eliminated a data-processing bottleneck that has long plagued the performance of spectral imaging technology. The result is an intelligent sensor capable of identifying chemicals and characterizing materials quickly and efficiently. Read on to learn more.

Using ‘Doughnut’ Beams to See Incredibly Small Objects

In a new study, researchers at CU Boulder have used doughnut-shaped beams of light to take detailed images of objects too tiny to view with traditional microscopes. The new technique could help scientists improve the inner workings of a range of “nanoelectronics,” including the miniature semiconductors in computer chips. Read on to learn more.

First Electronic-Photonic Quantum Chip Created in a Commercial Foundry

In a milestone for scalable quantum technologies, scientists from Boston University, UC Berkeley, and Northwestern University have reported the world’s first electronic–photonic–quantum system on a chip, according to a study published in Nature Electronics. Read on to learn more about it.

Super-Fast Camera Sees Through Dynamic Disorder of Atoms

When materials function inside an operating device, they can behave as if they are dancing. This dynamic disorder is difficult to study because the clusters are not only so small and disordered, but they also fluctuate in time. Researchers report that they have developed a new kind of “camera” that can see the local disorder. Read on to learn more about it.

What Can Dogs Tell Us About How Robots Can Locate Objects?

Whether in the kitchen or on a workshop floor, robot assistants that can fetch items for people could be extremely useful. Now, a team of Brown University researchers has developed...

The Holy Grail of Networking: Bringing Fiber-Optic Speed Directly to the Chip

Caltech scientists have developed a way to guide light on silicon wafers with low signal loss approaching that of optical fiber at visible wavelengths. Read on to learn more about it.

Stable Optical Wireless Power Transmission for the IoT

The world’s first automatic and adaptive, dual-mode light-emitting diode (LED)-based optical wireless power transmission system, that operates seamlessly under both dark and bright...

Readers Select 2025 Products of the Year

Last December, Tech Briefs readers were asked to select one product from our 2025 Products of the Month to be named Readers’ Choice Product of the Year. Thanks to all of our readers who cast their votes. Read on for the three 2025 winners.

Products of Tomorrow

See the products of tomorrow, including a bio-mimetic, light-powered soft lens that mimics the human eye’s ability to refocus and adjust to varying light conditions; a new material for insulating windows that could improve the energy efficiency of buildings worldwide; and more.

New on the Market

See what's new on the market, including Aerotech's PICAlignTM architecture, a new active alignment solution designed to overcome the manufacturing challenges of high-volume Co-Packaged Optics (CPO) production; PI's 6-axis piezo alignment platform: the P-616.65S Nano-Cube® 6-DOF piezo-flexure nano positioning system; a high-impedance miniaturized ferrite-core wire wound inductor from Coilcraft; and more.

Meet IRIS: A Smart Ring to Control Smart Devices

University of Washington researchers have developed IRIS, a smart ring that allows users to control smart devices by aiming the ring’s small camera at the device and clicking a built-in button. The prototype Bluetooth ring sends an image of the selected device to the user’s phone, which controls the device. Read on to learn more.

New MEMS Modulator Offers Significant Advancements in Optical Efficiency

A new Microelectromechanical system (MEMS) grating modulator has been developed, offering significant advancements in optical efficiency and scalability for communication systems. By integrating a tunable sinusoidal grating with broadside-constrained continuous ribbons, a large-scale aperture of 30 × 30 mm is achieved and supports high-speed modulation up to 250 kHz. Read on to learn more.

FPGA-Accelerated AI for Demultiplexing Multimode Fiber Toward Next-Generation Communications

The technique promises immediate impact not only on high-capacity optical communications but also on real-time endoscopic imaging, vibration-tolerant fiber sensors, and any application that demands fast, energyefficient phase retrieval. Read on to learn more.

Privacy-Aware Building Automation

Researchers at the University of Tokyo developed a framework to enable decentralized artificial intelligence-based building automation with a focus on privacy. The system enables AI-powered devices like cameras and interfaces to cooperate directly, using a new form of device-to-device communication. In doing so, it eliminates the need for central servers and thus the need for centralized data retention, often seen as a potential security weak point and risk to private data. Read on to learn more.

New on the Market

See what's new on the market, including COMSOL Multiphysics® version 6.4; Novotechnik's Vert-X 26 Series of non-contacting magnetic angle sensors; HMS Networks' N-Tron NT110-FX2, an unmanaged Ethernet switch with two fiber ports; Littelfuse's MMIX1T500N20X4 X4-Class Ultra-Junction Power MOSFET; and more.

Stanford Researchers Develop Flexible Color-Changing Material

Stanford researchers have developed a flexible material that can quickly change its surface texture and colors, offering potential applications in camouflage, art, robotics, and...

A New Tool for Measuring Femtosecond Lasers

Ultrashort laser pulses — that are shorter than a millionth of a millionth of a second — have transformed fundamental science, engineering and medicine. Despite this, their ultrashort duration...

NVIDIA Includes Ethernet Photonics in New Six-Chip AI Rubin Platform

NVIDIA is bringing Ethernet networking with co-packaged optics to artificial intelligence (AI) factories, enabling scale-out and scale-across on the NVIDIA Rubin platform...